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NCN5192MNRG

Onsemi

NCN5192MNRG by Onsemi

The Onsemi NCN5192MNRG modem features a 32-terminal chip carrier package with matte tin finish. Operating temperature ranges from -40 to 85°C, suitable for industrial use. It requires 3.3V nominal voltage and consumes 0.0006mA max supply current, making it ideal for telecom applications.

Median Price

$4.420

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 8,820 parts In-Stock

1+ parts

$4.420

100+ parts

$3.340

1k+ parts

$2.560

10k+ parts

$2.460

8,820

$4.420

$3.340

$2.560

$2.460

DigiKey

USA . 4,188 parts In-Stock

1+ parts

$4.420

100+ parts

$3.332

1k+ parts

$2.925

10k+ parts

$2.685

4,188

$4.420

$3.332

$2.925

$2.685

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$2.867

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$2.867

-

-

-

Vyrian

USA . 7,847 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,847

-

-

-

-

Digiode

USA . 1,679 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,679

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 4,209 parts In-Stock

1+ parts

$2.867

100+ parts

-

1k+ parts

-

10k+ parts

$2.810

4,209

$2.867

-

-

$2.810

Argo Parts USA

USA . 146 parts In-Stock

1+ parts

$2.867

100+ parts

-

1k+ parts

-

10k+ parts

-

146

$2.867

-

-

-

Aztec Data Supply Inc.

USA . 167 parts In-Stock

1+ parts

$7.650

100+ parts

-

1k+ parts

-

10k+ parts

-

167

$7.650

-

-

-

AZTECH Wire

Italy . 762 parts In-Stock

1+ parts

$12.632

100+ parts

-

1k+ parts

-

10k+ parts

-

762

$12.632

-

-

-

Microchip USA

USA . 3,856 parts In-Stock

1+ parts

$14.495

100+ parts

-

1k+ parts

-

10k+ parts

-

3,856

$14.495

-

-

-

Ampacity Inc.

Singapore . 766 parts In-Stock

1+ parts

$217.000

100+ parts

-

1k+ parts

-

10k+ parts

-

766

$217.000

-

-

-

Semicontronic

India . 945 parts In-Stock

1+ parts

$378.000

100+ parts

$368.550

1k+ parts

$366.660

10k+ parts

-

945

$378.000

$368.550

$366.660

-

Kulean Microsystems

USA . 6,700 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,700

-

-

-

-

Lixinc

USA . 6,422 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,422

-

-

-

-

SupplyDigital Components

Austria . 6,306 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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6,306

-

-

-

-

TANS Electronics

Latvia . 4,131 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,131

-

-

-

-

RC Electronics

USA . 3,750 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,750

-

-

-

-

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Problanco Electronics

Mexico . 715 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

715

-

-

-

-

Netroflash

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$2.810

1k+ parts

$2.724

10k+ parts

$2.666

500

-

$2.810

$2.724

$2.666

Corphita

USA . 392 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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392

-

-

-

-

Corohmni

South Africa . 252 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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252

-

-

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UHIMA Technologies

Türkiye . 86 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

86

-

-

-

-

Overview

Revolutionize your communication systems with the NCN5192MNRG by Onsemi. As a leading manufacturer in modem technology, Onsemi delivers top-quality products that guarantee seamless connectivity and reliability. Ideal for a wide range of applications, this modem offers unmatched value, benefits, and advantages to customers seeking superior performance and efficiency. Experience the difference with Onsemi's NCN5192MNRG and stay ahead in the fast-paced world of telecommunications.

Feature Benefit Bullets

Surface Mount

YES - Allows for easy and secure mounting on circuit boards, making it convenient for integration into various electronic devices.

Package Shape

SQUARE - Provides a compact and uniform design, saving space and ensuring efficient placement within electronic systems.

Power Supplies (V)

3.3/5 - Supports a range of power supply voltages, offering flexibility for different applications and environments.

No. of Terminals

32 - Provides ample connectivity options for interfacing with other components, enhancing overall functionality and versatility.

Package Style (Meter)

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE - Offers various package styles suitable for different thermal and spatial requirements, ensuring optimal performance in diverse settings.

Maximum Operating Temperature

85 °C - Can withstand high operating temperatures, making it reliable for extended and demanding usage conditions.

Minimum Operating Temperature

40 °C - Withstands low temperatures, ensuring consistent performance in harsh environmental conditions.

Terminal Finish

MATTE TIN - Provides a durable and corrosion-resistant terminal finish, ensuring long-term reliability and signal integrity.

Terminal Position

QUAD - Features a quad terminal position for secure connectivity and stable signal transmission, maintaining consistent data transfer.

Maximum Seated Height

1 mm - Boasts a low seated height, enabling slim designs and efficient space utilization in compact electronic devices.

Width

5 mm - Has a narrow width, allowing for streamlined integration and efficient use of board space in electronic assemblies.

Maximum Time At Peak Reflow Temperature (s)

30 - Safely endures reflow processes without compromising integrity, ensuring reliable and consistent performance during manufacturing.

Peak Reflow Temperature °C

260 - Supports high reflow temperatures, facilitating robust soldering and secure component attachment during assembly.

Length

5 mm - Features a short length, contributing to a compact form factor and facilitating space-saving design solutions.

Temperature Grade

INDUSTRIAL - Approved for industrial-grade applications, ensuring rugged and reliable performance in harsh operating environments.

Technology

CMOS - Utilizes CMOS technology for efficient power consumption and high-speed data processing, enhancing overall performance and energy efficiency.

Terminal Form

NO LEAD - Incorporates a lead-free terminal form, complying with environmental regulations and promoting sustainability.

Maximum Supply Current

0.0006 mA - Consumes minimal supply current, contributing to energy efficiency and prolonging battery life in portable devices.

Telecom IC Type

MODEM - Specifically designed for telecom applications, offering reliable and fast data transmission capabilities for communication purposes.

Nominal Supply Voltage

3.3 V - Operates on a standard 3.3V supply voltage, widely compatible with various electronic systems and power sources.

Terminal Pitch

0.5 mm - Features a fine terminal pitch for precise connectivity and compact layout designs, ensuring secure connections and efficient signal routing.

Moisture Sensitivity Level (MSL)

3 - Assigned MSL 3 rating indicates moderate moisture sensitivity, suitable for storage and operation in typical factory or warehouse environments.

Technical Specifications

Modems NCN5192MNRG attributes and parameters. Explore more Modems devices from Onsemi

Specs

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Modems

Maximum Supply Current:

.0006 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

NCN5192MNRG Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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