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TJA1042T/3/1U

NXP Semiconductors

TJA1042T/3/1U by NXP Semiconductors

NXP Semiconductors' TJA1042T/3/1U is an automotive-grade network interface IC with 8 terminals, operating from -40 to 125°C. It features a small outline package, Gull Wing terminals, and supports a 5V supply voltage. Ideal for interface circuits in automotive applications due to its robust design and high-temperature tolerance.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,282 parts In-Stock

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Digiode

USA . 1,498 parts In-Stock

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Anansix

USA . 1,188 parts In-Stock

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Nova Conductors

Japan . 450 parts In-Stock

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450

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Aztec Data Supply Inc.

USA . 4,996 parts In-Stock

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$8.690

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Microchip USA

USA . 106 parts In-Stock

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$10.171

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106

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Advanced Electronics

New Zealand . 100 parts In-Stock

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$10.339

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$9.822

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$9.822

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100

$10.339

$9.822

$9.822

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Corohmni

South Africa . 1,125 parts In-Stock

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$11.711

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AZTECH Wire

Italy . 288 parts In-Stock

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$12.490

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One Stop Electronics

USA . 897 parts In-Stock

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$179.000

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897

$179.000

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Semicontronic

India . 134 parts In-Stock

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$414.000

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$403.650

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$401.580

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134

$414.000

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$401.580

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Ampacity Inc.

Singapore . 1,522 parts In-Stock

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$498.000

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Continental Prestige Electronics

USA . 5,437 parts In-Stock

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Corphita

USA . 3,120 parts In-Stock

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UNI Independent Distributors

Spain . 2,777 parts In-Stock

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Argo Parts USA

USA . 2,689 parts In-Stock

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Vigor

Singapore . 2,105 parts In-Stock

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Bastille Electronics

Australia . 900 parts In-Stock

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900

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Overview

Discover the seamless connectivity and reliable performance of the TJA1042T/3/1U by NXP Semiconductors. As a leading manufacturer in the industry, NXP delivers top-quality network interfaces designed for automotive applications. With its robust construction and efficient design, this product offers customers unmatched value and benefits. Trust NXP for superior products that meet your connectivity needs with precision and ease. Elevate your automotive projects with the TJA1042T/3/1U today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability, making the product suitable for various environmental conditions.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards.

Package Shape: RECTANGULAR

Rectangular shape enables efficient use of space on the circuit board.

No. of Terminals: 8

Having 8 terminals allows for connectivity to multiple devices or circuits, increasing versatility.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliable performance even in harsh conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures the product can function in cold environments.

Nominal Supply Voltage: 5 V

5V supply voltage is a common standard in many applications, ensuring compatibility.

Technical Specifications

Network Interfaces TJA1042T/3/1U attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.75 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

TJA1042T/3/1U Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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