Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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TLE9251VSJXUMA1 by Infineon Technologies is a network interface IC with 8 terminals and a small outline package style. It operates at a nominal voltage of 5V and has a max seated height of 1.73mm. This IC is commonly used in telecom applications for interface circuit purposes.
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The use of plastic/epoxy material makes this product lightweight, durable, and ideal for various networking applications.
The surface mount feature allows for easy and efficient installation, saving time and effort during assembly.
With a single function, this product ensures simplicity and reliability in network interface applications.
The AEC-Q100 screening level provides high-quality manufacturing standards, ensuring excellent performance and reliability in automotive and other demanding environments.
The rectangular shape allows for compact and efficient packaging and placement of the network interface in various electronic devices.
With 8 terminals, this product provides sufficient connectivity options for seamless integration into network systems.
The small outline package style allows for space-efficient design and easy integration into compact electronic devices.
The use of nickel gold palladium terminal finish ensures excellent conductivity, corrosion resistance, and long-term reliability.
The dual terminal position enhances flexibility and ease of connection during installation and integration.
With a low maximum seated height, this product helps optimize space utilization in electronic assemblies.
The compact width of 3.94 mm facilitates easy integration into space-constrained electronic systems.
The optimal length of 4.93 mm allows for efficient placement and integration of the network interface in various electronic devices.
The gull wing terminal form provides secure and reliable solder connections, ensuring long-lasting performance.
This product, classified as an interface circuit telecom IC type, enables seamless and efficient communication between different devices and networks.
With a nominal supply voltage of 5 V, this product ensures compatibility with standard power sources commonly used in networking applications.
The terminal pitch of 1.27 mm allows for reliable connection and compatibility with various electronic devices and circuit boards.
With an MSL of 2A, this product is resistant to moisture and can withstand normal handling and assembly processes, ensuring long-term reliability.
Network Interfaces TLE9251VSJXUMA1 attributes and parameters. Explore more Network Interfaces devices from Infineon Technologies
JESD-30 Code:
Length:
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Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Screening Level:
Maximum Seated Height:
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Telecom IC Type:
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TLE9251VSJXUMA1 Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Design/Specification - Mult Dev DS Chg 8/Nov/2019
PCN Packaging - Mult Dev Cover Tape Chg 13/Jul/2022 Mult Dev Label Chgs 11/Jan/2018
Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.
CEO
Jochen Hanebeck
Chief Financial Officer
Sven Schneider
Chief Marketing Officer
Andreas Urschitz
Villach 300mm
Fabrication
Fab Initiation
2011
Austria
Villach
Wafer Capacity
11,000
Kulim 2
2016
Malaysia
Kulim
79,500
Dresden - Module 3
1999
Germany
Dresden
58,000
Villach Building
2,000
Regensburg
1986
60,000
Dresden 200 - Module 1
1995
28,000
Dresden 200 - Module 2
1996
Building 38
2005
500
Building 47
Kulim 1
2006
110,000
Mesa Facility
1990
USA
Mesa
3,000
Villach 150mm
1981
35,000
Villach 200mm
68,000
Temecula
30,000
2021
2018
5,000
Kulim 3
2024
Fab 25
Austin
31,000
Dresden - Module 4
2026
SS14
Micro Commercial Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
M39029/56-351
Glenair
CONNECTOR ACCESSORY; Associated Backshell Military - Specifications: MIL-DTL-38999; Material: COPPER ALLOY; Associated Military - Specifications: MIL-DTL-38999; Contact Gender: FEMALE; DIN Conformity: NO;
LM358AN
NXP Semiconductors
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
USB3320C-EZK-TR
Microchip Technology
Microchip Technology's USB3320C-EZK-TR is a Bus Controller IC with 32 terminals, operating at 1.6-2V. It supports USB bus compatibility, clock frequency up to 60MHz, and CMOS technology. Ideal for applications requiring Universal Serial Bus peripherals in compact designs with low power consumption.
SMBJ18CA
Pro-an Electronic
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Clamping Voltage: 29.2 V; Polarity: BIDIRECTIONAL; Nominal Breakdown Voltage: 21.05 V; Maximum Repetitive Peak Reverse Voltage: 18 V;
LM555CN
National Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
BAV99
General Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Taiwan Semiconductor
STM32H750VBT6
STMicroelectronics
STM32H750VBT6 by STMicroelectronics is a 32-bit microcontroller with Cortex-M7 CPU, offering 20 timers and 16 DMA channels. It features 2 DAC and 16 ADC channels, suitable for industrial applications requiring high-speed processing up to 48 MHz. With extensive connectivity options like FDCAN, Ethernet, and USB, it provides versatile solutions in a compact package.
NE555/D
General Electric Solid State
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; Maximum Operating Temperature: 70 Cel; Technology: BIPOLAR; Package Equivalence Code: DIE OR CHIP; Qualification: Not Qualified;
1N4148
Dc Components
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Continental Device India
Meritek Electronics
Eic Semiconductor
08055C104KAT4A
KYOCERA AVX
08055C104KAT4A by KYOCERA AVX is a ceramic capacitor with 0.1uF capacitance, rated for 50V. With X7R temperature characteristics and -55 to 125 °C operating range, it's ideal for SMT applications requiring compact size and high reliability. The wraparound terminals and multi-layer design make it suitable for various electronic circuits.
