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NCN5192MNG

Onsemi

NCN5192MNG by Onsemi

The Onsemi NCN5192MNG is a modem IC with 32 terminals, CMOS technology, and operates at -40 to 85 °C. It features a square surface mount package style with a 1mm seated height. Ideal for industrial telecom applications requiring a 3.3V supply voltage and 0.5mm terminal pitch.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,749 parts In-Stock

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Digiode

USA . 1,378 parts In-Stock

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AZTECH Wire

Italy . 1,098 parts In-Stock

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$20.860

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Kulean Microsystems

USA . 8,184 parts In-Stock

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SupplyDigital Components

Austria . 1,392 parts In-Stock

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Problanco Electronics

Mexico . 844 parts In-Stock

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844

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UHIMA Technologies

Türkiye . 751 parts In-Stock

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751

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Microchip USA

USA . 315 parts In-Stock

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Corohmni

South Africa . 222 parts In-Stock

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Corphita

USA . 125 parts In-Stock

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TANS Electronics

Latvia . 11 parts In-Stock

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Overview

Unlock seamless connectivity and enhanced communication with the NCN5192MNG by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality modems like the NCN5192MNG that offer unparalleled reliability and performance. Whether you're looking to upgrade your IoT devices, industrial equipment, or telecommunications systems, this modem is the perfect solution. With its advanced technology and industrial-grade design, the NCN5192MNG ensures smooth operation even in extreme conditions. Trust Onsemi to provide exceptional value and innovation in every product, making your connectivity needs a breeze.

Feature Benefit Bullets

Surface Mount: YES

Surface mount allows for easy and secure placement of the modem on a circuit board, making it suitable for mass production and space-saving designs.

Package Shape: SQUARE

Square package shape provides stability and ease of handling during installation, reducing the risk of damage to the modem.

No. of Terminals: 32

Having 32 terminals allows for more connectivity options and applications, making the modem versatile for various setups.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this modem can withstand demanding environmental conditions without performance degradation.

Minimum Operating Temperature: -40 °C

The wide range of minimum operating temperature (-40 °C) ensures reliable performance in extreme cold environments as well.

Terminal Position: QUAD

Quad terminal positions offer a secure and stable connection, enhancing the reliability of the modem in different applications.

Maximum Seated Height: 1 mm

The low maximum seated height of 1 mm allows for compact and slim designs, making the modem suitable for space-constrained applications.

Technology: CMOS

CMOS technology offers low power consumption and high performance, making the modem energy-efficient and fast in data processing.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3 V, the modem is compatible with standard power sources, ensuring easy integration into existing systems.

Terminal Pitch: 0.5 mm

Having a terminal pitch of 0.5 mm allows for precise and secure connections, ensuring reliable data transfer and signal integrity.

Technical Specifications

Modems NCN5192MNG attributes and parameters. Explore more Modems devices from Onsemi

Specs

JESD-30 Code:

S-XQCC-N32

Length:

5 mm

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Trade Compliance

NCN5192MNG Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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