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STLC7546CFNTR

STMicroelectronics

STLC7546CFNTR by STMicroelectronics

STLC7546CFNTR by STMicroelectronics is a CMOS modem with a compact 28-terminal chip carrier design. It operates b/w 0 °C and 70°C, requiring a nominal voltage of 3.3V. Ideal for telecom applications, it supports efficient data communication in commercial environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,240 parts In-Stock

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4,240

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Digiode

USA . 3,223 parts In-Stock

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3,223

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Anansix

USA . 1,007 parts In-Stock

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1,007

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 263 parts In-Stock

1+ parts

$13.399

100+ parts

-

1k+ parts

$12.059

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263

$13.399

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$12.059

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MKK Technologies

India . 333 parts In-Stock

1+ parts

$25.196

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333

$25.196

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DigiPath Technology Company

USA . 333 parts In-Stock

1+ parts

$25.196

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333

$25.196

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A-Z Elektronik GmbH

Germany . 5,432 parts In-Stock

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5,432

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Corphita

USA . 1,946 parts In-Stock

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1,946

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Parana Technologies

USA . 726 parts In-Stock

1+ parts

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$16.020

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726

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$16.020

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Overview

Unlock seamless connectivity with the STLC7546CFNTR from STMicroelectronics, a leader in modem technology. This compact, high-performance chip ensures reliable data transmission across diverse applications, from IoT devices to telecommunications. With exceptional temperature resilience and robust design, it delivers unmatched quality and efficiency, empowering your projects with cutting-edge innovation. Elevate your connectivity solutions and experience the benefits of superior engineering today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy helps in protecting the internal components from physical damage while also providing lightweight characteristics.

Surface Mount: YES

Surface mount technology allows for faster manufacturing processes and smaller product sizes, enhancing design versatility.

Package Shape: SQUARE

The square shape optimizes space on circuit boards, facilitating efficient layout and integration with other components.

No. of Terminals: 28

Having 28 terminals increases the connectivity options, allowing for more functionality and features in the modem design.

Package Style (Meter): CHIP CARRIER

Chip carrier packaging allows for easy handling and placement in automated assembly processes, improving reliability in production.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures that the modem can function effectively in various environmental conditions.

Minimum Operating Temperature: 0 °C

A minimum operating temperature of 0 °C allows reliable performance in cooler conditions, making it versatile for different applications.

Terminal Position: QUAD

Quad terminal positioning promotes better electrical connectivity and simplifies routing on PCB designs, enhancing overall performance.

Maximum Seated Height: 4.57 mm

A low maximum seated height contributes to a compact design, allowing for thinner end products and saving valuable space.

Width: 11.5062 mm

An optimized width enables efficient use of PCB space, which is crucial for modern small form factor devices.

Length: 11.5062 mm

The consistent length keeps the dimensions compact, aiding in space-constrained applications.

Temperature Grade: COMMERCIAL

Rated for commercial temperature grades, this modem can reliably serve general consumer applications without significant thermal challenges.

Technology: CMOS

CMOS technology is known for low power consumption, making the modem suitable for energy-efficient designs.

Terminal Form: J BEND

J bend terminals enhance the mechanical stability of the connections, ensuring a secure hold once mounted.

Telecom IC Type: MODEM-SUPPORT CIRCUIT

Designed specifically for modem applications, this IC type provides optimized performance for data transmission in telecommunication systems.

Nominal Supply Voltage: 3.3 V

Operating at a low nominal supply voltage of 3.3 V minimizes power demands, crucial for battery-powered devices.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm offers good spacing for soldering, ensuring reliable electrical connections while saving space on the PCB.

Technical Specifications

Modems STLC7546CFNTR attributes and parameters. Explore more Modems devices from STMicroelectronics

Specs

JESD-30 Code:

S-PQCC-J28

Length:

11.5062 mm

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.5062 mm

Trade Compliance

STLC7546CFNTR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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