Loading...

STLC7550TQF7TR

STMicroelectronics

STLC7550TQF7TR by STMicroelectronics

STLC7550TQF7TR by STMicroelectronics is a low-profile modem with a 3V supply and operates b/w 0 °C to 70°C. It features a data rate of 0.056 Mbps and comes in a compact 48-terminal flatpack design. Ideal for telecom applications, it ensures efficient communication in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,696 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,696

-

-

-

-

Digiode

USA . 757 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

757

-

-

-

-

Anansix

USA . 107 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

107

-

-

-

-

ACDS - Activité Composants Distribution Service

France . 61 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

61

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 460 parts In-Stock

1+ parts

$6.890

100+ parts

-

1k+ parts

$6.201

10k+ parts

-

460

$6.890

-

$6.201

-

MKK Technologies

India . 467 parts In-Stock

1+ parts

$12.956

100+ parts

-

1k+ parts

-

10k+ parts

-

467

$12.956

-

-

-

DigiPath Technology Company

USA . 467 parts In-Stock

1+ parts

$12.956

100+ parts

-

1k+ parts

-

10k+ parts

-

467

$12.956

-

-

-

AZTECH Wire

Italy . 755 parts In-Stock

1+ parts

$15.590

100+ parts

-

1k+ parts

-

10k+ parts

-

755

$15.590

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 10,317 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,317

-

-

-

-

Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,000

-

-

-

-

Microchip USA

USA . 5,908 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,908

-

-

-

-

Corphita

USA . 2,390 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,390

-

-

-

-

Parana Technologies

USA . 2,235 parts In-Stock

1+ parts

-

100+ parts

$8.238

1k+ parts

-

10k+ parts

-

2,235

-

$8.238

-

-

Vigor

Singapore . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

-

-

-

-

Perfect Parts

USA . 137 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

137

-

-

-

-

Cyclops Electronics Ltd (Excess)

UK . 61 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

61

-

-

-

-

Overview

Unlock seamless connectivity with the STLC7550TQF7TR modem from STMicroelectronics. Renowned for their commitment to quality, STMicroelectronics delivers a reliable solution perfect for diverse applications, including IoT devices and telecommunications. This compact modem boasts low power consumption and efficient performance, ensuring your projects thrive in any environment. Elevate your designs with a product that embodies innovation, reliability, and value!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic and epoxy construction provides excellent protection against environmental factors, ensuring longevity and reliability.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient use of space on printed circuit boards, making it ideal for modern applications.

Package Shape: SQUARE

The square package shape ensures uniform distribution of heat and facilitates efficient assembly on PCB layouts.

Power Supplies (V): 3

Designed to work with a low power supply voltage of 3V, making it energy-efficient and suitable for battery-powered devices.

No. of Terminals: 48

The 48 terminals provide ample connectivity options, enabling complex integration into various systems and enhancing functionality.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The low-profile, fine pitch design allows for high-density mounting and contributes to the overall reduction in system size.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this modem can perform reliably in a variety of environments without risking overheating.

Minimum Operating Temperature: 0 °C

The ability to operate down to 0 °C ensures functionality in cold environments, making it suitable for a wide range of applications.

Terminal Finish: TIN LEAD

Tin lead terminals offer superior solderability and corrosion resistance, ensuring a strong connection and long-lasting performance.

Terminal Position: QUAD

The quad terminal positioning allows for effective signal integrity and simplifies the layout process on the circuit board.

Maximum Seated Height: 1.6 mm

The low seated height of 1.6 mm is beneficial for applications requiring minimal vertical space, ideal for compact devices.

Width: 7 mm

At a width of 7 mm, this modem can fit into tight spaces without compromising on performance or functionality.

Length: 7 mm

The compact length of 7 mm contributes to a small footprint, making integration into smaller devices easier.

Temperature Grade: COMMERCIAL

Designed to meet commercial temperature standards, ensuring it remains operational in typical ambient conditions found in most applications.

Technology: CMOS

CMOS technology allows for low power consumption and high performance, making it suitable for modern communication applications.

Terminal Form: GULL WING

Gull wing terminal forms allow for easier soldering and better mechanical connection, enhancing reliability.

Telecom IC Type: MODEM-SUPPORT CIRCUIT

As a modem-support circuit, it is specifically designed to handle data communication needs efficiently.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3V supports low power applications, enhancing efficiency and battery life.

Terminal Pitch: 0.5 mm

A fine terminal pitch of 0.5 mm facilitates compact layouts, allowing the modem to be used in space-constrained applications.

Data Rate: 0.056 Mbps

A data rate of 0.056 Mbps is sufficient for basic communication needs, suitable for less demanding applications.

Technical Specifications

Modems STLC7550TQF7TR attributes and parameters. Explore more Modems devices from STMicroelectronics

Specs

Data Rate:

.056 Mbps

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e0

Length:

7 mm

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Modems

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

STLC7550TQF7TR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 16