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TS68951CP

STMicroelectronics

TS68951CP by STMicroelectronics

TS68951CP by STMicroelectronics is a modem-support circuit with 28 terminals, operating at -5V to +5V. It features CMOS technology, TIN LEAD finish, and operates in commercial temperature range. This rectangular package is ideal for telecom applications requiring low supply current and dual terminal position.

Median Price

$10.500

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 260 parts In-Stock

1+ parts

$10.500

100+ parts

$6.300

1k+ parts

$6.037

10k+ parts

-

260

$10.500

$6.300

$6.037

-

Vyrian

USA . 2,767 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,767

-

-

-

-

Anansix

USA . 2,332 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,332

-

-

-

-

Digiode

USA . 1,349 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,349

-

-

-

-

A2Z Electronics, Inc.

USA . 260 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

260

-

-

-

-

Pride Electronics

USA . 10 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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10

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,321 parts In-Stock

1+ parts

$5.905

100+ parts

-

1k+ parts

$5.314

10k+ parts

-

2,321

$5.905

-

$5.314

-

MKK Technologies

India . 439 parts In-Stock

1+ parts

$11.103

100+ parts

-

1k+ parts

-

10k+ parts

-

439

$11.103

-

-

-

DigiPath Technology Company

USA . 439 parts In-Stock

1+ parts

$11.103

100+ parts

-

1k+ parts

-

10k+ parts

-

439

$11.103

-

-

-

Corphita

USA . 2,896 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,896

-

-

-

-

Parana Technologies

USA . 1,140 parts In-Stock

1+ parts

-

100+ parts

$7.060

1k+ parts

-

10k+ parts

-

1,140

-

$7.060

-

-

Perfect Parts

USA . 24 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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24

-

-

-

-

Overview

Unlock the power of seamless communication with the TS68951CP by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers top-quality modems like no other. Perfect for a wide range of applications, this modem-support circuit offers unmatched value, benefits, and advantages to customers seeking reliable and efficient communication solutions. Experience the difference with STMicroelectronics and elevate your connectivity to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and lightweight design, making this modem ideal for portable devices.

Power Supplies (V): +-5

Dual power supplies of +-5V offer a stable operating environment for the modem, ensuring reliable performance.

No. of Terminals: 28

Having 28 terminals allows for a wide range of connectivity options, making this modem versatile for different applications.

Package Style (Meter): IN-LINE

The in-line package style saves space and simplifies installation, making it convenient for various setups.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this modem can handle demanding environments without overheating.

Technology: CMOS

CMOS technology offers low power consumption and high integration, ensuring efficient performance and cost-effectiveness.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5V provides consistent power to the modem, ensuring stable operation.

Technical Specifications

Modems TS68951CP attributes and parameters. Explore more Modems devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDIP-T28

JESD-609 Code:

e0

Length:

36.83 mm

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

+-5

Qualification:

Not Qualified

Sub-Category:

Modems

Maximum Supply Current:

.04 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Trade Compliance

TS68951CP Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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