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PCA82C250T/YM,112

NXP Semiconductors

PCA82C250T/YM,112 by NXP Semiconductors

PCA82C250T/YM,112 by NXP Semiconductors is a BICMOS technology-based network interface with 1 transceiver. It operates at a nominal voltage of 5V and has a max supply current of 0.07mA. This small outline package is commonly used in automotive applications for interface circuits.

Median Price

$1.490

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 13,729 parts In-Stock

1+ parts

$0.870

100+ parts

$0.850

1k+ parts

$0.840

10k+ parts

-

13,729

$0.870

$0.850

$0.840

-

Farnell

UK . 2,276 parts In-Stock

1+ parts

$1.490

100+ parts

$1.060

1k+ parts

$0.741

10k+ parts

$0.687

2,276

$1.490

$1.060

$0.741

$0.687

Element14

Singapore . 1,577 parts In-Stock

1+ parts

$2.960

100+ parts

$2.140

1k+ parts

$1.460

10k+ parts

-

1,577

$2.960

$2.140

$1.460

-

Verical

USA . 10 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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10

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,876 parts In-Stock

1+ parts

$0.826

100+ parts

-

1k+ parts

-

10k+ parts

-

2,876

$0.826

-

-

-

Nova Conductors

Japan . 15 parts In-Stock

1+ parts

$0.909

100+ parts

-

1k+ parts

-

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15

$0.909

-

-

-

Chip Stock

USA . 147,000 parts In-Stock

1+ parts

-

100+ parts

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147,000

-

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-

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Vyrian

USA . 6,702 parts In-Stock

1+ parts

-

100+ parts

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6,702

-

-

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ComSIT Distribution GmbH

Germany . 1,000 parts In-Stock

1+ parts

-

100+ parts

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-

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1,000

-

-

-

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Anansix

USA . 161 parts In-Stock

1+ parts

-

100+ parts

-

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161

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Bristol Electronics

USA . 36 parts In-Stock

1+ parts

-

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-

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36

-

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Atlantic Semiconductor

USA . 36 parts In-Stock

1+ parts

-

100+ parts

-

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36

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 6,478 parts In-Stock

1+ parts

$0.720

100+ parts

-

1k+ parts

-

10k+ parts

-

6,478

$0.720

-

-

-

Semicontronic

India . 13,684 parts In-Stock

1+ parts

$0.740

100+ parts

$0.722

1k+ parts

$0.718

10k+ parts

-

13,684

$0.740

$0.722

$0.718

-

Corphita

USA . 3,461 parts In-Stock

1+ parts

$0.783

100+ parts

-

1k+ parts

-

10k+ parts

-

3,461

$0.783

-

-

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Argo Parts USA

USA . 2,742 parts In-Stock

1+ parts

$0.909

100+ parts

-

1k+ parts

-

10k+ parts

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2,742

$0.909

-

-

-

Modulus Dynamics

Lithuania . 750 parts In-Stock

1+ parts

$1.009

100+ parts

$0.999

1k+ parts

$0.969

10k+ parts

-

750

$1.009

$0.999

$0.969

-

Continental Prestige Electronics

USA . 2,276 parts In-Stock

1+ parts

$1.490

100+ parts

$1.060

1k+ parts

$0.741

10k+ parts

-

2,276

$1.490

$1.060

$0.741

-

Vigor

Singapore . 3,416 parts In-Stock

1+ parts

$2.240

100+ parts

-

1k+ parts

-

10k+ parts

-

3,416

$2.240

-

-

-

Corohmni

South Africa . 1,287 parts In-Stock

1+ parts

$8.070

100+ parts

-

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-

10k+ parts

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1,287

$8.070

-

-

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Aztec Data Supply Inc.

