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TDA8296HN

NXP Semiconductors

TDA8296HN by NXP Semiconductors

TDA8296HN by NXP Semiconductors is a versatile modem-demodulator in a 40-terminal, no-lead chip carrier package. It features surface mount technology and a square shape, making it ideal for compact telecom applications. This device excels in efficient data transmission and reception.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics (Authorized)

USA . 48,490 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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48,490

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics

USA . 48,490 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

48,490

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Digiode

USA . 4,751 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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4,751

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Anansix

USA . 1,860 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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1,860

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Vyrian

USA . 1,054 parts In-Stock

1+ parts

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1,054

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,425 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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4,425

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UNI Independent Distributors

Spain . 2,672 parts In-Stock

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2,672

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Overview

Unlock seamless connectivity with the TDA8296HN from NXP Semiconductors, a leader in cutting-edge technology. This high-quality modem-demodulator offers exceptional performance and reliability, making it ideal for a wide range of applications from telecommunications to IoT devices. With its space-saving design and robust build, you can enhance your products’ functionality while enjoying the trusted excellence that comes from NXP’s legacy. Elevate your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material offers durability and resistance to environmental factors, making this modem suitable for various applications.

Surface Mount: YES

Surface mount technology allows for efficient use of space on printed circuit boards, making the modem easy to integrate into compact designs.

Package Shape: SQUARE

The square package shape ensures uniformity in design and allows for optimal placement on circuit boards, enhancing product reliability.

No. of Terminals: 40

With 40 terminals, this modem provides ample connection points for complex circuitry, facilitating advanced functionalities.

Package Style (Meter): CHIP CARRIER

The chip carrier package style supports high-density designs, making it ideal for modern electronic devices that require compact components.

Terminal Position: QUAD

The quad terminal position allows for better electrical performance and reduced electromagnetic interference, enhancing signal quality.

Terminal Form: NO LEAD

No lead terminal form reduces the physical footprint and improves compatibility with lead-free soldering processes, aligning with modern manufacturing practices.

Telecom IC Type: MODEM-DEMODULATOR

As a modem-demodulator, this telecom IC is designed for efficient communication, making it a suitable choice for various networking applications.

Technical Specifications

Modems TDA8296HN attributes and parameters. Explore more Modems devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N40

No. of Terminals:

40

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Position:

QUAD

Trade Compliance

TDA8296HN Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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