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MAX2992GCB+T

Analog Devices

MAX2992GCB+T by Analog Devices

Modems; Moisture Sensitivity Level (MSL): 3; Terminal Finish: MATTE TIN; Peak Reflow Temperature (C): 260; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 30;

Median Price

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3

In-Stock Inventory

1k+

MAX2992GCB+T by Analog Devices
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Vyrian

USA . 4,846 parts In-Stock

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4,846

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Digiode

USA . 1,689 parts In-Stock

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1,689

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Anansix

USA . 1,436 parts In-Stock

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1,436

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Distributors (Availability)

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MARBEL Systems

Belgium . 1,695 parts In-Stock

1+ parts

$14.349

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1,695

$14.349

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Texas Native Microelectronics

USA . 4,749 parts In-Stock

1+ parts

$16.493

100+ parts

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$15.338

10k+ parts

$14.514

4,749

$16.493

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$15.338

$14.514

AZTECH Wire

Italy . 685 parts In-Stock

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$16.868

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685

$16.868

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Kenton Components

USA . 3,082 parts In-Stock

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$19.792

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$17.417

3,082

$19.792

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$17.417

Advanced Electronics

New Zealand . 75 parts In-Stock

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$20.748

100+ parts

$18.881

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$17.013

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75

$20.748

$18.881

$17.013

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Qasali Group International

UK . 5,623 parts In-Stock

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$44.531

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5,623

$44.531

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Component Stockers USA

USA . 285 parts In-Stock

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$99.990

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285

$99.990

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Semicontronic

India . 1,032 parts In-Stock

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$474.000

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$462.150

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$459.780

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1,032

$474.000

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$459.780

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One Stop Electronics

USA . 2,757 parts In-Stock

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$494.000

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2,757

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QUARKTWIN TECHNOLOGY LTD

USA . 11,733 parts In-Stock

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11,733

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Corphita

USA . 2,102 parts In-Stock

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Technical Specifications

Modems MAX2992GCB+T attributes and parameters. Explore more Modems devices from Analog Devices

Specs

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

Peak Reflow Temperature (C):

260

Terminal Finish:

MATTE TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

MAX2992GCB+T Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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