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TLE9250XLEXUMA1

Infineon Technologies

TLE9250XLEXUMA1 by Infineon Technologies

TLE9250XLEXUMA1 by Infineon is an AEC-Q100 compliant interface circuit with 8 terminals, 0.65mm pitch, and 5V supply voltage. Its small outline package makes it suitable for automotive applications requiring a compact design and high reliability in harsh environments. The no-lead terminal form and thin profile enhance space efficiency while ensuring robust performance.

Median Price

$0.953

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 1,174 parts In-Stock

1+ parts

$0.762

100+ parts

$0.721

1k+ parts

$0.700

10k+ parts

-

1,174

$0.762

$0.721

$0.700

-

Newark

USA . 3,000 parts In-Stock

1+ parts

$1.060

100+ parts

$0.626

1k+ parts

$0.577

10k+ parts

-

3,000

$1.060

$0.626

$0.577

-

Mouser Electronics

USA . 83,757 parts In-Stock

1+ parts

$1.400

100+ parts

$0.840

1k+ parts

$0.743

10k+ parts

$0.704

83,757

$1.400

$0.840

$0.743

$0.704

Arrow

USA . 4,334 parts In-Stock

1+ parts

$1.417

100+ parts

$0.831

1k+ parts

$0.799

10k+ parts

-

4,334

$1.417

$0.831

$0.799

-

DigiKey

USA . 23,145 parts In-Stock

1+ parts

$1.730

100+ parts

$1.013

1k+ parts

$0.884

10k+ parts

$0.852

23,145

$1.730

$1.013

$0.884

$0.852

Element14

Singapore . 46,713 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.755

46,713

-

-

-

$0.755

Rochester

USA . 36,147 parts In-Stock

1+ parts

-

100+ parts

$0.854

1k+ parts

$0.709

10k+ parts

$0.632

36,147

-

$0.854

$0.709

$0.632

Verical

USA . 29,050 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.886

10k+ parts

$0.790

29,050

-

-

$0.886

$0.790

RS (Exports)

UK . 14,980 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.953

14,980

-

-

-

$0.953

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 854 parts In-Stock

1+ parts

$0.633

100+ parts

-

1k+ parts

-

10k+ parts

-

854

$0.633

-

-

-

Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$0.934

100+ parts

-

1k+ parts

-

10k+ parts

-

150

$0.934

-

-

-

Vyrian

USA . 33,069 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

33,069

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 32,810 parts In-Stock

1+ parts

$0.590

100+ parts

$0.575

1k+ parts

$0.572

10k+ parts

-

32,810

$0.590

$0.575

$0.572

-

Corphita

USA . 612 parts In-Stock

1+ parts

$0.599

100+ parts

-

1k+ parts

-

10k+ parts

-

612

$0.599

-

-

-

Ampacity Inc.

Singapore . 32,940 parts In-Stock

1+ parts

$0.600

100+ parts

-

1k+ parts

-

10k+ parts

-

32,940

$0.600

-

-

-

Modulus Dynamics

Lithuania . 4,138 parts In-Stock

1+ parts

$0.926

100+ parts

$0.889

1k+ parts

$0.852

10k+ parts

-

4,138

$0.926

$0.889

$0.852

-

Corohmni

South Africa . 381 parts In-Stock

1+ parts

$0.926

100+ parts

-

1k+ parts

-

10k+ parts

-

381

$0.926

-

-

-

Argo Parts USA

USA . 4,835 parts In-Stock

1+ parts

$0.934

100+ parts

-

1k+ parts

-

10k+ parts

-

4,835

$0.934

-

-

-

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$0.934

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

$0.934

-

-

-

Advanced Electronics

New Zealand . 200 parts In-Stock

1+ parts

$0.954

100+ parts

$0.906

1k+ parts

$0.906

10k+ parts

-

200

$0.954

$0.906

$0.906

-

Component Stockers USA

USA . 155,345 parts In-Stock

1+ parts

$1.210

100+ parts

$0.960

1k+ parts

$0.690

10k+ parts

$0.670

155,345

$1.210

$0.960

$0.690

$0.670

Continental Prestige Electronics

USA . 48,710 parts In-Stock

1+ parts

$1.350

100+ parts

$0.972

1k+ parts

$0.696

10k+ parts

-

48,710

$1.350

$0.972

$0.696

-

Aztec Data Supply Inc.

USA . 11,920 parts In-Stock

1+ parts

$11.498

100+ parts

-

1k+ parts

-

10k+ parts

-

11,920

$11.498

-

-

-

Authorized Procurement Solutions

USA . 8,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,000

-

-

-

-

Overview

Experience seamless connectivity and unparalleled performance with the TLE9250XLEXUMA1 by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies ensures top-notch quality and reliability in every product they offer. The TLE9250XLEXUMA1 falls under the category of Network Interfaces, making it an essential component for various applications. This cutting-edge technology not only guarantees fast and efficient data transmission but also provides exceptional value and benefits to customers looking to enhance their network systems. Upgrade your connectivity with the TLE9250XLEXUMA1 and discover a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the network interface easy to handle and long-lasting.

Surface Mount: YES

The surface mount feature allows for easy installation on circuit boards, saving time and effort.

Screening Level: AEC-Q100

This high screening level ensures reliability and quality compliance, making the product suitable for automotive applications.

Package Shape: SQUARE

The square shape allows for efficient use of space on the circuit board, making it suitable for compact designs.

No. of Terminals: 8

Having 8 terminals allows for versatile connectivity options, increasing the flexibility of the network interface.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE

This package style provides efficient heat dissipation and compact design, making it suitable for space-constrained applications.

Terminal Finish: TIN

The tin finish on terminals ensures good conductivity and corrosion resistance, improving the overall performance and longevity of the product.

Maximum Seated Height: 1.1 mm

The low seated height allows for a slim profile and efficient use of space, making it suitable for compact electronic devices.

Width: 3 mm

The compact width enables the network interface to fit easily into tight spaces, making it suitable for small electronic devices.

Length: 3 mm

The short length of the network interface allows for flexibility in placement on the circuit board, enhancing design options.

Terminal Form: NO LEAD

The no-lead terminal form is environmentally friendly and complies with RoHS regulations, making it a sustainable choice for electronic products.

Telecom IC Type: INTERFACE CIRCUIT

The network interface is designed specifically for telecom applications, ensuring optimal performance and compatibility.

Nominal Supply Voltage: 5 V

The 5V supply voltage is a standard in many electronic devices, ensuring compatibility and ease of integration with existing systems.

Terminal Pitch: 0.65 mm

The small terminal pitch allows for high-density mounting on the circuit board, maximizing connectivity options in a limited space.

Moisture Sensitivity Level (MSL): 2A

The MSL rating of 2A indicates that the network interface can withstand moderate levels of moisture, making it suitable for various environmental conditions.

Technical Specifications

Network Interfaces TLE9250XLEXUMA1 attributes and parameters. Explore more Network Interfaces devices from Infineon Technologies

Specs

JESD-30 Code:

S-PDSO-N8

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

2A

No. of Functions:

1

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE

Screening Level:

AEC-Q100

Maximum Seated Height:

1.1 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

TLE9250XLEXUMA1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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