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TJA1057GT/3

NXP Semiconductors

TJA1057GT/3 by NXP Semiconductors

NXP Semiconductors' TJA1057GT/3 is a network interface IC with AEC-Q100 screening. It features 8 terminals in a small outline package, suitable for telecom applications. Operating at 5V, it has a terminal pitch of 1.27mm and gull wing terminal form.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Cyclops Electronics Ltd

UK . 3,667 parts In-Stock

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3,667

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Anansix

USA . 2,084 parts In-Stock

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2,084

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Vyrian

USA . 409 parts In-Stock

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409

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Digiode

USA . 211 parts In-Stock

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211

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Nova Conductors

Japan . 92 parts In-Stock

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92

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Distributors (Availability)

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Corohmni

South Africa . 33 parts In-Stock

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$7.442

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33

$7.442

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AZTECH Wire

Italy . 818 parts In-Stock

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$9.745

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818

$9.745

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Aztec Data Supply Inc.

USA . 1,519 parts In-Stock

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$14.900

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1,519

$14.900

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One Stop Electronics

USA . 1,336 parts In-Stock

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$524.000

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$524.000

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Semicontronic

India . 1,623 parts In-Stock

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$613.000

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$597.675

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$594.610

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1,623

$613.000

$597.675

$594.610

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Ampacity Inc.

Singapore . 840 parts In-Stock

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$922.000

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840

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Lixinc

USA . 11,526 parts In-Stock

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

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UNI Independent Distributors

Spain . 7,698 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,781 parts In-Stock

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Corphita

USA . 2,532 parts In-Stock

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Futuretech Components

Singapore . 2,500 parts In-Stock

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2,500

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Continental Prestige Electronics

USA . 1,690 parts In-Stock

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1,690

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Argo Parts USA

USA . 943 parts In-Stock

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943

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Bastille Electronics

Australia . 300 parts In-Stock

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300

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Robosynatics

Brazil . 300 parts In-Stock

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300

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Overview

Unlock seamless communication with the TJA1057GT/3 by NXP Semiconductors, a top-tier networking interface designed to elevate connectivity in automotive and industrial applications. Manufactured with precision and reliability, this product boasts AEC-Q100 screening level, ensuring unmatched quality and performance. With its compact design and robust construction, the TJA1057GT/3 offers unparalleled value and efficiency to customers seeking optimal network solutions. Experience enhanced connectivity like never before with NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable devices or rugged environments.

Surface Mount: YES

Surface mount capability allows for easy and convenient integration onto circuit boards, saving space and facilitating automated assembly processes.

Screening Level: AEC-Q100

AEC-Q100 certification ensures that the product meets automotive quality standards, making it suitable for use in automotive applications where reliability and durability are crucial.

Package Shape: RECTANGULAR

The rectangular package shape is standard and widely compatible with various circuit board layouts, making integration easier and more flexible.

Nominal Supply Voltage: 5 V

Operating at a 5V supply voltage makes the product compatible with common power sources and ensures consistent performance in different setups.

Technical Specifications

Network Interfaces TJA1057GT/3 attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

TJA1057GT/3 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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