Loading...

XISO1044BDR

Texas Instruments

XISO1044BDR by Texas Instruments

XISO1044BDR by Texas Instruments is a small outline network interface IC with 8 terminals. It operates in automotive-grade temperature range (-40 to 125°C) at 1.8V supply voltage, drawing max 70mA current. Ideal for telecom applications requiring interface circuits in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,033 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,033

-

-

-

-

Digiode

USA . 96 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

96

-

-

-

-

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 921 parts In-Stock

1+ parts

$8.345

100+ parts

-

1k+ parts

-

10k+ parts

-

921

$8.345

-

-

-

Parana Technologies

USA . 627 parts In-Stock

1+ parts

$12.096

100+ parts

-

1k+ parts

$12.505

10k+ parts

-

627

$12.096

-

$12.505

-

DigiPath Technology Company

USA . 2,258 parts In-Stock

1+ parts

$13.319

100+ parts

$12.254

1k+ parts

-

10k+ parts

-

2,258

$13.319

$12.254

-

-

ChromeModa Solutions

Germany . 1,624 parts In-Stock

1+ parts

$13.591

100+ parts

$11.145

1k+ parts

-

10k+ parts

-

1,624

$13.591

$11.145

-

-

IDEA Electronic Components Group

UK . 959 parts In-Stock

1+ parts

$13.591

100+ parts

$12.911

1k+ parts

$12.232

10k+ parts

-

959

$13.591

$12.911

$12.232

-

Advanced Electronics

New Zealand . 200 parts In-Stock

1+ parts

$14.045

100+ parts

$13.343

1k+ parts

$13.343

10k+ parts

-

200

$14.045

$13.343

$13.343

-

AZTECH Wire

Italy . 226 parts In-Stock

1+ parts

$15.163

100+ parts

-

1k+ parts

-

10k+ parts

-

226

$15.163

-

-

-

One Stop Electronics

USA . 1,292 parts In-Stock

1+ parts

$70.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,292

$70.000

-

-

-

Ampacity Inc.

Singapore . 1,146 parts In-Stock

1+ parts

$524.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,146

$524.000

-

-

-

Semicontronic

India . 792 parts In-Stock

1+ parts

$899.000

100+ parts

$876.525

1k+ parts

$872.030

10k+ parts

-

792

$899.000

$876.525

$872.030

-

Continental Prestige Electronics

USA . 6,455 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,455

-

-

-

-

Robosynatics

Brazil . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,000

-

-

-

-

Lucentia Tech

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

$1.871

1k+ parts

$1.871

10k+ parts

$1.871

5,000

-

$1.871

$1.871

$1.871

Corphita

USA . 3,511 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,511

-

-

-

-

Argo Parts USA

USA . 584 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

584

-

-

-

-

Bastille Electronics

Australia . 26 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

26

-

-

-

-

Overview

Elevate your network interfaces with the XISO1044BDR by Texas Instruments. Crafted with quality materials and cutting-edge technology, this product offers unparalleled performance and reliability. Perfect for automotive applications, this interface circuit ensures seamless connectivity and optimal functionality. Say goodbye to connectivity issues and hello to a world of limitless possibilities with Texas Instruments' XISO1044BDR. Welcome to the future of networking.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for applications where weight and durability are important factors.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on PCBs, saving space and simplifying assembly processes.

Package Shape: RECTANGULAR

The rectangular package shape is commonly used and makes the product compatible with standard PCB layouts, ensuring easy integration into existing designs.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions and ensure reliable performance in a wide range of applications.

Terminal Form: GULL WING

The gull wing terminal form provides strong mechanical support and easy soldering, enhancing the product's reliability and ease of assembly.

Nominal Supply Voltage: 1.8 V

The low nominal supply voltage of 1.8V makes the product energy-efficient and suitable for low-power applications, helping to reduce power consumption.

Technical Specifications

Network Interfaces XISO1044BDR attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G8

Length:

4.905 mm

No. of Functions:

1

No. of Terminals:

8

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.24

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Seated Height:

1.75 mm

Maximum Supply Current:

70 mA

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.895 mm

Trade Compliance

XISO1044BDR Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 3