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XISOW1044DFMR

Texas Instruments

XISOW1044DFMR by Texas Instruments

XISOW1044DFMR by Texas Instruments is a CAN FD transceiver with 5 Mbps data rate. It operates in automotive temperature range (-40 to 125 °C) and has 20 terminals in small outline package. Ideal for automotive networking applications due to its high-speed communication capabilities.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,984 parts In-Stock

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Digiode

USA . 2,958 parts In-Stock

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2,958

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Nova Conductors

Japan . 91 parts In-Stock

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91

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$8.528

100+ parts

$8.102

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$8.102

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500

$8.528

$8.102

$8.102

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AZTECH Wire

Italy . 528 parts In-Stock

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$9.971

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528

$9.971

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Corohmni

South Africa . 166 parts In-Stock

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$11.947

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166

$11.947

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Parana Technologies

USA . 1,530 parts In-Stock

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$11.962

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$12.368

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1,530

$11.962

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$12.368

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DigiPath Technology Company

USA . 1,110 parts In-Stock

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$13.171

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$12.118

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$13.171

$12.118

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ChromeModa Solutions

Germany . 3,334 parts In-Stock

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$13.440

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$11.021

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$13.440

$11.021

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IDEA Electronic Components Group

UK . 1,685 parts In-Stock

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$13.440

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$12.768

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$12.096

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1,685

$13.440

$12.768

$12.096

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Ampacity Inc.

Singapore . 485 parts In-Stock

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$143.000

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485

$143.000

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One Stop Electronics

USA . 794 parts In-Stock

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$309.000

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794

$309.000

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Semicontronic

India . 524 parts In-Stock

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$366.000

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$356.850

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$355.020

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524

$366.000

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$355.020

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Continental Prestige Electronics

USA . 6,930 parts In-Stock

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Corphita

USA . 2,513 parts In-Stock

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Argo Parts USA

USA . 1,421 parts In-Stock

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Bastille Electronics

Australia . 500 parts In-Stock

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Overview

Discover the cutting-edge XISOW1044DFMR by Texas Instruments, a top-tier manufacturer known for its high-quality products. This networking interface device offers seamless connectivity solutions for various applications, making it a versatile choice for tech enthusiasts and professionals alike. With its compact design and exceptional performance, this product ensures reliable data transmission at high speeds, all while maintaining a cost-effective approach. Upgrade your networking experience with the XISOW1044DFMR and enjoy the benefits of efficiency, reliability, and innovation in one compact package.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Surface Mount: YES

The surface mount capability allows for easy installation and saves valuable PCB space.

Package Shape: RECTANGULAR

The rectangular package shape offers efficient use of board space and easy integration into existing designs.

No. of Terminals: 20

With 20 terminals, this network interface provides connectivity options for multiple components and devices.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliable performance even in demanding environmental conditions.

Nominal Supply Voltage: 1.8 V

The low nominal supply voltage enhances energy efficiency and reduces power consumption.

Data Rate: 5 Mbps

The high data rate of 5 Mbps ensures fast and efficient data transfer, ideal for high-speed networking applications.

Technical Specifications

Network Interfaces XISOW1044DFMR attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

Additional Features:

ESD Value for CANH, CANL Bus pins w.r.t GISOIN is 3B

Data Rate:

5 Mbps

JESD-30 Code:

R-PDSO-G20

Length:

12.83 mm

No. of Functions:

1

No. of Terminals:

20

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Seated Height:

3.55 mm

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

XISOW1044DFMR Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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