AH180-WG-7
Diodes Incorporated
AH180-WG-7 by Diodes Inc. is a magnetic field sensor with 1.5mT hysteresis, 0.30V output range, and 9mA max operating current. Ideal for applications requiring non-inverting analog voltage output in a compact rectangular package suitable for surface mount installations.
EPCS4SI8N
Intel
EPCS4SI8N by Intel is a small outline flash memory with 512Kx8 organization, operating at 3.3V. It features a max clock frequency of 40MHz and endurance of 100k write/erase cycles. Ideal for industrial applications requiring configuration memory with serial interface and low standby current consumption.
M39029/56351
Esterline Technologies
CONNECTOR ACCESSORY; IEC Conformity: NO; Contact Gender: FEMALE; DIN Conformity: NO; MIL-Connector Accessory Name: CONTACT; Tool Settings: M22520/2-10;
NUP2105LT1G
Onsemi
NUP2105LT1G by Onsemi is a Transient Suppression Device with 350W power dissipation, 29.1V breakdown voltage, and 44V clamping voltage. Commonly used in electronic circuits for surge protection due to its bidirectional polarity and silicon diode element material.
MBRS140T3G
MBRS140T3G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.6V and max output current of 1A. It operates b/w -65°C to 125°C, making it suitable for various applications requiring high-speed switching and low power loss in a small outline package style. The diode's matte tin terminal finish and dual position terminals enhance its performance in surface mount configurations.
TLE9255WSKXUMA2
Infineon Technologies
TLE9255WSKXUMA2 by Infineon Technologies is a small outline network interface IC with 14 terminals, GULL WING form, and 1.27mm pitch. It operates at 5V nominal voltage and AEC-Q100 screening level suitable for automotive applications. The package dimensions are 4mm x 8.75mm x 1.75mm, making it ideal for compact designs in the automotive industry.
LAN8710AI-EZK-TR
LAN8710AI-EZK-TR by Microchip is a 32-terminal Ethernet transceiver with 100 Mbps data rate, operating at -40 to 85 °C. It features a 3.3V power supply, matte tin finish, and square package shape suitable for industrial applications requiring network interfaces.
DP83848HSQ/NOPB
Texas Instruments
DP83848HSQ/NOPB by Texas Instruments is an Ethernet transceiver with 100000 Mbps data rate. It operates at -40 to 125 °C, suitable for automotive applications. This CMOS technology IC has a terminal pitch of 0.5 mm and comes in a square chip carrier package style.
RTL8211FI-CG
Realtek Semiconductor
Realtek's RTL8211FI-CG is a 40-terminal Ethernet transceiver with a square chip carrier package. Operating in industrial temperatures from -40 to 85°C, it has a low profile of 0.9mm and terminal pitch of 0.4mm. Ideal for telecom applications requiring reliable network interfaces in compact spaces.
LTC2875IS8#TRPBF
Analog Devices
LTC2875IS8#TRPBF by Analog Devices is a BICMOS technology interface circuit with 8 terminals, operating from -40 to 85°C. It has a small outline package style, matte tin finish, and nominal voltage of 3.3V. Ideal for network interfaces in industrial telecom applications.
KSZ8721BLI-TR
Microchip Technology's KSZ8721BLI-TR is an Ethernet transceiver with 100 Mbps data rate. It operates in industrial temperature range (-40 to 85 °C) and has a supply voltage of 2.5 V. With a flatpack, low profile package style, it is suitable for network interfaces in various applications.
SN65HVD230DR
SN65HVD230DR by Texas Instruments is a BICMOS technology interface circuit with 1Mbps data rate, suitable for industrial applications. It operates at 3.3V, has 8 terminals in a small outline package, and can withstand temperatures from -40 to 85°C.
PCA82C251T/N3
Philips Semiconductors
CAN TRANSCEIVER; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
TLE72593GEXUMA3
TLE72593GEXUMA3 by Infineon is an 8-terminal interface circuit with a nominal voltage of 8V. It features a small outline package style, gull wing terminal form, and AEC-Q100 screening level. Ideal for network interfaces in automotive applications due to its compact size and surface-mount capability.
KSZ8081RNAIA-TR
KSZ8081RNAIA-TR by Microchip is a 24-terminal Ethernet transceiver with 100 Mbps data rate, operating at -40 to 85°C. It features a square chip carrier package style, matte tin finish, and very thin profile for industrial applications requiring reliable network interfaces.
KSZ8895MQXCA
Micrel
ETHERNET TRANSCEIVER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 128; Package Code: FQFP; Package Shape: RECTANGULAR;
MCP2551T-I/SNG
MCP2551T-I/SNG by Microchip: CAN transceiver, 1 Mbps data rate, 5V supply voltage. Ideal for industrial applications requiring network interfaces. Small outline package with dual terminals and matte tin finish.
