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TJA1028TK/5V0/20:1

NXP Semiconductors

TJA1028TK/5V0/20:1 by NXP Semiconductors

NXP Semiconductors' TJA1028TK/5V0/20:1 is a LIN transceiver with 1 function, operating at -40 to 150°C. It has a supply voltage of 3.3V and draws a max current of 4.5mA. This small outline package with 8 terminals is ideal for automotive network interfaces.

Median Price

$1.089

Lifecycle Status

Suppliers In-Stock

19

In-Stock Inventory

1k+

Distributors (Authorized)

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Chip1Stop

Japan . 12,000 parts In-Stock

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$1.160

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$0.797

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$1.160

$0.797

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Mouser Electronics

USA . 439 parts In-Stock

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$1.770

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$1.050

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$0.950

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$0.867

439

$1.770

$1.050

$0.950

$0.867

Verical

USA . 16,800 parts In-Stock

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$1.089

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$0.971

16,800

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$1.089

$0.971

Rochester

USA . 16,800 parts In-Stock

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$1.050

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$0.872

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$0.777

16,800

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$1.050

$0.872

$0.777

Arrow

USA . 12,600 parts In-Stock

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$0.948

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Avnet

USA . 1,400 parts In-Stock

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Distributors (In-Stock)

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Maritex

Poland . 3,249 parts In-Stock

1+ parts

$1.051

100+ parts

$0.527

1k+ parts

$0.452

10k+ parts

$0.403

3,249

$1.051

$0.527

$0.452

$0.403

Digiode

USA . 4,808 parts In-Stock

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$1.102

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Nova Conductors

Japan . 91 parts In-Stock

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$1.138

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Flip Electronics

USA . 600,000 parts In-Stock

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IBS Electronics

USA . 15,400 parts In-Stock

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$1.031

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$1.031

TME

Poland . 12,600 parts In-Stock

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Vyrian

USA . 8,914 parts In-Stock

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Anansix

USA . 4,719 parts In-Stock

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Prism Electronics

USA . 79 parts In-Stock

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NAC Semi

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Cyclops Electronics Ltd

UK . 6 parts In-Stock

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ComSIT Distribution GmbH

Germany . 2 parts In-Stock

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ComSIT USA

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Distributors (Availability)

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Ampacity Inc.

Singapore . 9,164 parts In-Stock

1+ parts

$0.630

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9,164

$0.630

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Semicontronic

India . 15,238 parts In-Stock

1+ parts

$0.650

100+ parts

$0.634

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$0.630

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15,238

$0.650

$0.634

$0.630

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Corphita

USA . 3,297 parts In-Stock

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$1.044

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$1.044

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Continental Prestige Electronics

USA . 6,192 parts In-Stock

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$1.138

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$1.115

6,192

$1.138

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$1.115

Argo Parts USA

USA . 4,981 parts In-Stock

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$1.138

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Bastille Electronics

Australia . 10 parts In-Stock

1+ parts

$1.138

100+ parts

$1.081

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$1.027

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$1.013

10

$1.138

$1.081

$1.027

$1.013

Microchip USA

USA . 10,752 parts In-Stock

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$6.000

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Aztec Data Supply Inc.

USA . 1,480 parts In-Stock

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$9.130

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1,480

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Advanced Electronics

New Zealand . 82 parts In-Stock

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$15.145

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$14.388

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$14.388

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$15.145

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$14.388

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Corohmni

South Africa . 932 parts In-Stock

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$16.980

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QUARKTWIN TECHNOLOGY LTD

USA . 27,261 parts In-Stock

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S.R.D Solutions

India . 10,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 10,000 parts In-Stock

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Futuretech Components

Singapore . 6,000 parts In-Stock

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Kepictronics

USA . 6,000 parts In-Stock

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UNI Independent Distributors

Spain . 5,447 parts In-Stock

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iodParts Technologies Inc.

India . 4,025 parts In-Stock

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$1.267

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Lixinc

USA . 2,334 parts In-Stock

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2,334

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Netroflash

USA . 2,000 parts In-Stock

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$1.115

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$1.081

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$1.058

2,000

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$1.081

$1.058

Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Perfect Parts

USA . 560 parts In-Stock

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Metaverse IC Inc.

