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STLC7545CFN

STMicroelectronics

STLC7545CFN by STMicroelectronics

STLC7545CFN by STMicroelectronics is a 44-terminal modem IC with 3.3/5,5 V power supplies and 0.0384 Mbps data rate. It features CMOS technology, operates b/w 0-70 °C, and is used in telecom applications for modem-support circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,308 parts In-Stock

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Anansix

USA . 2,486 parts In-Stock

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2,486

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Vyrian

USA . 215 parts In-Stock

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215

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 71 parts In-Stock

1+ parts

$15.672

100+ parts

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$14.105

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71

$15.672

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$14.105

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MKK Technologies

India . 2,099 parts In-Stock

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$29.471

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2,099

$29.471

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DigiPath Technology Company

USA . 2,099 parts In-Stock

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$29.471

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2,099

$29.471

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Assy Fe

Spain . 6,231 parts In-Stock

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Parana Technologies

USA . 2,006 parts In-Stock

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$18.738

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2,006

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$18.738

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Corphita

USA . 503 parts In-Stock

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503

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Overview

Unlock seamless communication possibilities with the STLC7545CFN by STMicroelectronics. Crafted with precision and expertise, this modem-support circuit offers unparalleled reliability and performance. Ideal for a wide range of applications, this innovative chip carrier is designed for maximum efficiency and durability. Experience the value and benefits of superior connectivity with the STLC7545CFN, where quality meets cutting-edge technology to meet your communication needs effortlessly.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and helps in reducing the overall weight of the modem, making it easier to handle and transport.

Surface Mount: YES

Surface mount capability ensures easy installation and integration of the modem into existing setups or circuits.

Power Supplies (V): 3.3/5,5

Compatible with multiple power supply options, offering flexibility in power input for various applications.

No. of Terminals: 44

Higher number of terminals allows for more connectivity options, increasing the versatility of the modem.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this modem can perform efficiently even in demanding environmental conditions.

Minimum Operating Temperature: 0 °C

Capable of operating at low temperatures, ensuring reliable performance in a wide range of environments.

Technology: CMOS

CMOS technology offers low power consumption and high reliability, making the modem energy-efficient and durable.

Nominal Supply Voltage: 5 V

Operates at a standard voltage of 5V, compatible with most power sources and circuits.

Data Rate: 0.0384 Mbps

Capable of data transmission at a speed of 0.0384 Mbps, suitable for various communication needs.

Technical Specifications

Modems STLC7545CFN attributes and parameters. Explore more Modems devices from STMicroelectronics

Specs

Data Rate:

.0384 Mbps

JESD-30 Code:

S-PQCC-J44

JESD-609 Code:

e3

Length:

16.5862 mm

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC44,.7SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

3.3/5,5

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Modems

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

16.5862 mm

Trade Compliance

STLC7545CFN Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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