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TJA1041AT/CM,118

NXP Semiconductors

TJA1041AT/CM,118 by NXP Semiconductors

NXP Semiconductors' TJA1041AT/CM,118 is a 14-terminal network interface with 5V supply voltage and 1Mbps data rate. It features AEC-Q100 screening level for automotive applications. The IC is designed in CMOS technology, suitable for telecom interface circuits in compact designs.

Median Price

$2.262

Lifecycle Status

Suppliers In-Stock

22

In-Stock Inventory

1k+

Distributors (Authorized)

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Chip1Stop

Japan . 2,436 parts In-Stock

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$2.900

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$1.710

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$2.900

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Newark

USA . 2,676 parts In-Stock

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$3.320

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$3.320

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Mouser Electronics

USA . 3,315 parts In-Stock

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$3.530

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$2.230

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$1.980

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$1.840

3,315

$3.530

$2.230

$1.980

$1.840

Element14

Singapore . 2,779 parts In-Stock

1+ parts

$4.260

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$2.640

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$2.330

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2,779

$4.260

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$2.330

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Avnet

USA . 150,000 parts In-Stock

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Verical

USA . 72,500 parts In-Stock

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$0.843

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$0.829

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$0.810

72,500

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$0.843

$0.829

$0.810

Elektronika Sales Private Limited

India . 22,500 parts In-Stock

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DigiKey

USA . 11,828 parts In-Stock

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$1.916

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$1.916

Rochester

USA . 9,911 parts In-Stock

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$1.700

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$1.520

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$1.430

9,911

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$1.700

$1.520

$1.430

Farnell

UK . 7,710 parts In-Stock

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$2.262

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$1.620

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7,710

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$2.262

$1.620

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Arrow

USA . 5,000 parts In-Stock

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$1.433

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EBV Elektronik

Germany . 5,000 parts In-Stock

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Digiode

USA . 2,202 parts In-Stock

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$1.492

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$1.492

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Nova Conductors

Japan . 650 parts In-Stock

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$1.880

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650

$1.880

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IBS Electronics

USA . 3,911 parts In-Stock

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$2.564

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Vyrian

USA . 8,574 parts In-Stock

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NAC Semi

USA . 5,000 parts In-Stock

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$2.250

5,000

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$2.250

HZD GmbH

Germany . 2,166 parts In-Stock

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2,166

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Flip Electronics

USA . 1,840 parts In-Stock

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1,840

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Anansix

USA . 1,333 parts In-Stock

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1,333

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RLX Solution Inc.

Canada . 488 parts In-Stock

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488

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NexGen Digital

USA . 10 parts In-Stock

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10

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Distributors (Availability)

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Semicontronic

India . 7,710 parts In-Stock

1+ parts

$1.220

100+ parts

$1.190

1k+ parts

$1.183

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7,710

$1.220

$1.190

$1.183

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Ampacity Inc.

Singapore . 7,652 parts In-Stock

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$1.220

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$1.220

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Corphita

USA . 688 parts In-Stock

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$1.413

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Component Stockers USA

USA . 11,930 parts In-Stock

1+ parts

$1.820

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$1.710

1k+ parts

$1.540

10k+ parts

$1.450

11,930

$1.820

$1.710

$1.540

$1.450

Argo Parts USA

USA . 1,816 parts In-Stock

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$1.880

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Netroflash

USA . 100 parts In-Stock

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$1.880

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Corohmni

South Africa . 394 parts In-Stock

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$1.882

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394

$1.882

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Advanced Electronics

New Zealand . 900 parts In-Stock

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$1.938

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$1.842

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$1.842

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$1.938

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$1.842

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Vigor

Singapore . 1,842 parts In-Stock

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$2.250

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Aztec Data Supply Inc.

USA . 308 parts In-Stock

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$8.655

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Microchip USA

USA . 4,437 parts In-Stock

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$10.097

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Perfect Parts

USA . 126,246 parts In-Stock

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Infinite Electronics LLP (Excess)

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Formix International (Excess)

India . 20,000 parts In-Stock

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Lixinc

USA . 16,276 parts In-Stock

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Continental Prestige Electronics

USA . 8,019 parts In-Stock

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$1.700

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Futuretech Components

Singapore . 5,000 parts In-Stock

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UNI Independent Distributors

Spain . 2,162 parts In-Stock

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iodParts Technologies Inc.

India . 1,610 parts In-Stock

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$2.527

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$2.166

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1,610

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$2.166

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Component Connect

USA . 785 parts In-Stock

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Overview

Upgrade your network connectivity with the TJA1041AT/CM,118 by NXP Semiconductors. This high-quality Network Interface chip offers reliable performance and seamless integration, making it ideal for a wide range of applications. With its durable plastic/epoxy construction and AEC-Q100 screening level, this product ensures long-lasting functionality and superior quality. Experience the value and benefits of enhanced communication and efficiency with the TJA1041AT/CM,118 - the perfect solution for your networking needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the network interface, ensuring long-term reliability.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards.

Screening Level: AEC-Q100

AEC-Q100 screening level ensures high quality and reliability, making it suitable for automotive applications.

Power Supplies (V): 5

Operating on 5V power supplies makes it compatible with a wide range of systems and applications.

No. of Terminals: 14

Having 14 terminals allows for versatile connectivity options and integration into various circuits.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space and is ideal for compact electronic devices.

Maximum Seated Height: 1.75 mm

Low maximum seated height enables a slim profile, suitable for space-constrained designs.

Width: 3.9 mm

Narrow width facilitates easy placement on the circuit board, even in tight spaces.

Maximum Time At Peak Reflow Temperature (s): 30

Ability to withstand peak reflow temperature for up to 30 seconds ensures reliable soldering during manufacturing.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability ensures secure solder joints for optimal performance.

Length: 8.65 mm

Moderate length provides a balanced form factor for integration into various electronic devices.

Technology: CMOS

CMOS technology offers low power consumption, enhancing efficiency and reducing heat generation.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy installation and soldering on the circuit board.

Maximum Supply Current: 0.08 mA

Low maximum supply current requirement minimizes power consumption and extends battery life in portable devices.

Telecom IC Type: INTERFACE CIRCUIT

Specifically designed as an interface circuit for telecom applications, ensuring compatibility and seamless communication.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources.

Terminal Pitch: 1.27 mm

Optimal terminal pitch of 1.27mm offers a good balance between space-saving and ease of soldering.

Data Rate: 1 Mbps

Supporting a data rate of 1 Mbps enables fast and efficient data transmission for seamless networking.

Technical Specifications

Network Interfaces TJA1041AT/CM,118 attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

Data Rate:

1 Mbps

JESD-30 Code:

R-PDSO-G14

Length:

8.65 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

14

No. of Transceivers:

1

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

.08 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

TJA1041AT/CM,118 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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