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MC68194FJR2

Onsemi

MC68194FJR2 by Onsemi

MC68194FJR2 by Onsemi is a 52-terminal modem IC with 5V power supply, operating at temperatures from 0 to 70 °C. It features a data rate of 10 Mbps and is ideal for telecom applications requiring a commercial-grade, bipolar technology chip carrier package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 1,322 parts In-Stock

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Vyrian

USA . 895 parts In-Stock

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895

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Kulean Microsystems

USA . 4,338 parts In-Stock

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4,338

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Problanco Electronics

Mexico . 2,540 parts In-Stock

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TANS Electronics

Latvia . 797 parts In-Stock

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797

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SupplyDigital Components

Austria . 645 parts In-Stock

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645

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Corphita

USA . 607 parts In-Stock

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UHIMA Technologies

Türkiye . 371 parts In-Stock

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Corohmni

South Africa . 154 parts In-Stock

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Overview

Enhance your communication devices with the MC68194FJR2 modem by Onsemi, a leading manufacturer known for its superior quality in the industry. This cutting-edge technology offers fast data rates of up to 10 Mbps, making it ideal for a wide range of applications. With a compact chip carrier package and low power consumption of only 0.27 mA, this modem provides exceptional value and efficiency for your electronic designs. Upgrade your products with Onsemi's reliable and high-performance MC68194FJR2 modem today!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This package body material ensures high durability and reliability of the modem.

Surface Mount: YES

Being surface mountable makes the modem easy to install and reduces the overall footprint of the device.

Power Supplies (V): 5

Operating at a low power supply of 5V makes this modem energy efficient.

No. of Terminals: 52

Having a high number of terminals allows for more connectivity options and versatility in usage.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this modem can withstand harsh environments.

Width: 18.935 mm

The compact width of the modem makes it suitable for installations where space is limited.

Temperature Grade: COMMERCIAL

Being rated for commercial temperature grades ensures stable performance in typical operating conditions.

Data Rate: 10 Mbps

Capable of a high data rate of 10 Mbps, this modem can handle fast and efficient data transfer.

Technical Specifications

Modems MC68194FJR2 attributes and parameters. Explore more Modems devices from Onsemi

Specs

Data Rate:

10 Mbps

JESD-30 Code:

S-CQCC-J52

JESD-609 Code:

e0

Length:

18.935 mm

No. of Functions:

1

No. of Terminals:

52

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LDCC52,.8SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Modems

Maximum Supply Current:

.27 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

18.935 mm

Trade Compliance

MC68194FJR2 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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