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SN65HVD231QDRQ1

Texas Instruments

SN65HVD231QDRQ1 by Texas Instruments

SN65HVD231QDRQ1 by Texas Instruments is a BICMOS technology interface circuit with 1 channel and a data rate of 1 Mbps. It operates at a nominal voltage of 3.3V and is suitable for automotive applications.

Median Price

$2.352

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 11,470 parts In-Stock

1+ parts

$1.864

100+ parts

$1.539

1k+ parts

$0.832

10k+ parts

-

11,470

$1.864

$1.539

$0.832

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DigiKey

USA . 434 parts In-Stock

1+ parts

$2.840

100+ parts

$1.739

1k+ parts

$1.611

10k+ parts

-

434

$2.840

$1.739

$1.611

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Mouser Electronics

USA . 333 parts In-Stock

1+ parts

$2.840

100+ parts

$1.740

1k+ parts

$1.580

10k+ parts

$1.460

333

$2.840

$1.740

$1.580

$1.460

Rochester

USA . 1 parts In-Stock

1+ parts

-

100+ parts

$1.200

1k+ parts

$1.070

10k+ parts

$1.010

1

-

$1.200

$1.070

$1.010

Distributors (In-Stock)

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Digiode

USA . 4,260 parts In-Stock

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$1.102

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4,260

$1.102

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Nova Conductors

Japan . 700 parts In-Stock

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$1.760

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700

$1.760

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Vyrian

USA . 6,262 parts In-Stock

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6,262

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LWI Electronics Inc

India . 5 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 6,185 parts In-Stock

1+ parts

$0.990

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-

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6,185

$0.990

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Semicontronic

India . 6,086 parts In-Stock

1+ parts

$0.990

100+ parts

$0.965

1k+ parts

$0.960

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6,086

$0.990

$0.965

$0.960

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Corphita

USA . 3,623 parts In-Stock

1+ parts

$1.044

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3,623

$1.044

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Continental Prestige Electronics

USA . 5,685 parts In-Stock

1+ parts

$1.691

100+ parts

-

1k+ parts

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$1.657

5,685

$1.691

-

-

$1.657

Argo Parts USA

USA . 4,980 parts In-Stock

1+ parts

$1.691

100+ parts

-

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4,980

$1.691

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-

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Bastille Electronics

Australia . 300 parts In-Stock

1+ parts

$1.760

100+ parts

$1.672

1k+ parts

$1.588

10k+ parts

$1.566

300

$1.760

$1.672

$1.588

$1.566

Corohmni

South Africa . 51 parts In-Stock

1+ parts

$6.864

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-

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51

$6.864

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Advanced Electronics

New Zealand . 270 parts In-Stock

1+ parts

$11.521

100+ parts

$10.945

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$10.945

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270

$11.521

$10.945

$10.945

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Parana Technologies

USA . 1,161 parts In-Stock

1+ parts

$15.873

100+ parts

-

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$16.229

10k+ parts

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1,161

$15.873

-

$16.229

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IDEA Electronic Components Group

UK . 944 parts In-Stock

1+ parts

$17.835

100+ parts

$16.943

1k+ parts

$16.052

10k+ parts

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944

$17.835

$16.943

$16.052

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ChromeModa Solutions

Germany . 870 parts In-Stock

1+ parts

$17.835

100+ parts

$14.625

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870

$17.835

$14.625

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iodParts Technologies Inc.

India . 25,000 parts In-Stock

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GreenTree Electronics

Israel . 5,000 parts In-Stock

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Lixinc

USA . 2,236 parts In-Stock

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DigiPath Technology Company

USA . 919 parts In-Stock

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$16.080

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919

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$16.080

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Robosynatics

Brazil . 100 parts In-Stock

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Lucentia Tech

USA . 100 parts In-Stock

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$1.596

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$1.596

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$1.596

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$1.596

$1.596

$1.596

Infinite Electronics LLP (Excess)

. 38 parts In-Stock

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Overview

Experience superior network connectivity with the SN65HVD231QDRQ1 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality products that exceed expectations. Designed for automotive applications, this network interface offers incredible value and numerous advantages. With its small outline package style and dual terminal position, it is ideal for space-constrained environments. Enjoy seamless data transmission at 1 Mbps, ensuring smooth communication across your network. Trust Texas Instruments to provide reliable, high-performance solutions for all your networking needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy construction of the package body ensures durability and reliability, making it a great choice for long-lasting network interfaces.

