Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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TLE9261BQXV33XUMA1 by Infineon is a CAN FD transceiver with 5 Mbps data rate, operating at -40 to 150°C. It has 48 terminals in a square chip carrier package suitable for automotive applications meeting AEC-Q100 standards. With low supply current of 6.5 mA and nominal voltage of 13.5 V, it's ideal for network interfaces in harsh environments.
Median Price
$2.570
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13
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1k+
Farnell
1+ parts
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$1.470
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$1.320
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DigiKey
$4.040
$2.510
$2.234
Element14
$4.055
$2.976
$2.136
Mouser Electronics
$1.720
RS (Exports)
$4.411
$3.980
Verical
$1.975
Rochester
$1.670
$1.500
$1.410
Digiode
$1.872
Nova Conductors
$2.910
Chip Stock
Cyclops Electronics Ltd
Vyrian
Semtec, LLC
Semicontronic
$1.370
$1.336
$1.329
Ampacity Inc.
Corphita
$1.773
Aranea Global
$2.852
$2.738
Argo Parts USA
Advanced Electronics
$2.966
Aztec Data Supply Inc.
$10.200
Modulus Dynamics
$13.418
$12.881
$12.345
Corohmni
$16.610
Microchip USA
$18.890
$18.770
$18.710
$18.650
Perfect Parts
QUARKTWIN TECHNOLOGY LTD
Authorized Procurement Solutions
Continental Prestige Electronics
$1.850
$1.450
The use of plastic/epoxy material in the package body makes the product durable and resistant to impact, making it suitable for long-term use in various environments.
Being surface mountable allows for easy and efficient integration into circuit boards, saving space and simplifying the assembly process.
Conformance to AEC-Q100 standard ensures high reliability and quality, making this product ideal for automotive applications where robustness is crucial.
With a high maximum operating temperature of 150°C, this product can withstand elevated temperatures without compromising performance, suitable for demanding industrial applications.
The nominal supply voltage of 13.5 V provides a stable power source for consistent operation, ensuring reliable communication in network interfaces.
Network Interfaces TLE9261BQXV33XUMA1 attributes and parameters. Explore more Network Interfaces devices from Infineon Technologies
Data Rate:
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Maximum Operating Temperature:
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TLE9261BQXV33XUMA1 Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Packaging - Mult Dev Cover Tape Chg 13/Jul/2022
Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.
CEO
Jochen Hanebeck
Chief Financial Officer
Sven Schneider
Chief Marketing Officer
Andreas Urschitz
Villach 300mm
Fabrication
Fab Initiation
2011
Austria
Villach
Wafer Capacity
11,000
Kulim 2
2016
Malaysia
Kulim
79,500
Dresden - Module 3
1999
Germany
Dresden
58,000
Villach Building
2,000
Regensburg
1986
60,000
Dresden 200 - Module 1
1995
28,000
Dresden 200 - Module 2
1996
Building 38
2005
500
Building 47
Kulim 1
2006
110,000
Mesa Facility
1990
USA
Mesa
3,000
Villach 150mm
1981
35,000
Villach 200mm
68,000
Temecula
30,000
2021
2018
5,000
Kulim 3
2024
Fab 25
Austin
31,000
Dresden - Module 4
2026
LM358M
Raytheon Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
2N7002
Motorola
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Package Body Material: PLASTIC/EPOXY; Qualification: Not Qualified; Minimum Operating Temperature: -55 Cel;
SS14
Taiwan Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Panjit International
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Time At Peak Reflow Temperature (s): 40; Minimum DS Breakdown Voltage: 60 V;
SMBJ18CA
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Wuxi Xuyang Electronic
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
DS18B20Z+
Analog Devices
DS18B20Z+ by Analog Devices is a 12-bit temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, with ±0.5°C accuracy. Suitable for applications requiring digital output and surface mounting feature.
BAV99
Hitano Enterprise
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Surge Components
261
New England Microwave
Other Interface ICs; No. of Terminals: 14; Package Equivalence Code: FL14(UNSPEC); Power Supplies (V): +-5,-15; Package Body Material: PLASTIC/EPOXY; Surface Mount: YES;
1552200253
Molex
WIRE AND CABLE;
Goodwork Semiconductor
NE555D
NXP Semiconductors
SQUARE; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: LSOP; Package Shape: RECTANGULAR; Surface Mount: YES;
2N2222A
Loras Industries
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
B340A-13-F
SPC TECHNOLOGY/ MULTICOMP
LL4148
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
National Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Package Style (Meter): SMALL OUTLINE; Terminal Position: DUAL;
USB3320C-EZK-TR
Standard Microsystems
INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
MBR0530T1G
Onsemi
MBR0530T1G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.375V and output current of 0.5A. It operates b/w -65°C to 125°C, making it suitable for applications requiring high-speed switching in compact electronic devices like smartphones and tablets. The package style is small outline with gull wing terminals for surface mount assembly.
