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TJA1050T/H/V,118

NXP Semiconductors

TJA1050T/H/V,118 by NXP Semiconductors

NXP Semiconductors' TJA1050T/H/V,118 is a Network Interface with 1 Mbps Data Rate and 5 V Nominal Voltage. It features CMOS Technology, -40 to 125 °C Operating Temperature Range, and is ideal for automotive applications due to its small outline package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,869 parts In-Stock

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Digiode

USA . 1,119 parts In-Stock

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1,119

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Anansix

USA . 255 parts In-Stock

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255

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Nova Conductors

Japan . 75 parts In-Stock

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75

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Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$7.039

100+ parts

$6.687

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$6.687

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100

$7.039

$6.687

$6.687

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Aztec Data Supply Inc.

USA . 324 parts In-Stock

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$8.830

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324

$8.830

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AZTECH Wire

Italy . 360 parts In-Stock

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$9.263

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360

$9.263

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Microchip USA

USA . 116 parts In-Stock

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$11.558

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$11.558

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Corohmni

South Africa . 85 parts In-Stock

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$15.746

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$15.746

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One Stop Electronics

USA . 801 parts In-Stock

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$32.000

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801

$32.000

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Ampacity Inc.

Singapore . 771 parts In-Stock

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$135.000

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771

$135.000

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Semicontronic

India . 832 parts In-Stock

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$785.000

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$765.375

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$761.450

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832

$785.000

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$761.450

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UNI Independent Distributors

Spain . 3,214 parts In-Stock

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Corphita

USA . 2,113 parts In-Stock

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Continental Prestige Electronics

USA . 1,718 parts In-Stock

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Argo Parts USA

USA . 537 parts In-Stock

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Bastille Electronics

Australia . 200 parts In-Stock

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200

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Overview

Elevate your network interfaces with the TJA1050T/H/V,118 by NXP Semiconductors. Designed with precision and reliability in mind, this automotive-grade interface circuit offers unparalleled performance for a range of applications. With a small outline package style and durable plastic/epoxy material, this product ensures seamless integration and long-lasting functionality. Trust NXP Semiconductors to deliver top-notch quality and cutting-edge technology. Upgrade your systems today and experience the difference with the TJA1050T/H/V,118.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides lightweight and durable construction, making it suitable for various network interface applications.

Surface Mount: YES

Enables easy and convenient installation on circuit boards, saving time and effort during assembly.

Power Supplies (V): 5

Operates at a standard voltage level, ensuring compatibility with most systems and reducing the need for additional power conversion.

Maximum Operating Temperature: 125 °C

Offers a wide temperature range for reliable performance in different environmental conditions, especially in automotive applications.

Data Rate: 1 Mbps

Supports high-speed data transfer, making it ideal for efficient network communication and data exchange.

Technical Specifications

Network Interfaces TJA1050T/H/V,118 attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

Data Rate:

1 Mbps

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

.075 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

TJA1050T/H/V,118 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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