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TS68950CFN013TR

STMicroelectronics

TS68950CFN013TR by STMicroelectronics

TS68950CFN013TR by STMicroelectronics is a CMOS modem IC designed for telecom applications. It operates with ±5V power supplies, features a compact 28-terminal chip carrier package, and supports temperatures from 0 °C to 70°C. Ideal for surface mount designs, it ensures reliable performance in commercial environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,453 parts In-Stock

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4,453

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 2,594 parts In-Stock

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2,594

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Vyrian

USA . 2,257 parts In-Stock

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2,257

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Anansix

USA . 790 parts In-Stock

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790

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,378 parts In-Stock

1+ parts

$9.594

100+ parts

-

1k+ parts

$8.634

10k+ parts

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2,378

$9.594

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$8.634

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MKK Technologies

India . 2,194 parts In-Stock

1+ parts

$18.040

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2,194

$18.040

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DigiPath Technology Company

USA . 2,194 parts In-Stock

1+ parts

$18.040

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2,194

$18.040

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Corphita

USA . 3,898 parts In-Stock

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3,898

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Parana Technologies

USA . 2,067 parts In-Stock

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$11.471

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2,067

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$11.471

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Overview

Unlock seamless connectivity with the TS68950CFN013TR from STMicroelectronics! Renowned for their cutting-edge technology and unwavering quality, STMicroelectronics delivers this robust modem solution designed to enhance communication systems. With its compact design and adaptability, it’s perfect for telecom applications where reliability is key. Experience superior performance, energy efficiency, and dependable support that elevate your projects and keep you ahead in a fast-paced digital world.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic and epoxy materials enhances durability and helps protect against environmental factors, ensuring reliability in various operating conditions.

Surface Mount: YES

Being a surface mount component allows for easier integration into compact designs and contributes to reduced assembly time and costs.

Package Shape: SQUARE

The square package shape is beneficial for efficient space utilization on printed circuit boards (PCBs) without sacrificing performance.

Power Supplies (V): +-5

With a dual power supply requirement, this modem can provide flexibility in design and compatibility with different power systems, enhancing versatility.

No. of Terminals: 28

Having 28 terminals allows for more functionalities and connections, making it suitable for complex modem applications.

Package Style (Meter): CHIP CARRIER

The chip carrier style enables direct attachment to PCBs, providing better thermal conductivity and electrical performance.

Maximum Operating Temperature: 70 °C

A high maximum operating temperature ensures that the modem can function efficiently in warmer environments without risk of failure.

Minimum Operating Temperature: 0 °C

The capability to operate from 0 °C means this modem can be used in various environments, including slightly colder climates.

Terminal Finish: TIN LEAD

The tin-lead finish provides good solderability and ensures reliable connections during assembly.

Terminal Position: QUAD

Quad terminal positioning allows for better routing and compact designs on PCBs, optimizing space and connectivity.

Maximum Seated Height: 4.57 mm

A low seated height ensures that the modem can fit into compact devices, maintaining a slim design profile.

Width: 11.5062 mm

The compact width enables integration into space-constrained designs while providing necessary connectivity options.

Length: 11.5062 mm

Similar to width, the length supports efficient layout on PCBs, important for modern compact electronic devices.

Temperature Grade: COMMERCIAL

Having a commercial temperature grade indicates suitable performance for a wide range of non-industrial applications.

Technology: CMOS

CMOS technology ensures low power consumption and high-speed operations, making it efficient for modern telecom applications.

Nominal Negative Supply Voltage: -5 V

A nominal negative supply voltage allows for effective signal processing and reduces noise levels in modem operations.

Terminal Form: J BEND

The J bend terminal form provides easier handling during assembly while ensuring stable connections.

Maximum Supply Current: 0.03 mA

Low maximum supply current contributes to reduced power consumption, making the modem ideal for battery-powered applications.

Telecom IC Type: MODEM-SUPPORT CIRCUIT

As a modem-support circuit, this component is specifically designed for effective data transmission, ensuring reliability in communication.

Nominal Supply Voltage: 5 V

Standard nominal supply voltage of 5V makes it compatible with widely used electronic devices, ensuring easy integration.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for compact designs while maintaining adequate space for soldering, which aids in manufacturability.

Technical Specifications

Modems TS68950CFN013TR attributes and parameters. Explore more Modems devices from STMicroelectronics

Specs

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e0

Length:

11.5062 mm

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

+-5

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Modems

Maximum Supply Current:

.03 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.5062 mm

Trade Compliance

TS68950CFN013TR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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