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TNETEL1200PPB

Texas Instruments

TNETEL1200PPB by Texas Instruments

TNETEL1200PPB by Texas Instruments is a modem IC with 208 terminals, operating at -40 to 85°C. It has a data rate of 6 Mbps and operates at 3.3V supply voltage. This square-shaped IC in flatpack style is ideal for industrial telecom applications due to its high temperature grade and small form factor.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,733 parts In-Stock

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Digiode

USA . 1,824 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 207 parts In-Stock

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207

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Electronics Depot

USA . 48 parts In-Stock

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48

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Distributors (Availability)

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Parana Technologies

USA . 321 parts In-Stock

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$8.904

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$9.579

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321

$8.904

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$9.579

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DigiPath Technology Company

USA . 1,767 parts In-Stock

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$9.805

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$9.021

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1,767

$9.805

$9.021

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ChromeModa Solutions

Germany . 4,469 parts In-Stock

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$10.005

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$8.204

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4,469

$10.005

$8.204

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IDEA Electronic Components Group

UK . 147 parts In-Stock

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$10.005

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$9.505

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$9.004

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147

$10.005

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$9.004

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AZTECH Wire

Italy . 348 parts In-Stock

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$13.872

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348

$13.872

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One Stop Electronics

USA . 461 parts In-Stock

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$871.000

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461

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Corphita

USA . 4,204 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 207 parts In-Stock

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207

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Glotronic Ltd.

UK . 166 parts In-Stock

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Overview

Elevate your communication capabilities with the TNETEL1200PPB by Texas Instruments, a high-quality modem designed to deliver reliable performance in a compact package. Crafted by the industry leader in telecommunications technology, this modem offers unparalleled value and benefits for a wide range of applications. Whether you're looking to enhance your network infrastructure or streamline your data transmission processes, the TNETEL1200PPB is the ideal solution for achieving fast and efficient connectivity. Experience the advantages of cutting-edge technology with Texas Instruments' innovative modem, setting new standards for speed, reliability, and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic and epoxy material helps in reducing the overall weight of the modem, making it easier to handle and install.

Surface Mount: YES

Surface mount technology provides a more compact design, saving space and allowing for easier integration into various devices.

Package Shape: SQUARE

The square package shape offers stability and ease of placement on circuit boards.

No. of Terminals: 208

Having a high number of terminals allows for complex functionality and connectivity options in the modem.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability and performance even in demanding industrial environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature makes this modem suitable for use in extreme cold conditions.

Terminal Position: QUAD

Quad terminal position provides improved stability and connection reliability in the modem.

Maximum Seated Height: 4.1 mm

The low seated height allows for a compact and slim design, ideal for applications with space constraints.

Width: 28 mm

The 28mm width offers a balance between compact size and sufficient surface area for components and connections.

Length: 28 mm

The 28mm length helps in maintaining a square shape, ideal for uniformity in placement and design.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures the modem can withstand harsh environmental conditions in industrial settings.

Terminal Form: GULL WING

Gull wing terminal form provides excellent solder joint reliability and easy inspection during manufacturing.

Telecom IC Type: MODEM

Being a dedicated modem IC type ensures optimized performance for data transmission and reception.

Nominal Supply Voltage: 3.3 V

A 3.3V supply voltage offers compatibility with a wide range of systems and power sources.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch allows for high-density mounting and efficient use of PCB space.

Data Rate: 6 Mbps

With a data rate of 6 Mbps, this modem can handle high-speed data transmission requirements effectively.

Technical Specifications

Modems TNETEL1200PPB attributes and parameters. Explore more Modems devices from Texas Instruments

Specs

Data Rate:

6 Mbps

JESD-30 Code:

S-PQFP-G208

Length:

28 mm

No. of Functions:

1

No. of Terminals:

208

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

4.1 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

28 mm

Trade Compliance

TNETEL1200PPB Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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