Canada . 544 parts In-Stock

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544

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GreenTree Electronics

Israel . 500 parts In-Stock

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Component Connect

USA . 295 parts In-Stock

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Overview

Unlock seamless communication with the TJA1028TK/5V0/20:1 by NXP Semiconductors. This LIN transceiver offers unparalleled reliability and performance, thanks to NXP's cutting-edge technology. Ideal for automotive and industrial applications, this network interface ensures smooth data transmission in any environment. Trust NXP Semiconductors to deliver quality products that exceed expectations. Elevate your connectivity with the TJA1028TK/5V0/20:1 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material makes the product lightweight and durable, ideal for network interfaces that may be subject to frequent handling or movement.

Surface Mount: YES

With surface mount capability, this product can be easily integrated into circuit boards, saving space and making it suitable for compact electronic devices.

No. of Functions: 1

Despite its compact size, this product is able to perform multiple functions efficiently, making it a versatile choice for various networking applications.

Screening Level: AEC-Q100

This high screening level ensures that the product meets stringent automotive industry standards, guaranteeing reliable performance in challenging environments.

Package Shape: SQUARE

The square package shape allows for easy placement on circuit boards and ensures efficient use of space, making it a practical choice for compact electronic designs.

No. of Terminals: 8

With eight terminals, this product offers ample connectivity options, allowing for versatile and customizable networking solutions.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

This package style combines a small outline, heat sink/slug, and very thin profile, making it ideal for applications where space is limited and heat dissipation is crucial.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature ensures that this product can withstand intense heat conditions, making it suitable for use in demanding industrial environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for reliable performance even in extremely cold conditions, making this product versatile for use in various climates.

Terminal Position: DUAL

With dual terminal positions, this product offers flexibility in circuit board placement, allowing for optimal connectivity and reducing installation challenges.

Maximum Seated Height: 1 mm

The low maximum seated height of 1mm enables slim and compact design possibilities, making this product suitable for space-constrained electronic devices.

Width: 3 mm

The compact width of 3mm ensures that this product can fit into narrow spaces, enabling efficient use of board real estate in electronic designs.

Maximum Time At Peak Reflow Temperature (s): 30

This specification indicates the maximum duration the product can be exposed to peak reflow temperatures during soldering, ensuring proper installation and reliability in manufacturing processes.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C provides a high heat tolerance, ensuring that the product can withstand soldering processes without damage, guaranteeing long-term reliability.

Length: 3 mm

The short length of 3mm allows for compact and space-efficient product design, making it ideal for applications where size constraints are a consideration.

Terminal Form: NO LEAD

This terminal form eliminates the need for lead soldering, making installation easier and reducing the environmental impact, making it a more sustainable choice.

No. of Transceivers: 1

With one transceiver, this product can transmit and receive data efficiently, making it suitable for applications that require reliable communication capabilities.

Maximum Supply Current: 4.5 mA

The low maximum supply current of 4.5mA ensures energy-efficient operation, reducing power consumption and making it ideal for battery-powered devices.

Telecom IC Type: LIN TRANSCEIVER

This telecom IC type is specifically designed for Local Interconnect Network (LIN) applications, ensuring compatibility and optimal performance in networking systems that require LIN communication.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V provides stable power input for the product, ensuring consistent performance and reliability in a variety of networking applications.

Terminal Pitch: 0.65 mm

With a small terminal pitch of 0.65mm, this product offers high-density connectivity options, making it ideal for applications where space-saving and efficiency are critical.

Moisture Sensitivity Level (MSL): 1

The low moisture sensitivity level of 1 indicates that this product is highly resistant to moisture damage, ensuring long-term reliability in humid or damp environments.

Technical Specifications

Network Interfaces TJA1028TK/5V0/20:1 attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PDSO-N8

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Transceivers:

1

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.12,25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Maximum Supply Current:

4.5 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

TJA1028TK/5V0/20:1 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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