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DP83848IVVX

Texas Instruments

DP83848IVVX by Texas Instruments

DP83848IVVX by Texas Instruments is an Ethernet transceiver with 48 terminals in a square package. Operating temperature ranges from -40 to 85°C, suitable for industrial use. It features CMOS technology, GULL WING terminal form, and requires a nominal voltage of 3.3V.

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Vyrian

USA . 3,364 parts In-Stock

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Digiode

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Nova Conductors

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Advanced Electronics

New Zealand . 350 parts In-Stock

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$10.385

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$9.866

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$9.866

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$10.385

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Corohmni

South Africa . 383 parts In-Stock

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$10.482

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AZTECH Wire

Italy . 292 parts In-Stock

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Parana Technologies

USA . 1,855 parts In-Stock

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$15.716

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$16.082

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DigiPath Technology Company

USA . 206 parts In-Stock

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$17.305

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ChromeModa Solutions

Germany . 3,846 parts In-Stock

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$17.658

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$14.480

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IDEA Electronic Components Group

UK . 465 parts In-Stock

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$17.658

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$16.775

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$15.892

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Semicontronic

India . 808 parts In-Stock

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$79.950

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$79.540

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Ampacity Inc.

Singapore . 1,580 parts In-Stock

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One Stop Electronics

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iodParts Technologies Inc.

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Perfect Parts

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Lixinc

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A-Z Elektronik GmbH

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Alle Elektronik GmbH

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Continental Prestige Electronics

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GreenTree Electronics

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Corphita

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Argo Parts USA

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Modulus Dynamics

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Bastille Electronics

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Overview

Unlock seamless and reliable network connectivity with the Texas Instruments DP83848IVVX Ethernet transceiver. Known for its top-notch quality and cutting-edge technology, Texas Instruments delivers a product that exceeds expectations in the network interfaces category. Designed for industrial-grade applications, this Ethernet transceiver offers high performance in a compact package. Experience the value of seamless communication and enhanced efficiency with the DP83848IVVX, providing unparalleled reliability and connectivity for your networking needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide durability and resistance to damage, making this product suitable for long-term use in various conditions.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Package Shape: SQUARE

The square shape of the package helps in optimizing space on the circuit board, ensuring efficient use of available area.

No. of Terminals: 48

Having 48 terminals allows for multiple connections and functionalities, making this product versatile and suitable for complex networking setups.

Package Style: FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch design of the package enhances connectivity and signal transmission efficiency, ensuring high performance in networking applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product can withstand high temperatures, making it reliable in demanding environments.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures down to -40°C ensures this product's functionality in a wide range of temperature conditions.

Terminal Position: QUAD

The quad terminal position allows for efficient connectivity and signal transmission, enhancing performance in networking applications.

Maximum Seated Height: 1.6 mm

The low maximum seated height of 1.6 mm helps in reducing the overall profile of the product, making it suitable for compact devices and space-constrained environments.

Width: 7 mm

The width of 7 mm provides a compact form factor, allowing for easy integration into various electronic devices and circuit boards.

Length: 7 mm

With a length of 7 mm, this product offers a balanced size for seamless integration and efficient use of space on the circuit board.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this product can withstand harsh operating conditions and ensure reliable performance in rugged environments.

Technology: CMOS

CMOS technology offers low power consumption and high-speed operation, making this product energy-efficient and suitable for high-performance networking applications.

Terminal Form: GULL WING

The gull wing terminal form allows for easy soldering and secure connections, enhancing the reliability and durability of the product in networking setups.

Telecom IC Type: ETHERNET TRANSCEIVER

Being an Ethernet transceiver, this product facilitates fast and efficient data transmission over network connections, ensuring reliable communication in networking applications.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3 V, this product ensures compatibility with standard power sources, making it easy to integrate into existing systems.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5 mm, this product offers precise and secure connections, optimizing signal transmission and reducing the risk of electrical interference.

Technical Specifications

Network Interfaces DP83848IVVX attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Maximum Seated Height:

1.6 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

DP83848IVVX Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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