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SN65HVD233DG4

Texas Instruments

SN65HVD233DG4 by Texas Instruments

SN65HVD233DG4 by Texas Instruments is an 8-terminal interface circuit with a data rate of 1 Mbps. Operating b/w -40 to 125°C, it has a supply voltage of 3.3V and consumes up to 6mA. Ideal for automotive applications due to its small outline package and robust temperature grade.

Median Price

$3.390

Lifecycle Status

EOL

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$3.390

100+ parts

-

1k+ parts

-

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300

$3.390

-

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Chip Stock

USA . 21,890 parts In-Stock

1+ parts

-

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21,890

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Vyrian

USA . 5,294 parts In-Stock

1+ parts

-

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5,294

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-

-

-

Digiode

USA . 4,293 parts In-Stock

1+ parts

-

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4,293

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Euro-Tech

UK . 10 parts In-Stock

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 3,231 parts In-Stock

1+ parts

$3.093

100+ parts

-

1k+ parts

-

10k+ parts

$3.031

3,231

$3.093

-

-

$3.031

Argo Parts USA

USA . 1,148 parts In-Stock

1+ parts

$3.093

100+ parts

-

1k+ parts

-

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1,148

$3.093

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Modulus Dynamics

Lithuania . 500 parts In-Stock

1+ parts

$3.108

100+ parts

$3.077

1k+ parts

$2.984

10k+ parts

-

500

$3.108

$3.077

$2.984

-

AZTECH Wire

Italy . 719 parts In-Stock

1+ parts

$7.637

100+ parts

-

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719

$7.637

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Parana Technologies

USA . 282 parts In-Stock

1+ parts

$10.810

100+ parts

-

1k+ parts

$11.289

10k+ parts

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282

$10.810

-

$11.289

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ChromeModa Solutions

Germany . 4,337 parts In-Stock

1+ parts

$12.146

100+ parts

$9.960

1k+ parts

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4,337

$12.146

$9.960

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IDEA Electronic Components Group

UK . 1,519 parts In-Stock

1+ parts

$12.146

100+ parts

$11.539

1k+ parts

$10.931

10k+ parts

-

1,519

$12.146

$11.539

$10.931

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Corohmni

South Africa . 222 parts In-Stock

1+ parts

$15.699

100+ parts

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222

$15.699

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$18.222

100+ parts

$17.311

1k+ parts

$17.311

10k+ parts

-

3,000

$18.222

$17.311

$17.311

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One Stop Electronics

USA . 1,355 parts In-Stock

1+ parts

$526.000

100+ parts

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1,355

$526.000

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Semicontronic

India . 1,214 parts In-Stock

1+ parts

$657.000

100+ parts

$640.575

1k+ parts

$637.290

10k+ parts

-

1,214

$657.000

$640.575

$637.290

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Ampacity Inc.

Singapore . 1,295 parts In-Stock

1+ parts

$897.000

100+ parts

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1,295

$897.000

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Corphita

USA . 1,367 parts In-Stock

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1,367

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$3.322

1k+ parts

$3.221

10k+ parts

$3.153

1,000

-

$3.322

$3.221

$3.153

DigiPath Technology Company

USA . 986 parts In-Stock

1+ parts

-

100+ parts

$10.951

1k+ parts

-

10k+ parts

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986

-

$10.951

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Robosynatics

Brazil . 500 parts In-Stock

1+ parts

-

100+ parts

$0.759

1k+ parts

$0.759

10k+ parts

$0.759

500

-

$0.759

$0.759

$0.759

Lucentia Tech

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$0.759

1k+ parts

$0.759

10k+ parts

$0.759

500

-

$0.759

$0.759

$0.759

Microchip USA

USA . 446 parts In-Stock

1+ parts

-

100+ parts

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446

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Perfect Parts

USA . 252 parts In-Stock

1+ parts

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252

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Overview

Unleash the power of seamless communication with the SN65HVD233DG4 by Texas Instruments. Crafted with precision and expertise, this network interface marvel is designed to elevate your connectivity experience. Whether you're in the automotive industry, telecommunications sector, or any other field requiring interface circuits, this product offers unparalleled quality and reliability. With a nominal supply voltage of 3.3V and a data rate of 1 Mbps, the SN65HVD233DG4 ensures smooth operations at temperatures ranging from -40°C to 125°C. Trust in Texas Instruments for cutting-edge solutions that deliver value, efficiency, and peace of mind. Elevate your connectivity game today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the network interface easy to handle and long-lasting.

Surface Mount: YES

Allows for easy and secure attachment to circuit boards, saving space and facilitating assembly.

Maximum Operating Temperature: 125 °C

Can operate in high temperature environments, suitable for a wide range of applications.

Nominal Supply Voltage: 3.3 V

Compatible with standard voltage levels, making it easy to integrate into various electronic systems.

Data Rate: 1 Mbps

Capable of transferring data at a fast rate, ensuring efficient communication within networks.

Technical Specifications

Network Interfaces SN65HVD233DG4 attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

Data Rate:

1 Mbps

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

6 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

SN65HVD233DG4 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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