Surface Mount: YES

The ability to be surface mounted makes installation and integration easier, allowing for efficient use and integration of the network interfaces.

No. of Functions: 1

With a single function, this network interface simplifies implementation and avoids unnecessary complexity, making it a user-friendly choice.

Screening Level: AEC-Q100

Meeting the AEC-Q100 screening level demonstrates the high quality and reliability of this network interface, ensuring it is suitable for demanding automotive applications.

Package Shape: RECTANGULAR

The rectangular package shape offers convenient and versatile mounting options, allowing for easy integration into various systems and setups.

Power Supplies (V): 3.3

The 3.3V power supply ensures compatibility with most systems and helps to reduce power consumption, making it an energy-efficient choice.

No. of Terminals: 8

With 8 terminals, this network interface provides sufficient connectivity options for reliable data transfer and communication.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves valuable space while maintaining performance, making it ideal for applications with size constraints.

Maximum Operating Temperature: 125 °C

The network interface's high maximum operating temperature allows it to withstand demanding and extreme conditions, ensuring reliable operation even in harsh environments.

Minimum Operating Temperature: -40 °C

The network interface's low minimum operating temperature enables it to function in cold environments, providing flexibility and reliability in diverse conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of nickel, palladium, and gold as terminal finish materials ensures corrosion resistance, reliability, and long-term performance, making it a dependable choice for network interfaces.

Terminal Position: DUAL

Dual terminal position offers flexibility in system design and board layout, simplifying integration and enabling efficient data transmission.

Maximum Seated Height: 1.75 mm

The low seated height of 1.75mm allows for compact and space-saving installations, making it suitable for devices with size restrictions.

Width: 3.9 mm

The narrow width of 3.9mm helps to save board space, enabling efficient use of limited real estate in electronic systems.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, this network interface withstands the soldering process during assembly, ensuring reliable connections and robust performance.

Length: 4.9 mm

The compact length of 4.9mm contributes to space optimization, facilitating the integration of the network interface into various system designs.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this network interface delivers the high performance and reliability required in demanding automotive environments.

No. of Channels: 1

With 1 channel, this network interface provides a single pathway for data transmission, simplifying configuration and implementation.

Technology: BICMOS

The use of bipolar complementary metal-oxide-semiconductor (BiCMOS) technology combines the advantages of both bipolar and CMOS technologies, resulting in improved performance and power efficiency for the network interface.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and ensures secure connections, enhancing the overall reliability and durability of the network interface.

No. of Transceivers: 1

Featuring 1 transceiver, this network interface provides reliable and efficient bidirectional communication between connected devices.

Maximum Supply Current: 0.017 mA

With a low maximum supply current, this network interface minimizes power consumption and contributes to energy efficiency.

Telecom IC Type: INTERFACE CIRCUIT

Classified as an interface circuit telecom IC type, this network interface is specifically designed to ensure seamless and reliable communication within telecom systems.

Nominal Supply Voltage: 3.3 V

With a nominal supply voltage of 3.3V, this network interface is compatible with standard voltage levels, facilitating integration and operation in various systems.

Terminal Pitch: 1.27 mm

The 1.27mm terminal pitch allows for easy and accurate connections, ensuring reliable data transfer and enhancing overall performance.

Data Rate: 1 Mbps

With a data rate of 1 Mbps, this network interface enables fast and efficient data transmission, making it suitable for a wide range of applications.

Moisture Sensitivity Level (MSL): 1

The MSL 1 rating indicates that this network interface has a low moisture sensitivity, making it highly durable and resistant to moisture-related damage.

Technical Specifications

Network Interfaces SN65HVD231QDRQ1 attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

Data Rate:

1 Mbps

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

.017 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

SN65HVD231QDRQ1 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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