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PCA82C250TD

NXP Semiconductors

PCA82C250TD by NXP Semiconductors

PCA82C250TD by NXP Semiconductors is an 8-terminal interface circuit with a nominal voltage of 5V. It operates in automotive-grade temperature range from -40 to 125°C, suitable for network interfaces. The package style is small outline, surface mountable, with terminal finish in nickel palladium gold.

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Digiode

USA . 3,420 parts In-Stock

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Bristol Electronics

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Atlantic Semiconductor

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Anansix

USA . 1,786 parts In-Stock

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Vyrian

USA . 529 parts In-Stock

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Goldney Electronics S.L.

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ACDS - Activité Composants Distribution Service

France . 89 parts In-Stock

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Legend Electronics Inc.

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Elcom Components

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 37 parts In-Stock

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PC Components Company LLC

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Velocity Electronics

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Nova Conductors

Japan . 10 parts In-Stock

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GSS - Global Semi Support

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Mentor Electronics Marketing, LLC

USA . 5 parts In-Stock

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NAC Semi

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Connector Distribution Corp

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Right Parts Inc.

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Aztec Data Supply Inc.

USA . 196 parts In-Stock

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$6.810

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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$7.768

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$7.380

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Corohmni

South Africa . 663 parts In-Stock

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AZTECH Wire

Italy . 617 parts In-Stock

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One Stop Electronics

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Semicontronic

India . 700 parts In-Stock

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$669.000

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$652.275

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Ampacity Inc.

Singapore . 550 parts In-Stock

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Continental Prestige Electronics

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Corphita

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Benley Electronics

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Argo Parts USA

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Modulus Dynamics

Lithuania . 550 parts In-Stock

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Bastille Electronics

Australia . 500 parts In-Stock

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Brazil . 500 parts In-Stock

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Lucentia Tech

USA . 500 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 89 parts In-Stock

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Glotronic Ltd.

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Overview

The PCA82C250TD by NXP Semiconductors is a top-of-the-line network interface designed to deliver superior performance and reliability. With a focus on quality, NXP Semiconductors ensures that their products meet the highest standards in the industry. This versatile component is perfect for a wide range of applications in automotive and telecommunications, offering customers unmatched value and benefits. Trust NXP Semiconductors to provide innovative solutions that will take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and resistance to corrosion, making the product suitable for various environments.

Surface Mount: YES

Surface mount technology allows for easier assembly and more efficient use of PCB space.

No. of Terminals: 8

Having 8 terminals allows for more connections and versatility in network setups.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures stable performance even in demanding conditions.

Telecom IC Type: INTERFACE CIRCUIT

Designed specifically for interfacing with telecom networks, ensuring reliable communication and data transfer.

Nominal Supply Voltage: 5 V

Operating at a nominal 5V supply voltage makes it compatible with standard power sources in network setups.

Technical Specifications

Network Interfaces PCA82C250TD attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

PCA82C250TD Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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