USA . 573 parts In-Stock

1+ parts

$11.600

100+ parts

-

1k+ parts

-

10k+ parts

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573

$11.600

-

-

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Advanced Electronics

New Zealand . 140 parts In-Stock

1+ parts

$15.008

100+ parts

$14.258

1k+ parts

$14.258

10k+ parts

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140

$15.008

$14.258

$14.258

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AZTECH Wire

Italy . 505 parts In-Stock

1+ parts

$16.200

100+ parts

-

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505

$16.200

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Perfect Parts

USA . 164,528 parts In-Stock

1+ parts

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164,528

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S.R.D Solutions

India . 30,000 parts In-Stock

1+ parts

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30,000

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

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10,000

-

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A-Z Elektronik GmbH

Germany . 5,540 parts In-Stock

1+ parts

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5,540

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Microchip USA

USA . 4,821 parts In-Stock

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4,821

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UNI Independent Distributors

Spain . 4,473 parts In-Stock

1+ parts

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4,473

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-

-

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$0.891

1k+ parts

$0.864

10k+ parts

$0.845

1,000

-

$0.891

$0.864

$0.845

Robosynatics

Brazil . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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500

-

-

-

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Lucentia Tech

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$3.842

1k+ parts

$3.842

10k+ parts

$3.842

500

-

$3.842

$3.842

$3.842

Overview

Discover the PCA82C250T/YM,112 by NXP Semiconductors, an industry-leading network interface that combines superior quality with unmatched performance. Manufactured by NXP Semiconductors, a trusted name in the semiconductor industry, this product offers numerous advantages for various applications. With its compact design and surface mount capability, it is perfect for automotive and telecom applications. Experience the value of seamless communication, reliable connectivity, and efficient power supply with the PCA82C250T/YM,112. Trust NXP Semiconductors to deliver the highest quality solutions that exceed your expectations.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY. This material provides durability and resistance, making the product suitable for use in various environments.

Surface Mount:

YES. The surface mount capability enables easy installation and integration into existing systems.

No. of Functions:

1. With a single function, this product focuses on providing a specific and reliable operation.

Package Shape:

RECTANGULAR. The rectangular shape allows for efficient use of space and easy placement in electronic devices.

Power Supplies (V):

5. Operating at 5 volts ensures compatibility with a wide range of power sources.

No. of Terminals:

8. The presence of multiple terminals enables seamless connectivity and communication with other components.

Package Style (Meter):

SMALL OUTLINE. This compact package style allows for space-saving integration and efficient design.

Maximum Operating Temperature:

125 °C. The high operating temperature range ensures reliable performance even in challenging environments.

Minimum Operating Temperature:

40 °C. With a low operating temperature limit, this product remains functional even in extremely cold conditions.

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER. The use of these high-quality finishes enhances the product's conductivity and resistance to corrosion.

Terminal Position:

DUAL. The dual terminal position offers flexibility in terms of circuit connection and layout.

Maximum Seated Height:

1.75 mm. The low seated height enables the product to be employed in space-constrained applications.

Width:

3.9 mm. The slim width makes this product suitable for compact designs and devices.

Maximum Time At Peak Reflow Temperature (s):

30. The ability to withstand high temperatures for up to 30 seconds enhances the product's durability during assembly processes.

Peak Reflow Temperature °C:

260. This high peak reflow temperature ensures efficient soldering and reliability in manufacturing.

Length:

4.9 mm. The compact length facilitates easy integration and placement within electronic assemblies.

Temperature Grade:

AUTOMOTIVE. This product is designed to meet the demanding temperature range required for automotive applications.

Technology:

BICMOS. The use of BICMOS technology combines the advantages of both bipolar and CMOS, resulting in improved performance and functionality.

Terminal Form:

GULL WING. The gull wing terminal form enables secure and reliable solder connections during assembly.

No. of Transceivers:

1. The inclusion of a transceiver allows this product to efficiently transmit and receive data or signals.

Maximum Supply Current:

0.07 mA. Operating within low supply current levels ensures energy efficiency and reduces power consumption.

Telecom IC Type:

INTERFACE CIRCUIT. This product serves as a reliable interface circuit for telecommunications applications.

Nominal Supply Voltage:

5 V. The use of a 5-volt nominal supply voltage ensures compatibility and ease of integration with existing systems.

Terminal Pitch:

1.27 mm. The small terminal pitch enables high-density mounting, maximizing circuitry in a limited space.

Moisture Sensitivity Level (MSL):

1. The MSL 1 rating indicates that this product has been designed and tested to withstand the effects of moisture during storage and assembly processes.

Technical Specifications

Network Interfaces PCA82C250T/YM,112 attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

.07 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

PCA82C250T/YM,112 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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