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XISO1042DWR

Texas Instruments

XISO1042DWR by Texas Instruments

XISO1042DWR by Texas Instruments is a CMOS network interface IC with 16 terminals, operating b/w -40 to 125°C. It has a small outline package style and Gull Wing terminal form, suitable for automotive applications requiring a 1.8V supply voltage and interface circuitry in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,418 parts In-Stock

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Digiode

USA . 3,459 parts In-Stock

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3,459

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Nova Conductors

Japan . 900 parts In-Stock

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900

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Distributors (Availability)

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AZTECH Wire

Italy . 540 parts In-Stock

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$9.166

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540

$9.166

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Parana Technologies

USA . 1,184 parts In-Stock

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$9.389

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$10.006

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1,184

$9.389

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$10.006

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DigiPath Technology Company

USA . 2,039 parts In-Stock

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$10.338

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$9.511

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2,039

$10.338

$9.511

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ChromeModa Solutions

Germany . 3,070 parts In-Stock

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$10.549

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$8.650

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3,070

$10.549

$8.650

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IDEA Electronic Components Group

UK . 276 parts In-Stock

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$10.549

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$10.022

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$9.494

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276

$10.549

$10.022

$9.494

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Corohmni

South Africa . 244 parts In-Stock

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$14.973

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$14.973

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Ampacity Inc.

Singapore . 1,524 parts In-Stock

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$105.000

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$105.000

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One Stop Electronics

USA . 451 parts In-Stock

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$204.000

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451

$204.000

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Semicontronic

India . 676 parts In-Stock

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$397.000

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$387.075

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$385.090

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676

$397.000

$387.075

$385.090

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

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Corphita

USA . 1,148 parts In-Stock

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Continental Prestige Electronics

USA . 552 parts In-Stock

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552

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Argo Parts USA

USA . 231 parts In-Stock

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Bastille Electronics

Australia . 23 parts In-Stock

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Overview

Elevate your network interfaces with the XISO1042DWR by Texas Instruments. Known for their superior quality and reliability, Texas Instruments delivers cutting-edge technology in a compact, automotive-grade package. This interface circuit offers seamless connectivity and enhanced performance, making it the perfect solution for a wide range of applications. Experience the value and benefits of Texas Instruments with the XISO1042DWR – where innovation meets excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material, suitable for various applications.

Surface Mount: YES

Easy to install on circuit boards, saving time and effort.

Package Shape: RECTANGULAR

Standard shape that fits well with other components on a board.

No. of Terminals: 16

Provides multiple connection points for a secure and reliable electrical connection.

Package Style (Meter): SMALL OUTLINE

Compact size saves space on the board and allows for denser packing of components.

Maximum Operating Temperature: 125 °C

Can operate efficiently at high temperatures without performance degradation.

Minimum Operating Temperature: -40 °C

Can withstand low temperatures, making it suitable for various environments.

Terminal Position: DUAL

Provides redundancy and ensures a stable connection.

Maximum Seated Height: 2.8 mm

Low profile design for compact and slim devices.

Width: 5.85 mm

Narrow width for efficient use of board space.

Length: 7.5 mm

Compact length for space-constrained applications.

Temperature Grade: AUTOMOTIVE

Meets automotive industry standards for reliable performance in vehicles.

Technology: CMOS

Uses low power CMOS technology for energy efficiency.

Terminal Form: GULL WING

Provides mechanical strength and easy soldering for reliable connections.

Telecom IC Type: INTERFACE CIRCUIT

Specifically designed for interface circuits in telecommunications applications.

Nominal Supply Voltage: 1.8 V

Operates at a low voltage for energy efficiency.

Terminal Pitch: 1.27 mm

Provides fine pitch for densely populated boards, allowing for more terminals in a smaller space.

Technical Specifications

Network Interfaces XISO1042DWR attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G16

Length:

7.5 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Seated Height:

2.8 mm

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.85 mm

Trade Compliance

XISO1042DWR Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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