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CSP1037B

Broadcom

CSP1037B by Broadcom

MODEM-SUPPORT CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Data Rate: .056 Mbps;

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 466 parts In-Stock

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466

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Vyrian

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455

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Cyclops Electronics Ltd

UK . 410 parts In-Stock

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Velocity Electronics

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10

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Distributors (Availability)

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Decca Corp

Germany . 1,050 parts In-Stock

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$13.000

100+ parts

$12.740

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$12.613

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1,050

$13.000

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$12.613

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Northwest PG Solutions

USA . 1,267 parts In-Stock

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Supply Digital

USA . 894 parts In-Stock

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Kepictronics

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403

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Native Components

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Corphita

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118

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Technical Specifications

Modems CSP1037B attributes and parameters. Explore more Modems devices from Broadcom

Specs

Data Rate:

.056 Mbps

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

Length:

9.905 mm

No. of Functions:

1

No. of Terminals:

16

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

240

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Telecom IC Type:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

CSP1037B Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Broadcom

Broadcom Inc, a Delaware corporation headquartered in San Jose, CA, is a global technology leader that designs, develops and supplies a broad range of semiconductor and infrastructure software solutions. Broadcom’s category-leading product portfolio serves critical markets including data center, networking, software, broadband, wireless, storage and industrial. Our solutions include data center networking and storage, enterprise and mainframe software focused on automation, monitoring and security, smartphone components, telecoms and factory automation.

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