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DP83867IRRGZT

Texas Instruments

DP83867IRRGZT by Texas Instruments

DP83867IRRGZT by Texas Instruments is an Ethernet transceiver with 1.1V supply voltage, 1000000 Mbps data rate, and operates in industrial temperature range. It comes in a square chip carrier package with 48 terminals for surface mount applications. Ideal for high-speed network interfaces requiring reliable performance in harsh environments.

Median Price

$7.923

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

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Texas Instruments

USA . 49,222 parts In-Stock

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$7.923

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$6.459

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$4.306

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Chip1Stop

Japan . 280 parts In-Stock

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$10.227

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$7.470

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$5.624

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$10.227

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Arrow

USA . 8,000 parts In-Stock

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$4.725

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DigiKey

USA . 1,459 parts In-Stock

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$5.662

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$5.662

RS (Exports)

UK . 167 parts In-Stock

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$7.934

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Verical

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Nova Conductors

Japan . 15 parts In-Stock

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$7.075

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Digiode

USA . 1,339 parts In-Stock

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$7.527

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Chip Stock

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Vyrian

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Martec Srl

Italy . 768 parts In-Stock

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ComSIT Distribution GmbH

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ComSIT USA

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Bristol Electronics

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Sensible Micro Corp

USA . 423 parts In-Stock

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$10.969

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Semtec, LLC

USA . 50 parts In-Stock

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SPM Sales

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Semicontronic

India . 8,673 parts In-Stock

1+ parts

$4.860

100+ parts

$4.738

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$4.714

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8,673

$4.860

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$4.714

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Ampacity Inc.

Singapore . 8,544 parts In-Stock

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$4.860

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Continental Prestige Electronics

USA . 2,027 parts In-Stock

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$7.075

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$6.933

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Netroflash

USA . 100 parts In-Stock

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$7.075

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Corphita

USA . 240 parts In-Stock

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$7.131

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$7.131

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Parana Technologies

USA . 1,431 parts In-Stock

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$10.737

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$11.220

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DigiPath Technology Company

USA . 1,533 parts In-Stock

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$11.823

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$10.877

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ChromeModa Solutions

Germany . 3,389 parts In-Stock

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$12.064

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$9.892

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IDEA Electronic Components Group

UK . 2,239 parts In-Stock

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$11.461

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$10.858

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Corohmni

South Africa . 976 parts In-Stock

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Advanced Electronics

New Zealand . 350 parts In-Stock

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Modulus Dynamics

Lithuania . 2,762 parts In-Stock

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Microchip USA

USA . 3,500 parts In-Stock

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$20.810

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Lixinc

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Authorized Procurement Solutions

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Perfect Parts

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Argo Parts USA

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A-Z Elektronik GmbH

Germany . 1,859 parts In-Stock

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Robosynatics

Brazil . 1,297 parts In-Stock

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$14.490

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$14.195

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Lucentia Tech

USA . 1,297 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,239 parts In-Stock

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GreenTree Electronics

Israel . 1,050 parts In-Stock

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Futuretech Components

Singapore . 500 parts In-Stock

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Allen Electronics Distributors

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iodParts Technologies Inc.

India . 117 parts In-Stock

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$6.838

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Overview

Enhance your network interfaces with the DP83867IRRGZT by Texas Instruments. Manufactured with top-notch quality and reliability, this product offers exceptional performance and durability. Ideal for a wide range of applications, this Ethernet transceiver provides seamless connectivity and fast data rates of up to 1Gbps. With its innovative design and advanced features, customers can enjoy the value, benefits, and advantages of a superior networking solution. Upgrade your systems today with the DP83867IRRGZT and experience unmatched quality and performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material makes the product lightweight and durable, ideal for use in various networking applications.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on circuit boards, saving time and effort during production.

Power Supplies (V): 1.1, 1.8, 2.5

The multiple power supply options provide flexibility in voltage requirements, making it compatible with a wide range of systems.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, the product can withstand demanding environmental conditions and ensure reliable performance.

Data Rate: 1000000 Mbps

With a high data rate of 1000000 Mbps, this network interface can handle large volumes of data quickly and efficiently, perfect for high-speed networking applications.

Technical Specifications

Network Interfaces DP83867IRRGZT attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

Data Rate:

1000000 Mbps

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

No. of Transceivers:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.1,1.8,2.5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Network Interfaces

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

DP83867IRRGZT Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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