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SX061S

Onsemi

SX061S by Onsemi

SX061S by Onsemi is a small outline modem-demodulator IC with 24 terminals in gull wing form. It offers a data rate of 1 Mbps and measures 7.5mm in width, making it suitable for compact telecom applications requiring high-speed data transmission. The package material is plastic/epoxy, enabling surface mount installation with a low seated height of 2.65mm.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,704 parts In-Stock

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Digiode

USA . 1,540 parts In-Stock

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TANS Electronics

Latvia . 4,684 parts In-Stock

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SupplyDigital Components

Austria . 3,982 parts In-Stock

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Problanco Electronics

Mexico . 3,908 parts In-Stock

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Kulean Microsystems

USA . 2,485 parts In-Stock

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Corphita

USA . 1,009 parts In-Stock

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UHIMA Technologies

Türkiye . 739 parts In-Stock

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Corohmni

South Africa . 397 parts In-Stock

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Overview

Experience the next level of connectivity with the SX061S by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and reliability in all their products. The SX061S modem offers seamless integration with advanced features, making it an ideal choice for a wide range of applications. Unlock fast data transmission speeds of up to 1 Mbps without compromising on performance. Upgrade your communication systems today with the SX061S and stay ahead of the curve.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and makes the modem lightweight, ideal for portable devices.

Surface Mount: YES

Surface mount capability makes installation and replacement of the modem easy and convenient.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space when installing the modem in a device.

No. of Terminals: 24

Having 24 terminals offers plenty of connectivity options for various devices and interfaces.

Package Style (Meter): SMALL OUTLINE

Small outline package style helps in saving space and enables compact design layouts for the device.

Terminal Position: DUAL

Dual terminal position provides flexibility in the orientation of the modem during installation.

Maximum Seated Height: 2.65 mm

Low seated height allows for a slim profile and efficient space utilization within the device.

Width: 7.5 mm

Narrow width enables the modem to fit into tight spaces or slim device designs.

Length: 15.4 mm

Compact length makes the modem suitable for devices where space is a constraint.

Terminal Form: GULL WING

Gull wing terminal form offers strong mechanical support for reliable connections.

Telecom IC Type: MODEM-DEMODULATOR

Specific IC type designed for modem-demodulator function ensures optimized performance and compatibility.

Terminal Pitch: 1.27 mm

Uniform terminal pitch simplifies assembly and enhances reliability during connection.

Data Rate: 1 Mbps

High data rate of 1 Mbps ensures fast and efficient transfer of data over the modem.

Technical Specifications

Modems SX061S attributes and parameters. Explore more Modems devices from Onsemi

Specs

Data Rate:

1 Mbps

JESD-30 Code:

R-PDSO-G24

Length:

15.4 mm

No. of Functions:

1

No. of Terminals:

24

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

SX061S Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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