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DP83826IRHBR

Texas Instruments

DP83826IRHBR by Texas Instruments

DP83826IRHBR by Texas Instruments is an Ethernet transceiver with a data rate of 100000 Mbps. It operates at a nominal voltage of 3.3V and has a max supply current of 53 mA. This network interface IC is suitable for industrial applications requiring high-speed data transmission.

Median Price

$1.760

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 34,249 parts In-Stock

1+ parts

$1.602

100+ parts

$1.323

1k+ parts

$0.715

10k+ parts

-

34,249

$1.602

$1.323

$0.715

-

Mouser Electronics

USA . 9,233 parts In-Stock

1+ parts

$2.930

100+ parts

$1.800

1k+ parts

$1.670

10k+ parts

$1.530

9,233

$2.930

$1.800

$1.670

$1.530

DigiKey

USA . 6,118 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$1.760

6,118

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-

-

$1.760

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 870 parts In-Stock

1+ parts

$1.099

100+ parts

-

1k+ parts

-

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870

$1.099

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-

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Digiode

USA . 831 parts In-Stock

1+ parts

$1.522

100+ parts

-

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831

$1.522

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Component Sense

UK . 62,008 parts In-Stock

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-

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62,008

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Chip Stock

USA . 34,840 parts In-Stock

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34,840

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Cyclops Electronics Ltd

UK . 33,564 parts In-Stock

1+ parts

-

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33,564

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Vyrian

USA . 17,725 parts In-Stock

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-

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17,725

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Greenchips

USA . 2,968 parts In-Stock

1+ parts

-

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2,968

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 6,489 parts In-Stock

1+ parts

$1.099

100+ parts

-

1k+ parts

-

10k+ parts

$1.077

6,489

$1.099

-

-

$1.077

Argo Parts USA

USA . 4,068 parts In-Stock

1+ parts

$1.099

100+ parts

-

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4,068

$1.099

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Corphita

USA . 3,719 parts In-Stock

1+ parts

$1.442

100+ parts

-

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10k+ parts

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3,719

$1.442

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Ampacity Inc.

Singapore . 17,892 parts In-Stock

1+ parts

$2.960

100+ parts

-

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17,892

$2.960

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Semicontronic

India . 16,989 parts In-Stock

1+ parts

$2.960

100+ parts

$2.886

1k+ parts

$2.871

10k+ parts

-

16,989

$2.960

$2.886

$2.871

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Parana Technologies

USA . 640 parts In-Stock

1+ parts

$13.026

100+ parts

-

1k+ parts

$13.522

10k+ parts

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640

$13.026

-

$13.522

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ChromeModa Solutions

Germany . 387 parts In-Stock

1+ parts

$14.636

100+ parts

$12.002

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-

10k+ parts

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387

$14.636

$12.002

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IDEA Electronic Components Group

UK . 81 parts In-Stock

1+ parts

$14.636

100+ parts

$13.904

1k+ parts

$13.172

10k+ parts

-

81

$14.636

$13.904

$13.172

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Advanced Electronics

New Zealand . 25 parts In-Stock

1+ parts

$15.997

100+ parts

$15.197

1k+ parts

$15.197

10k+ parts

-

25

$15.997

$15.197

$15.197

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Corohmni

South Africa . 1,090 parts In-Stock

1+ parts

$17.409

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1,090

$17.409

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Lixinc

USA . 19,699 parts In-Stock

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19,699

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A-Z Elektronik GmbH

Germany . 6,000 parts In-Stock

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6,000

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iodParts Technologies Inc.

India . 2,882 parts In-Stock

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2,882

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DigiPath Technology Company

USA . 1,322 parts In-Stock

1+ parts

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$13.196

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1,322

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$13.196

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$1.077

1k+ parts

$1.044

10k+ parts

$1.022

1,000

-

$1.077

$1.044

$1.022

Futuretech Components

Singapore . 300 parts In-Stock

1+ parts

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300

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Overview

Experience unparalleled network connectivity with the DP83826IRHBR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-quality products that are built to last. With its innovative design and cutting-edge technology, this network interface offers seamless connection and unmatched performance. Suitable for a wide range of applications, the DP83826IRHBR is perfect for data centers, industrial automation, and telecommunications. Experience enhanced network efficiency and reliability with this superior product. Upgrade your network infrastructure today and unlock the full potential of your connectivity solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body enhances the product's durability and resistance to environmental factors, making it a reliable choice for network interfaces.

