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TJA1057GTK/3

NXP Semiconductors

TJA1057GTK/3 by NXP Semiconductors

NXP Semiconductors' TJA1057GTK/3 is an AEC-Q100 compliant interface circuit with 8 terminals, small outline package style, and 5V nominal voltage. It is designed for automotive applications requiring a compact (3x3mm) surface-mount solution with dual terminal position.

Median Price

$1.119

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Maritex

Poland . 4,628 parts In-Stock

1+ parts

$1.119

100+ parts

$0.645

1k+ parts

$0.602

10k+ parts

$0.526

4,628

$1.119

$0.645

$0.602

$0.526

Digiode

USA . 3,777 parts In-Stock

1+ parts

-

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3,777

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Cyclops Electronics Ltd

UK . 1,457 parts In-Stock

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1,457

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Anansix

USA . 1,082 parts In-Stock

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1,082

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Vyrian

USA . 884 parts In-Stock

1+ parts

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884

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 220 parts In-Stock

1+ parts

$7.355

100+ parts

-

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220

$7.355

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Aztec Data Supply Inc.

USA . 16,632 parts In-Stock

1+ parts

$8.740

100+ parts

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16,632

$8.740

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AZTECH Wire

Italy . 466 parts In-Stock

1+ parts

$9.057

100+ parts

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466

$9.057

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One Stop Electronics

USA . 1,008 parts In-Stock

1+ parts

$241.000

100+ parts

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1,008

$241.000

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Semicontronic

India . 1,161 parts In-Stock

1+ parts

$582.000

100+ parts

$567.450

1k+ parts

$564.540

10k+ parts

-

1,161

$582.000

$567.450

$564.540

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Ampacity Inc.

Singapore . 1,591 parts In-Stock

1+ parts

$991.000

100+ parts

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1,591

$991.000

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Lixinc

USA . 15,378 parts In-Stock

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15,378

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A-Z Elektronik GmbH

Germany . 5,957 parts In-Stock

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5,957

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Futuretech Components

Singapore . 4,518 parts In-Stock

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4,518

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Continental Prestige Electronics

USA . 3,489 parts In-Stock

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3,489

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UNI Independent Distributors

Spain . 2,617 parts In-Stock

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2,617

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Corphita

USA . 1,238 parts In-Stock

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1,238

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Argo Parts USA

USA . 1,028 parts In-Stock

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1,028

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

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1,000

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Bastille Electronics

Australia . 37 parts In-Stock

1+ parts

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37

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Overview

Elevate your network interfaces with the TJA1057GTK/3 by NXP Semiconductors. This cutting-edge product boasts top-quality manufacturing and a wide range of applications, making it a versatile solution for various industries. With its advanced features and compact design, this interface circuit offers unparalleled value, providing customers with enhanced performance and reliability. Upgrade your systems today with the TJA1057GTK/3 and experience the benefits of superior connectivity like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability in various operating conditions.

Surface Mount: YES

Allows for easy installation on PCBs, saving space and enabling efficient manufacturing processes.

Screening Level: AEC-Q100

Meets automotive industry standards for quality and reliability, suitable for automotive applications.

Package Shape: SQUARE

Square package shape helps in efficient layout design and space utilization on boards.

No. of Terminals: 8

Provides multiple connection points for enhanced functionality and connectivity.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The small outline, heat sink/slug, and very thin profile design contribute to improved thermal management and space-saving.

Terminal Position: DUAL

Dual terminal position allows for flexibility in circuit design and connectivity options.

Maximum Seated Height: 1 mm

Low seated height enables the product to fit in compact spaces without compromising performance.

Width: 3 mm

Compact width makes it suitable for applications where space is a constraint.

Length: 3 mm

Compact length contributes to the overall small form factor of the product.

Terminal Form: NO LEAD

Lead-free terminals are environmentally friendly and comply with modern regulations.

Telecom IC Type: INTERFACE CIRCUIT

Specifically designed for telecom applications, ensuring compatibility and performance in communication systems.

Nominal Supply Voltage: 5 V

Operates at a standard 5V supply voltage, making it widely compatible with common power sources.

Terminal Pitch: 0.65 mm

Fine terminal pitch allows for high-density mounting and precise connections on PCBs.

Technical Specifications

Network Interfaces TJA1057GTK/3 attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PDSO-N8

Length:

3 mm

No. of Functions:

1

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3 mm

Trade Compliance

TJA1057GTK/3 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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