Rectron
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; Package Shape: ROUND;
SN65HVD232D
Texas Instruments
SN65HVD232D by Texas Instruments is a BICMOS technology interface circuit with 1Mbps data rate, suitable for industrial applications. It operates at 3.3V, has 8 terminals in a small outline package style, and can withstand temperatures from -40 to 85°C. Ideal for network interfaces requiring low supply current and high reliability.
KSZ8081MNXCA
Micrel
ETHERNET TRANSCEIVER; Temperature Grade: COMMERCIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
ADM3050EBRIZ-RL
ADM3050EBRIZ-RL by Analog Devices is a Network Interface with 8 terminals, operating from -40 to 125°C. It features a small outline package style, Gull Wing terminal form, and supports MIL-STD-1553 data bus transceiver applications in automotive environments.
KSZ8995M
LAN SWITCHING CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 128; Package Code: FQFP; Package Shape: RECTANGULAR;
SN65HVD230D
SN65HVD230D by Texas Instruments is a BICMOS technology interface circuit with 1Mbps data rate, operating at -40 to 85°C. It features 8 terminals in a small outline package suitable for industrial applications requiring a 3.3V power supply and minimal current consumption of 0.017mA.
KSZ8081RNBCA-TR
TCAN1042HDRBTQ1
TCAN1042HDRBTQ1 by Texas Instruments is an Ethernet transceiver with a data rate of 2 Mbps. It operates b/w -55 to 125 °C, suitable for military applications. This small outline package has 8 terminals and is AEC-Q100 compliant, making it ideal for automotive network interfaces.
MAX3051ESA
Maxim Integrated
MAX3051ESA by Maxim Integrated is a network interface IC with 8 terminals, operating at 3.3V. It features a data rate of 1 Mbps and is ideal for industrial applications requiring an interface circuit. The small outline package with gull wing terminals makes it suitable for surface mount designs in harsh environments.
RN131G-I/RM
Microchip Technology
Microchip Technology's RN131G-I/RM is a surface mount network interface with 44 terminals. It operates b/w -30°C to 85°C, with a seated height of 3.5mm and nominal voltage of 3.3V. Ideal for LAN switching circuits, it has a compact rectangular package style measuring 20mm in width and 37mm in length.
TCAN337GDCNT
TCAN337GDCNT by Texas Instruments is a network interface IC with 8 terminals, operating temperature range of -40 to 125°C, and data rate of 5 Mbps. It is ideal for automotive applications requiring a small outline package with low profile and shrink pitch design. The IC features nickel palladium gold terminal finish and gull wing terminal form for reliable performance in telecom interfaces.
WJLXT971ALE.A4-857343
Cortina Systems
Cortina Systems' WJLXT971ALE.A4-857343 is a 64-terminal Ethernet transceiver with 100 Mbps data rate, operating at 3.3V. This CMOS technology device has a low profile flatpack package suitable for industrial applications, with temperature range from -40 to 85°C. It features gull wing terminals and quad terminal position for surface mount assembly.
MCP2551T-I/SNG
MCP2551T-I/SNG by Microchip: CAN transceiver, 1 Mbps data rate, 5V supply voltage. Ideal for industrial applications requiring network interfaces. Small outline package with dual terminals and matte tin finish.
TCAN1051HGVDRQ1
TCAN1051HGVDRQ1 by Texas Instruments is a network interface IC with 8 terminals, operating temperature range of -55 to 125°C, and data rate of 5 Mbps. It is designed for automotive applications requiring AEC-Q100 screening, featuring small outline package style and Gull Wing terminal form. With a supply voltage of 5V and max supply current of 180mA, it provides reliable interface circuitry in harsh environments.
Inphi
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE;
KSZ9131RNXV-VAO
KSZ9131RNXV-VAO by Microchip: Ethernet transceiver with 1000 Mbps data rate, operates at -40 to 105 °C, in industrial settings. Features quad terminals, matte tin finish, and AEC-Q100 screening for automotive applications. Package style is chip carrier with very thin profile.
TJA1051T/3,112
NXP Semiconductors' TJA1051T/3,112 is a CAN transceiver with 5V supply voltage and 1Mbps data rate. It operates in automotive grade temperatures (-40 to 125°C) and has AEC-Q100 screening. With a small outline package style, it features dual terminals for surface mount applications.
TCAN337DCNT
TCAN337DCNT by Texas Instruments is a network interface IC with 8 terminals, operating temperature range of -40 to 125°C, and supply voltage of 3.3V. It is ideal for automotive applications requiring a data rate of 1 Mbps, featuring a small outline package style and dual terminal position for compact designs.
