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SN65HVD230QDRG4

Texas Instruments

SN65HVD230QDRG4 by Texas Instruments

SN65HVD230QDRG4 by Texas Instruments is a BICMOS technology interface circuit with a data rate of 1 Mbps. It operates at a nominal voltage of 3.3V and is commonly used in automotive applications due to its temperature grade and small outline package style.

Median Price

$1.994

Lifecycle Status

EOL

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 837 parts In-Stock

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$1.627

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837

$1.627

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Chip1Stop

Japan . 1,557 parts In-Stock

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$2.360

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$1.618

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$1.610

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1,557

$2.360

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$1.610

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Verical

USA . 837 parts In-Stock

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837

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Digiode

USA . 2,153 parts In-Stock

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$1.865

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$1.865

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Nova Conductors

Japan . 26 parts In-Stock

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$2.602

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Chip Stock

USA . 18,500 parts In-Stock

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Vyrian

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Cyclops Electronics Ltd

UK . 4,095 parts In-Stock

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Component Stockers USA

USA . 7,080 parts In-Stock

1+ parts

$1.370

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$1.310

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$1.260

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7,080

$1.370

$1.310

$1.260

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Semicontronic

India . 1,507 parts In-Stock

1+ parts

$1.430

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$1.394

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$1.387

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1,507

$1.430

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$1.387

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Ampacity Inc.

Singapore . 1,076 parts In-Stock

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$1.430

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Corohmni

South Africa . 243 parts In-Stock

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$1.590

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$1.590

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$1.638

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$1.556

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$1.556

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$1.638

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$1.556

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Corphita

USA . 3,222 parts In-Stock

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$1.767

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$1.767

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Continental Prestige Electronics

USA . 6,771 parts In-Stock

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$2.156

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$2.113

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Argo Parts USA

USA . 4,563 parts In-Stock

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$2.156

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Modulus Dynamics

Lithuania . 750 parts In-Stock

1+ parts

$2.285

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$2.262

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$2.194

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750

$2.285

$2.262

$2.194

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AZTECH Wire

Italy . 1,111 parts In-Stock

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$8.580

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Parana Technologies

USA . 383 parts In-Stock

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$9.354

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$9.976

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$9.354

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DigiPath Technology Company

USA . 159 parts In-Stock

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$10.300

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$9.476

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$9.476

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ChromeModa Solutions

Germany . 6,414 parts In-Stock

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$10.510

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$8.618

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IDEA Electronic Components Group

UK . 546 parts In-Stock

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$10.510

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$9.984

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$9.459

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Perfect Parts

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Infinite Electronics LLP (Excess)

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Formix International (Excess)

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A-Z Elektronik GmbH

Germany . 1,616 parts In-Stock

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Microchip USA

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Robosynatics

Brazil . 100 parts In-Stock

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$0.470

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Lucentia Tech

USA . 100 parts In-Stock

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$0.470

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$0.470

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Overview

Looking for a reliable and high-quality network interface? Look no further than the SN65HVD230QDRG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments is known for delivering exceptional products that meet and exceed customer expectations. The SN65HVD230QDRG4 offers numerous advantages, including its compact design, surface mount capability, and automotive-grade temperature range. With a data rate of 1 Mbps and a nominal supply voltage of 3.3V, this interface circuit provides seamless connectivity and optimal performance. Whether you need it for automotive applications or any other networking needs, the SN65HVD230QDRG4 is the perfect choice to enhance your systems' reliability and efficiency. Experience the value and benefits it brings firsthand!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to external factors, making this product an excellent choice for long-term use.

Surface Mount: YES

This surface mount capability allows for easy installation and integration into various systems, making it a convenient choice for efficient network interfaces.

Package Shape: RECTANGULAR

The rectangular shape of the package provides a compact and space-saving design, making it ideal for applications where size is a constraint.

Power Supplies (V): 3.3

With a nominal supply voltage of 3.3V, this product ensures a stable and reliable power source, contributing to its reliable performance.

No. of Terminals: 8

The availability of 8 terminals allows for versatile connectivity options and makes this product suitable for multiple network interface applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style provides a compact form factor, enabling easy integration into systems with limited space, making it a desirable choice.

Maximum Operating Temperature: 125 °C

This product has a high maximum operating temperature of 125°C, ensuring reliable performance under extreme heat conditions, making it suitable for demanding environments.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this product is designed to withstand cold temperatures, making it a suitable choice for applications in frigid environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The terminal finish of nickel/palladium/gold provides excellent conductivity and corrosion resistance, ensuring reliable and long-lasting connections, making it a preferable choice for network interfaces.

Terminal Position: DUAL

The dual terminal position enhances flexibility in installation and enables multiple connection options, making it a versatile choice for various network interface configurations.

Maximum Seated Height: 1.75 mm

With a low maximum seated height of 1.75mm, this product offers a compact profile, allowing for easy integration into space-constrained systems.

Width: 3.9 mm

The narrow width of 3.9mm makes this product suitable for applications where space is limited, making it a practical choice for compact network interface solutions.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capability of 260°C ensures reliable solder connections during assembly, contributing to the overall robustness and quality of this product choice.

Length: 4.9 mm

The compact length of 4.9mm makes this product suitable for applications with limited space availability, making it a practical option for compact network interfaces.

Temperature Grade: AUTOMOTIVE

With an automotive temperature grade designation, this product is designed and tested to withstand the rigorous temperature requirements of automotive applications, making it a reliable choice for automotive network interfaces.

Technology: BICMOS

The utilization of BICMOS technology combines the benefits of both bipolar and CMOS technologies, resulting in enhanced performance and power efficiency, making this product a superior choice for network interfaces.

Terminal Form: GULL WING

The gull-wing terminal form provides secure solder joints and easy inspection during assembly, ensuring reliable connections and simplifying the manufacturing process, making it an ideal choice for efficient network interfaces.

Maximum Supply Current: 0.017 mA

With a low maximum supply current of 0.017mA, this product minimizes power consumption, making it energy-efficient and suitable for applications where power efficiency is a priority.

Telecom IC Type: INTERFACE CIRCUIT

Designed as an interface circuit for telecommunications applications, this product enables seamless connectivity and signal transmission, making it a reliable choice for telecom network interfaces.

Nominal Supply Voltage: 3.3 V

With a nominal supply voltage of 3.3V, this product ensures compatibility with standard power supply systems, making it a practical choice for various network interface configurations.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27mm provides sufficient space between terminals for easy handling and precise installation, making it a user-friendly choice for network interfaces.

Data Rate: 1 Mbps

With a data rate of 1Mbps, this product offers high-speed data transmission capabilities, making it suitable for applications requiring rapid and efficient data transfer.

Technical Specifications

Network Interfaces SN65HVD230QDRG4 attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

Data Rate:

1 Mbps

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

.017 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

SN65HVD230QDRG4 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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