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74HC943N

Texas Instruments

74HC943N by Texas Instruments

74HC943N by Texas Instruments is a 20-terminal CMOS modem with a 5V supply voltage. Operating b/w -40°C to 85°C, it features tin/lead terminals in an industrial-grade rectangular package. Ideal for telecom applications due to its through-hole design and 2.54mm terminal pitch.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Digiode

USA . 5,328 parts In-Stock

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Vyrian

USA . 1,962 parts In-Stock

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Anansix

USA . 884 parts In-Stock

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Native Components

USA . 663 parts In-Stock

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$7.500

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$7.500

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Parana Technologies

USA . 351 parts In-Stock

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$12.804

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$13.269

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351

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ChromeModa Solutions

Germany . 3,185 parts In-Stock

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$14.386

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$11.797

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$14.386

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IDEA Electronic Components Group

UK . 1,189 parts In-Stock

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$14.386

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$13.667

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$12.947

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AZTECH Wire

Italy . 606 parts In-Stock

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$14.520

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One Stop Electronics

USA . 611 parts In-Stock

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$963.000

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Corphita

USA . 2,989 parts In-Stock

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Northwest PG Solutions

USA . 1,079 parts In-Stock

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DigiPath Technology Company

USA . 367 parts In-Stock

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$12.970

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RTC Component Inc.

USA . 44 parts In-Stock

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Overview

Enhance your communication systems with the 74HC943N by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and reliability in all their products. The 74HC943N falls under the category of modems, offering seamless connectivity solutions for various applications. With a nominal supply voltage of 5V and an industrial temperature grade, this modem is designed to deliver optimal performance even in harsh environments. Trust Texas Instruments for innovative technology and superior products that bring value and efficiency to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic and epoxy in the package body makes the modem lightweight and durable, ideal for long-term use and transportation.

Power Supplies (V): 5

Operating at a standard voltage of 5V makes this modem compatible with a wide range of power sources, ensuring versatile and widespread use.

No. of Terminals: 20

With 20 terminals, this modem offers ample connectivity options for various devices and systems, enhancing its versatility and compatibility.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures that this modem can function reliably even in high-temperature environments, making it suitable for a wide range of applications.

Technology: CMOS

Utilizing CMOS technology enhances the efficiency and reliability of this modem, providing stable and consistent performance for seamless data transmission.

Technical Specifications

Modems 74HC943N attributes and parameters. Explore more Modems devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e0

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Modems

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

74HC943N Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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