KSZ8721BL-TR
KSZ8721BL-TR by Microchip: Ethernet transceiver with 100 Mbps data rate, CMOS technology, and 2.5V supply voltage. Ideal for network interfaces in commercial-grade applications due to its low profile flatpack design and TS 16949 screening level.
AR8031-AL1B-R
Qualcomm Atheros
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;
SN65HVD232QDRG4Q1
SN65HVD232QDRG4Q1 by Texas Instruments is a BICMOS technology interface circuit with 8 terminals, operating at 3.3V and supporting data rates up to 1 Mbps. Designed for automotive applications, it has a wide temperature range from -40°C to 125°C and AEC-Q100 screening level for reliability.
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TLE9251VSJXUMA1
Infineon Technologies
TLE9251VSJXUMA1 by Infineon Technologies is a network interface IC with 8 terminals and a small outline package style. It operates at a nominal voltage of 5V and has a max seated height of 1.73mm. This IC is commonly used in telecom applications for interface circuit purposes.
TLE9252VLCXUMA1
INTERFACE CIRCUIT; Terminal Finish: TIN; Moisture Sensitivity Level (MSL): 2A; JESD-609 Code: e3;
TLE9252VSKXUMA1
TLE9252VSKXUMA1 by Infineon is a CAN FD transceiver with 5 Mbps data rate, AEC-Q100 screening, and 5V supply voltage. Ideal for automotive applications due to its small outline package and operating temperature range of -40 to 150°C.
TLE9255WSKXUMA2
TLE9255WSKXUMA2 by Infineon Technologies is a small outline network interface IC with 14 terminals, GULL WING form, and 1.27mm pitch. It operates at 5V nominal voltage and AEC-Q100 screening level suitable for automotive applications. The package dimensions are 4mm x 8.75mm x 1.75mm, making it ideal for compact designs in the automotive industry.
TLE9251VLEXUMA1
TLE9251VLEXUMA1 by Infineon is an AEC-Q100 compliant interface circuit with 8 terminals, 5V supply voltage, and 0.65mm terminal pitch. It is designed for automotive applications requiring a small outline package with heat sink, suitable for surface mount assembly. The IC's compact size of 3x3mm and low seated height of 1.1mm make it ideal for space-constrained environments in vehicles.
TLE9255WLCXUMA1
TLE9255WLCXUMA1 by Infineon Technologies is a network interface IC with 14 terminals, AEC-Q100 screening level, and 5V nominal voltage. It is designed for automotive applications requiring a small outline package with surface mount capability and dual terminal position.
TLE9250XLEXUMA1
TLE9250XLEXUMA1 by Infineon is an AEC-Q100 compliant interface circuit with 8 terminals, 0.65mm pitch, and 5V supply voltage. Its small outline package makes it suitable for automotive applications requiring a compact design and high reliability in harsh environments. The no-lead terminal form and thin profile enhance space efficiency while ensuring robust performance.
TLE9250XSJXUMA1
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Finish: NICKEL GOLD PALLADIUM;
TLE9250VSJXUMA1
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
TLE9250SJXUMA1
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE;
TLE9250LEXUMA1
TLE9250LEXUMA1 by Infineon is an AEC-Q100 compliant interface circuit with 8 terminals, 5V supply voltage, and 0.65mm terminal pitch. It is a small outline package suitable for automotive applications requiring network interfaces. The IC features a square shape, tin finish, and thin profile design for space-constrained installations.
TLE9251VSJXUMA1/SAMPLE
INTERFACE CIRCUIT;
TLE9250VLEXUMA1
TLE9250VLEXUMA1 by Infineon is an AEC-Q100 compliant interface circuit with 8 terminals, small outline package style, and tin terminal finish. It operates at a nominal voltage of 5V and has a terminal pitch of 0.65mm. Ideal for automotive applications requiring network interfaces in compact spaces.
TLE92613BQXXUMA1
CAN FD TRANSCEIVER; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Terminal Position: QUAD;
TLE9261BQXXUMA1
CAN FD TRANSCEIVER; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Maximum Supply Current: 6.5 mA;
TLE94613ESV33XUMA1
CAN FD TRANSCEIVER; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: HTSSOP; Package Shape: RECTANGULAR; Package Equivalence Code: TSSOP24,.25;
TLE9351VSJXTMA1
CAN FD TRANSCEIVER; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; JESD-30 Code: R-PDSO-G8;
TLE92613BQXV33XUMA1
CAN FD TRANSCEIVER; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Terminal Pitch: .5 mm;
TLE9271QXV33XUMA1
CAN FD TRANSCEIVER; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Package Equivalence Code: LCC48,.27SQ,20;
Supply Digital Components
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