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12197-504-XTP

Onsemi

12197-504-XTP by Onsemi

Onsemi's 12197-504-XTP modem features CMOS technology, operates at -40 to 85 °C, with a data rate of 0.0012 Mbps. With 28 terminals in a square chip carrier package, it is ideal for industrial telecom applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,650 parts In-Stock

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1,650

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Vyrian

USA . 199 parts In-Stock

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199

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 599 parts In-Stock

1+ parts

$0.260

100+ parts

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$0.250

599

$0.260

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$0.250

Northwest PG Solutions

USA . 1,282 parts In-Stock

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$0.286

100+ parts

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$0.252

1,282

$0.286

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$0.252

Problanco Electronics

Mexico . 6,023 parts In-Stock

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6,023

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TANS Electronics

Latvia . 5,925 parts In-Stock

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5,925

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Kulean Microsystems

USA . 2,881 parts In-Stock

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2,881

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SupplyDigital Components

Austria . 1,508 parts In-Stock

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1,508

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UHIMA Technologies

Türkiye . 942 parts In-Stock

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942

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Corphita

USA . 689 parts In-Stock

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Corohmni

South Africa . 113 parts In-Stock

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Overview

Unlock the power of seamless connectivity with the 12197-504-XTP by Onsemi. Crafted with precision and expertise, this modem offers unparalleled quality and reliability. Perfect for a wide range of applications, this innovative product ensures fast and efficient data transmission. Enjoy the benefits of cutting-edge technology with Onsemi's modem, providing value and convenience to customers worldwide. Elevate your connectivity experience with the 12197-504-XTP from Onsemi today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection to the internal components of the modem, ensuring long-term reliability.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort during assembly.

No. of Terminals: 28

Sufficient number of terminals for connecting various components and ensuring efficient data transfer.

Maximum Operating Temperature: 85 °C

Capable of operating in high-temperature environments without overheating, increasing the versatility of the modem.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, resulting in energy-efficient and reliable performance.

Technical Specifications

Modems 12197-504-XTP attributes and parameters. Explore more Modems devices from Onsemi

Specs

Data Rate:

.0012 Mbps

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e0

Length:

11.4808 mm

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

4.572 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.4808 mm

Trade Compliance

12197-504-XTP Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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