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TS68951CFN

STMicroelectronics

TS68951CFN by STMicroelectronics

STMicroelectronics TS68951CFN is a modem-support circuit with +-5V power supplies. It features 28 terminals in a square chip carrier package, CMOS technology, and operates b/w 0-70 °C. Ideal for telecom applications requiring -5V/+5V supply voltages and low current consumption of 0.04mA.

Median Price

-

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,743 parts In-Stock

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Anansix

USA . 2,448 parts In-Stock

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2,448

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Vyrian

USA . 1,696 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 146 parts In-Stock

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J & M Industries LLC

USA . 107 parts In-Stock

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107

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Q Components

USA . 56 parts In-Stock

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Prism Electronics

USA . 31 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,603 parts In-Stock

1+ parts

$10.735

100+ parts

-

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$9.661

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1,603

$10.735

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$9.661

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MKK Technologies

India . 1,023 parts In-Stock

1+ parts

$20.186

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1,023

$20.186

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DigiPath Technology Company

USA . 1,023 parts In-Stock

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$20.186

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1,023

$20.186

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Parana Technologies

USA . 1,335 parts In-Stock

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$12.835

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1,335

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$12.835

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Kepictronics

USA . 1,289 parts In-Stock

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1,289

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Corphita

USA . 762 parts In-Stock

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Perfect Parts

USA . 362 parts In-Stock

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362

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Cyclops Electronics Ltd (Excess)

UK . 146 parts In-Stock

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146

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Overview

Unlocking seamless communication and connectivity, the TS68951CFN by STMicroelectronics sets the standard for quality and innovation in the modem category. Crafted with precision and expertise, this modem-support circuit boasts a range of applications, from telecommunications to networking. Offering unparalleled value and benefits to customers, this product delivers reliable performance, efficient power supplies, and robust terminal finishes. Experience the advantages of cutting-edge technology and elevate your connectivity with the TS68951CFN.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and helps in reducing the overall weight of the modem, making it easy to handle and transport.

Surface Mount: YES

Surface mount technology allows for easy installation on circuit boards, saving time and effort during assembly.

Power Supplies (V): +-5

The power supply range of +-5V ensures stable and consistent power delivery, enhancing the performance and reliability of the modem.

No. of Terminals: 28

The numerous terminals provide ample connectivity options, allowing for seamless integration with other components in the system.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70 °C ensures that the modem can withstand harsh environmental conditions without compromising functionality.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the modem energy-efficient and reliable in data transmission.

Technical Specifications

Modems TS68951CFN attributes and parameters. Explore more Modems devices from STMicroelectronics

Specs

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e0

Length:

11.5062 mm

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

+-5

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Modems

Maximum Supply Current:

.04 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.5062 mm

Trade Compliance

TS68951CFN Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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