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PCA82C251T

NXP Semiconductors

PCA82C251T by NXP Semiconductors

PCA82C251T by NXP Semiconductors is a CMOS interface circuit with 8 terminals, operating at 5V. It has a temperature range of -40 to 125°C, suitable for automotive applications. This small outline package IC is surface mountable and ideal for network interfaces in automotive systems.

Median Price

$6.055

Lifecycle Status

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28

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Component Electronics Inc.

Canada . 5 parts In-Stock

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Forefront Electronics and Design

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Sunrise Surplus Inc.

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ComSIT Distribution GmbH

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Atlantic Semiconductor

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Corohmni

South Africa . 375 parts In-Stock

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Aztec Data Supply Inc.

USA . 4,444 parts In-Stock

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AZTECH Wire

Italy . 884 parts In-Stock

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Advanced Electronics

New Zealand . 500 parts In-Stock

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One Stop Electronics

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Semicontronic

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Ampacity Inc.

Singapore . 748 parts In-Stock

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Cyclops Electronics Ltd (Excess)

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ChipstoGo Electronic ltd

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Computer Components Inc. - USA

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Giza Technologies, Inc.

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Assy Fe

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Overview

Upgrade your network interface with the PCA82C251T by NXP Semiconductors, a high-quality solution designed to enhance connectivity and communication in automotive applications. With a reputation for excellence in semiconductor manufacturing, NXP Semiconductors ensures top-notch performance and reliability. Say goodbye to connectivity issues and hello to seamless data transfer with this innovative product. Unlock new possibilities and optimize your system with the PCA82C251T today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection for the internal components of the network interface.

Surface Mount: YES

Being surface mountable makes it easy to integrate this network interface into circuit boards, saving space and simplifying the assembly process.

Power Supplies (V): 5

With a nominal supply voltage of 5V, this network interface is compatible with a wide range of power sources and can be easily integrated into various applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures that this network interface can perform reliably in high temperature environments.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high speed operation, making this network interface efficient and reliable.

Technical Specifications

Network Interfaces PCA82C251T attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Network Interfaces

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

PCA82C251T Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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