Surface Mount: YES

The surface mount feature enables easy installation and integration into various electronic devices, increasing the convenience and flexibility of using this network interface product.

No. of Functions: 1

With a single function, this network interface simplifies the design and implementation process, ensuring efficient and streamlined operations.

Package Shape: SQUARE

The square package shape allows for efficient utilization of space, enabling compact designs of electronic devices that require network interfaces.

No. of Terminals: 32

The abundance of terminals ensures compatibility with various connection requirements, providing versatility and adaptability in network interface applications.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The chip carrier package style, combined with a heat sink/slug and a very thin profile, enables effective heat dissipation and compact design, making this product suitable for space-constrained environments.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature limit, this network interface can withstand demanding conditions, ensuring reliable performance even in harsh environments with elevated temperatures.

Minimum Operating Temperature: -40 °C

The wide range of minimum operating temperature tolerance allows this network interface to function reliably in extremely cold conditions, providing versatility and resilience.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish enhances conductivity and corrosion resistance, ensuring reliable and long-lasting connections in diverse network interface applications.

Terminal Position: QUAD

The quad terminal position allows for efficient and secure connections, ensuring stable and dependable network interface performance.

Maximum Seated Height: 1 mm

With a maximum seated height of 1 mm, this network interface offers compactness in design and allows for effective space utilization in electronic devices.

Width: 5 mm

The compact width of 5 mm enables this network interface to fit seamlessly into various electronic devices with limited space, offering flexibility in design options.

Maximum Time At Peak Reflow Temperature (s): 30

The product's ability to withstand the peak reflow temperature for a maximum of 30 seconds ensures reliable soldering during the manufacturing process, facilitating efficient production.

Peak Reflow Temperature °C: 260

This network interface's peak reflow temperature of 260°C ensures thorough and precise soldering, resulting in durable connections and high-quality manufacturing.

Length: 5 mm

The compact length of 5 mm further contributes to the product's suitability for applications that require space-efficient network interfaces, enabling versatility in design choices.

Temperature Grade: INDUSTRIAL

By being categorized as an industrial-grade product, this network interface is capable of withstanding rugged environmental conditions, making it a reliable choice for industrial applications.

Terminal Form: NO LEAD

The no-lead terminal form enhances the product's compatibility with lead-free soldering processes, ensuring compliance with environmental regulations and offering reliability in production.

No. of Transceivers: 1

With a single transceiver, this network interface simplifies design and integration processes, offering efficient and streamlined communication capabilities.

Maximum Supply Current: 53 mA

The maximum supply current of 53 mA ensures efficient power consumption, contributing to energy-saving and sustainable network interface operations.

Telecom IC Type: ETHERNET TRANSCEIVER

As an Ethernet transceiver, this product offers reliable and high-speed data transmission capabilities, making it a suitable choice for various telecommunications applications.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V provides compatibility with common voltage requirements, facilitating seamless integration of this network interface into various electronic devices.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5 mm, this network interface allows for precise connections and compatibility with devices that have specific spacing requirements, offering versatility in design choices.

Data Rate: 100000 Mbps

With a high data rate of 100,000 Mbps, this network interface facilitates rapid and efficient data transfer, making it ideal for applications that demand fast and reliable network connections.

Moisture Sensitivity Level (MSL): 1

The moisture sensitivity level of 1 ensures that the product can withstand moisture exposure during transportation and storage, guaranteeing its performance and reliability.

Technical Specifications

Network Interfaces DP83826IRHBR attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

Data Rate:

100000 Mbps

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

32

No. of Transceivers:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Current:

53 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

DP83826IRHBR Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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