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LAN8742-CZ

Microchip Technology

LAN8742-CZ by Microchip Technology

LAN8742-CZ by Microchip Technology is a 3.3V Ethernet transceiver with 100 Mbps data rate. It features a square package, 24 terminals in a chip carrier style, and operates b/w 0-70°C. Ideal for network interfaces requiring surface mount components with a very thin profile and quad terminal position.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

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Vyrian

USA . 844 parts In-Stock

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844

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 4,438 parts In-Stock

1+ parts

$9.630

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4,438

$9.630

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AZTECH Wire

Italy . 272 parts In-Stock

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$13.694

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272

$13.694

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Corohmni

South Africa . 141 parts In-Stock

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$14.193

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141

$14.193

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Advanced Electronics

New Zealand . 50 parts In-Stock

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$17.189

100+ parts

$16.329

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$16.329

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50

$17.189

$16.329

$16.329

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Component Stockers USA

USA . 534 parts In-Stock

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$99.990

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534

$99.990

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Semicontronic

India . 1,109 parts In-Stock

1+ parts

$453.000

100+ parts

$441.675

1k+ parts

$439.410

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1,109

$453.000

$441.675

$439.410

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Kepictronics

USA . 26,207 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 22,681 parts In-Stock

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Microchip USA

USA . 5,284 parts In-Stock

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West Coast Incorporated

USA . 4,646 parts In-Stock

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Continental Prestige Electronics

USA . 2,579 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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300

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Argo Parts USA

USA . 131 parts In-Stock

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Overview

Upgrade your network interfaces with the cutting-edge LAN8742-CZ by Microchip Technology. Known for their top-notch quality and innovative solutions, Microchip Technology delivers reliable products that exceed industry standards. The LAN8742-CZ is perfect for various applications in the networking sector, offering unmatched value and benefits to customers. With a focus on performance and efficiency, this product provides a seamless experience for all your networking needs. Trust Microchip Technology to take your network to the next level with the LAN8742-CZ.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient integration into circuit boards, saving space and reducing assembly time.

Package Shape: SQUARE

The square package shape allows for a compact design, making it suitable for applications where space is limited.

Power Supplies (V): 3.3

Operating at a low voltage of 3.3V helps in reducing power consumption and heat generation, leading to improved energy efficiency.

No. of Terminals: 24

With a high number of terminals, this network interface allows for multiple connections and data transfer capabilities.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles provides enhanced heat dissipation and compact design options.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this network interface can withstand higher temperatures, making it suitable for a variety of environments.

Minimum Operating Temperature: 0 °C

The ability to operate at temperatures as low as 0°C ensures reliable performance in cold environments.

Terminal Position: QUAD

The quad terminal position allows for stable and secure connections, enhancing the overall durability and performance of the product.

Maximum Seated Height: 1 mm

With a low maximum seated height of 1 mm, this network interface minimizes the overall profile of the circuit board, enabling a more streamlined design.

Width: 4 mm

The compact width of 4 mm makes this product suitable for applications where space is limited, offering flexibility in design.

Length: 4 mm

The small length of 4 mm allows for a compact and space-saving layout on the circuit board, optimizing overall design efficiency.

Temperature Grade: COMMERCIAL

Designed for commercial use, this network interface meets industry standards for reliability and performance in typical operating conditions.

Terminal Form: NO LEAD

The no-lead terminal form enhances the reliability of connections and reduces the risk of electrical failures, ensuring consistent performance.

Telecom IC Type: ETHERNET TRANSCEIVER

With an Ethernet transceiver integrated, this network interface enables high-speed data transmission and communication over Ethernet networks.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3V ensures compatibility with standard electronic systems and power sources.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm allows for close connections and efficient data transfer, maximizing signal integrity and performance.

Data Rate: 100 Mbps

Capable of supporting data rates up to 100 Mbps, this network interface provides fast and reliable connectivity for high-speed network applications.

Technical Specifications

Network Interfaces LAN8742-CZ attributes and parameters. Explore more Network Interfaces devices from Microchip Technology

Specs

Data Rate:

100 Mbps

JESD-30 Code:

S-XQCC-N24

Length:

4 mm

No. of Functions:

1

No. of Terminals:

24

No. of Transceivers:

1

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Network Interfaces

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4 mm

Trade Compliance

LAN8742-CZ Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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