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SN65HVD230DR

Texas Instruments

SN65HVD230DR by Texas Instruments

SN65HVD230DR by Texas Instruments is a BICMOS technology interface circuit with 1Mbps data rate, suitable for industrial applications. It operates at 3.3V, has 8 terminals in a small outline package, and can withstand temperatures from -40 to 85°C.

Median Price

$1.903

Lifecycle Status

Suppliers In-Stock

47

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 310,481 parts In-Stock

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$1.579

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Chip1Stop

Japan . 1,887 parts In-Stock

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Newark

USA . 56 parts In-Stock

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$1.360

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DigiKey

USA . 61,866 parts In-Stock

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$2.450

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$1.229

Mouser Electronics

USA . 41,848 parts In-Stock

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Farnell

UK . 3,843 parts In-Stock

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Arrow

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Verical

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RS (Exports)

UK . 270 parts In-Stock

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Distributors (In-Stock)

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Maritex

Poland . 1 parts In-Stock

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Greenchips

USA . 2,289 parts In-Stock

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Ozdisan Elektronik

Türkiye . 1,945 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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Digiode

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TME

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Cyclops Electronics Ltd

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Bristol Electronics

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NAC Semi

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Micros sp.j. W. Kędra i J. Lic

Poland . 760 parts In-Stock

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iBuyXS LLC

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$0.720

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Ampacity Inc.

Singapore . 39,021 parts In-Stock

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Semicontronic

India . 38,814 parts In-Stock

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Corphita

USA . 3,949 parts In-Stock

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Argo Parts USA

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Netroflash

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Corohmni

South Africa . 58 parts In-Stock

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Modulus Dynamics

Lithuania . 4,794 parts In-Stock

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Parana Technologies

USA . 1,211 parts In-Stock

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$13.644

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$1,267.024

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$12.279

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DigiPath Technology Company

USA . 1,875 parts In-Stock

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$15.023

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ChromeModa Solutions

Germany . 6,769 parts In-Stock

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$15.330

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$12.571

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IDEA Electronic Components Group

UK . 367 parts In-Stock

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$14.564

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$13.797

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Advanced Electronics

New Zealand . 91 parts In-Stock

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$17.037

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$16.185

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$16.185

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Infinite Electronics LLP (Excess)

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Formix International (Excess)

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iodParts Technologies Inc.

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Kepictronics

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Israel . 60,000 parts In-Stock

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Epart123

USA . 17,500 parts In-Stock

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S.R.D Solutions

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Germany . 6,041 parts In-Stock

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Robosynatics

Brazil . 4,400 parts In-Stock

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$10.914

$10.914

Lucentia Tech

USA . 4,400 parts In-Stock

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$11.142

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$10.914

Authorized Procurement Solutions

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Continental Prestige Electronics

USA . 1,960 parts In-Stock

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Singapore . 200 parts In-Stock

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Overview

Upgrade your network interfaces with the SN65HVD230DR by Texas Instruments, a top-quality solution designed to meet all your connectivity needs. Manufactured by a trusted name in the industry, this product offers unparalleled reliability and performance. Ideal for a wide range of applications, this interface circuit ensures seamless communication at a blazing-fast data rate of 1 Mbps. Say goodbye to connectivity issues and experience the benefits of a high-quality solution that delivers value and efficiency to customers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, perfect for portable devices.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards.

Power Supplies (V): 3.3

Operates on a standard power supply voltage of 3.3V, making it compatible with a wide range of devices.

Maximum Operating Temperature: 85 °C

Can operate effectively even in high-temperature environments, ensuring reliability in various conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The nickel/palladium/gold terminal finish provides excellent conductivity and corrosion resistance for long-term performance.

Width: 3.9 mm

Compact width allows for space-saving installation in tight layouts or designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures the product can withstand harsh operating conditions typically found in industrial settings.

Data Rate: 1 Mbps

Supports a data rate of 1 Mbps, suitable for efficient data transmission and communication.

Technical Specifications

Network Interfaces SN65HVD230DR attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

Data Rate:

1 Mbps

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

No. of Transceivers:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

.017 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

SN65HVD230DR Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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