MCP251863T-E/SSVAO
CAN FD TRANSCEIVER;
KSZ8795CLXIC
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 80; Package Code: LFQFP; Package Shape: SQUARE;
TJA1041AT/CM,118
NXP Semiconductors' TJA1041AT/CM,118 is a 14-terminal network interface with 5V supply voltage and 1Mbps data rate. It features AEC-Q100 screening level for automotive applications. The IC is designed in CMOS technology, suitable for telecom interface circuits in compact designs.
14450R-500
Adesto Technologies
Network Interfaces;
MAX14882AWE+T
Maxim Integrated
INTERFACE CIRCUIT; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 1; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30; Terminal Finish: MATTE TIN;
MCP2562T-E/SN
MCP2562T-E/SN by Microchip: CAN transceiver for automotive apps. Operates at 1 Mbps, 5V supply voltage, and -40 to 125°C temp range. Small outline package with 8 terminals, matte tin finish, and TS16949 screening level.
DP83869HMRGZT
DP83869HMRGZT by Texas Instruments is an Ethernet transceiver with a data rate of 1 Gbps. It operates in automotive-grade temperatures from -40 to 125°C. The package style is chip carrier, suitable for network interfaces in harsh environments.
PCA82C250T
PCA82C250T by Philips Semiconductors is a CAN transceiver with 1 transceiver. It operates at a nominal voltage of 5V and has a temperature range of -40 to 125°C. This network interface IC is commonly used in automotive applications.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
TLE9252VLCXUMA1
INTERFACE CIRCUIT; Terminal Finish: TIN; Moisture Sensitivity Level (MSL): 2A; JESD-609 Code: e3;
TLE9252VSKXUMA1
TLE9252VSKXUMA1 by Infineon is a CAN FD transceiver with 5 Mbps data rate, AEC-Q100 screening, and 5V supply voltage. Ideal for automotive applications due to its small outline package and operating temperature range of -40 to 150°C.
TLE9251VLEXUMA1
TLE9251VLEXUMA1 by Infineon is an AEC-Q100 compliant interface circuit with 8 terminals, 5V supply voltage, and 0.65mm terminal pitch. It is designed for automotive applications requiring a small outline package with heat sink, suitable for surface mount assembly. The IC's compact size of 3x3mm and low seated height of 1.1mm make it ideal for space-constrained environments in vehicles.
TLE9255WLCXUMA1
TLE9255WLCXUMA1 by Infineon Technologies is a network interface IC with 14 terminals, AEC-Q100 screening level, and 5V nominal voltage. It is designed for automotive applications requiring a small outline package with surface mount capability and dual terminal position.
TLE9250XLEXUMA1
TLE9250XLEXUMA1 by Infineon is an AEC-Q100 compliant interface circuit with 8 terminals, 0.65mm pitch, and 5V supply voltage. Its small outline package makes it suitable for automotive applications requiring a compact design and high reliability in harsh environments. The no-lead terminal form and thin profile enhance space efficiency while ensuring robust performance.
TLE9250XSJXUMA1
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Finish: NICKEL GOLD PALLADIUM;
TLE9250VSJXUMA1
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
TLE9250SJXUMA1
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE;
TLE9250LEXUMA1
TLE9250LEXUMA1 by Infineon is an AEC-Q100 compliant interface circuit with 8 terminals, 5V supply voltage, and 0.65mm terminal pitch. It is a small outline package suitable for automotive applications requiring network interfaces. The IC features a square shape, tin finish, and thin profile design for space-constrained installations.
TLE9251VSJXUMA1/SAMPLE
INTERFACE CIRCUIT;
TLE9250VLEXUMA1
TLE9250VLEXUMA1 by Infineon is an AEC-Q100 compliant interface circuit with 8 terminals, small outline package style, and tin terminal finish. It operates at a nominal voltage of 5V and has a terminal pitch of 0.65mm. Ideal for automotive applications requiring network interfaces in compact spaces.
TLE92613BQXXUMA1
CAN FD TRANSCEIVER; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Terminal Position: QUAD;
TLE9261BQXV33XUMA1
CAN FD TRANSCEIVER; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Minimum Operating Temperature: -40 Cel;
TLE9261BQXXUMA1
CAN FD TRANSCEIVER; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Maximum Supply Current: 6.5 mA;
TLE94613ESV33XUMA1
CAN FD TRANSCEIVER; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: HTSSOP; Package Shape: RECTANGULAR; Package Equivalence Code: TSSOP24,.25;
TLE9351VSJXTMA1
CAN FD TRANSCEIVER; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; JESD-30 Code: R-PDSO-G8;
TLE92613BQXV33XUMA1
CAN FD TRANSCEIVER; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Terminal Pitch: .5 mm;
TLE9271QXV33XUMA1
CAN FD TRANSCEIVER; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Package Equivalence Code: LCC48,.27SQ,20;
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