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TLE94613ESV33XUMA1

Infineon Technologies

TLE94613ESV33XUMA1 by Infineon Technologies

Infineon's TLE94613ESV33XUMA1 is a CAN FD transceiver with 24 terminals in a small outline package. Operating at 13.5V, it has a terminal pitch of 0.65mm and AEC-Q100 screening for automotive applications. The device features gull wing terminals, measures 3.9mm x 8.65mm, and has a max seated height of 1.15mm suitable for network interfaces in compact designs.

Median Price

$2.323

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2,192 parts In-Stock

1+ parts

$0.656

100+ parts

$0.626

1k+ parts

$0.596

10k+ parts

-

2,192

$0.656

$0.626

$0.596

-

Chip1Stop

Japan . 2,900 parts In-Stock

1+ parts

$2.260

100+ parts

$1.697

1k+ parts

$1.684

10k+ parts

-

2,900

$2.260

$1.697

$1.684

-

Farnell

UK . 35,231 parts In-Stock

1+ parts

$2.310

100+ parts

$1.320

1k+ parts

$1.160

10k+ parts

-

35,231

$2.310

$1.320

$1.160

-

DigiKey

USA . 2,960 parts In-Stock

1+ parts

$3.060

100+ parts

$1.891

1k+ parts

$1.679

10k+ parts

$1.587

2,960

$3.060

$1.891

$1.679

$1.587

Newark

USA . 35,231 parts In-Stock

1+ parts

$3.100

100+ parts

$1.920

1k+ parts

$1.700

10k+ parts

-

35,231

$3.100

$1.920

$1.700

-

Mouser Electronics

USA . 2,231 parts In-Stock

1+ parts

$3.320

100+ parts

$2.030

1k+ parts

$1.790

10k+ parts

$1.730

2,231

$3.320

$2.030

$1.790

$1.730

Element14

Singapore . 35,231 parts In-Stock

1+ parts

$4.360

100+ parts

$2.700

1k+ parts

$2.400

10k+ parts

-

35,231

$4.360

$2.700

$2.400

-

Rochester

USA . 3,446 parts In-Stock

1+ parts

-

100+ parts

$1.480

1k+ parts

$1.330

10k+ parts

$1.250

3,446

-

$1.480

$1.330

$1.250

RS (Exports)

UK . 2,600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$2.336

2,600

-

-

-

$2.336

Verical

USA . 2,192 parts In-Stock

1+ parts

-

100+ parts

$0.626

1k+ parts

$0.596

10k+ parts

-

2,192

-

$0.626

$0.596

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 239 parts In-Stock

1+ parts

$1.349

100+ parts

-

1k+ parts

-

10k+ parts

-

239

$1.349

-

-

-

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$2.130

100+ parts

-

1k+ parts

-

10k+ parts

-

500

$2.130

-

-

-

Vyrian

USA . 12,368 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

12,368

-

-

-

-

NAC Semi

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$2.710

3,000

-

-

-

$2.710

Bristol Electronics

USA . 450 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

450

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 13,506 parts In-Stock

1+ parts

$1.210

100+ parts

-

1k+ parts

-

10k+ parts

-

13,506

$1.210

-

-

-

Semicontronic

India . 13,409 parts In-Stock

1+ parts

$1.210

100+ parts

$1.180

1k+ parts

$1.174

10k+ parts

-

13,409

$1.210

$1.180

$1.174

-

Corphita

USA . 358 parts In-Stock

1+ parts

$1.278

100+ parts

-

1k+ parts

-

10k+ parts

-

358

$1.278

-

-

-

Argo Parts USA

USA . 2,820 parts In-Stock

1+ parts

$2.130

100+ parts

-

1k+ parts

-

10k+ parts

-

2,820

$2.130

-

-

-

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$2.130

100+ parts

$2.087

1k+ parts

-

10k+ parts

-

1,000

$2.130

$2.087

-

-

Component Stockers USA

USA . 38,037 parts In-Stock

1+ parts

$2.840

100+ parts

$2.230

1k+ parts

$1.660

10k+ parts

$1.870

38,037

$2.840

$2.230

$1.660

$1.870

Modulus Dynamics

Lithuania . 2,247 parts In-Stock

1+ parts

$7.915

100+ parts

$7.598

1k+ parts

$7.282

10k+ parts

-

2,247

$7.915

$7.598

$7.282

-

Corohmni

South Africa . 22 parts In-Stock

1+ parts

$8.662

100+ parts

-

1k+ parts

-

10k+ parts

-

22

$8.662

-

-

-

Aztec Data Supply Inc.

USA . 2,267 parts In-Stock

1+ parts

$12.507

100+ parts

-

1k+ parts

-

10k+ parts

-

2,267

$12.507

-

-

-

Continental Prestige Electronics

USA . 35,990 parts In-Stock

1+ parts

-

100+ parts

$2.090

1k+ parts

$1.590

10k+ parts

-

35,990

-

$2.090

$1.590

-

Perfect Parts

USA . 8,959 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,959

-

-

-

-

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Eastek

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

GreenTree Electronics

Israel . 2,550 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,550

-

-

-

-

Overview

Unlock the power of seamless communication with the TLE94613ESV33XUMA1 by Infineon Technologies. Crafted with precision and expertise, this network interface device offers unparalleled reliability and performance. Whether you're in the automotive industry or require cutting-edge technology for your IoT project, this product is designed to elevate your applications to the next level. Experience the exceptional value and benefits that only Infineon Technologies can provide, and revolutionize the way you connect with the world.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection for the network interface, making it reliable for long-term use.

Surface Mount: YES

Being surface mountable makes the installation of this network interface easier and more convenient, especially in compact electronic devices.

Screening Level: AEC-Q100

Compliance with AEC-Q100 ensures high reliability and quality standards, making this network interface suitable for automotive applications where rugged performance is essential.

Nominal Supply Voltage: 13.5 V

The nominal supply voltage of 13.5 V allows for compatibility with standard power sources, ensuring reliable and stable performance in different operating conditions.

Technical Specifications

Network Interfaces TLE94613ESV33XUMA1 attributes and parameters. Explore more Network Interfaces devices from Infineon Technologies

Specs

JESD-30 Code:

R-PDSO-G24

Length:

8.65 mm

Moisture Sensitivity Level (MSL):

2A

No. of Functions:

1

No. of Terminals:

24

No. of Transceivers:

1

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.15 mm

Nominal Supply Voltage:

13.5 V

Surface Mount:

YES

Telecom IC Type:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

TLE94613ESV33XUMA1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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