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TLE92613BQXXUMA1

Infineon Technologies

TLE92613BQXXUMA1 by Infineon Technologies

TLE92613BQXXUMA1 by Infineon is a CAN FD transceiver with 48 terminals, operating at 5 Mbps data rate and 13.5 V supply voltage. It has AEC-Q100 screening level for automotive applications, with -40 to 150 °C temperature range. Suitable for network interfaces in automotive electronics due to its compact chip carrier package style.

Median Price

$2.063

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 4,415 parts In-Stock

1+ parts

$2.900

100+ parts

$2.620

1k+ parts

$2.210

10k+ parts

$2.100

4,415

$2.900

$2.620

$2.210

$2.100

Rochester

USA . 4,188 parts In-Stock

1+ parts

-

100+ parts

$1.840

1k+ parts

$1.650

10k+ parts

$1.550

4,188

-

$1.840

$1.650

$1.550

Verical

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.063

10k+ parts

$1.938

2,500

-

-

$2.063

$1.938

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 221 parts In-Stock

1+ parts

$2.755

100+ parts

-

1k+ parts

-

10k+ parts

-

221

$2.755

-

-

-

Nova Conductors

Japan . 90 parts In-Stock

1+ parts

$3.630

100+ parts

-

1k+ parts

-

10k+ parts

-

90

$3.630

-

-

-

Vyrian

USA . 4,367 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,367

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 4,260 parts In-Stock

1+ parts

$2.460

100+ parts

$2.398

1k+ parts

$2.386

10k+ parts

-

4,260

$2.460

$2.398

$2.386

-

Ampacity Inc.

Singapore . 4,203 parts In-Stock

1+ parts

$2.460

100+ parts

-

1k+ parts

-

10k+ parts

-

4,203

$2.460

-

-

-

Corphita

USA . 284 parts In-Stock

1+ parts

$2.610

100+ parts

-

1k+ parts

-

10k+ parts

-

284

$2.610

-

-

-

Continental Prestige Electronics

USA . 5,095 parts In-Stock

1+ parts

$3.630

100+ parts

-

1k+ parts

-

10k+ parts

$3.557

5,095

$3.630

-

-

$3.557

Argo Parts USA

USA . 4,054 parts In-Stock

1+ parts

$3.630

100+ parts

-

1k+ parts

-

10k+ parts

-

4,054

$3.630

-

-

-

Netroflash

USA . 100 parts In-Stock

1+ parts

$3.630

100+ parts

$3.557

1k+ parts

-

10k+ parts

-

100

$3.630

$3.557

-

-

Aztec Data Supply Inc.

USA . 734 parts In-Stock

1+ parts

$7.529

100+ parts

-

1k+ parts

-

10k+ parts

-

734

$7.529

-

-

-

Advanced Electronics

New Zealand . 122 parts In-Stock

1+ parts

$10.628

100+ parts

$10.521

1k+ parts

$10.096

10k+ parts

-

122

$10.628

$10.521

$10.096

-

Modulus Dynamics

Lithuania . 864 parts In-Stock

1+ parts

$12.162

100+ parts

$11.676

1k+ parts

$11.189

10k+ parts

-

864

$12.162

$11.676

$11.189

-

Corohmni

South Africa . 244 parts In-Stock

1+ parts

$12.907

100+ parts

-

1k+ parts

-

10k+ parts

-

244

$12.907

-

-

-

Microchip USA

USA . 2,693 parts In-Stock

1+ parts

$20.687

100+ parts

-

1k+ parts

-

10k+ parts

-

2,693

$20.687

-

-

-

Perfect Parts

USA . 11,200 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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11,200

-

-

-

-

iodParts Technologies Inc.

India . 900 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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900

-

-

-

-

Overview

Transform your network interfaces with the TLE92613BQXXUMA1 from Infineon Technologies. With a commitment to quality and reliability, Infineon continues to innovate in the field of automotive electronics. This CAN FD transceiver offers unparalleled performance and efficiency, making it ideal for a wide range of applications. Experience the benefits of seamless communication, high data rates, and robust design. Upgrade your systems today with the TLE92613BQXXUMA1 and discover the difference that top-tier technology can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for use in various applications.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving time and effort.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high reliability and performance, making the product suitable for automotive applications.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, the product can withstand extended use in demanding environments.

Nominal Supply Voltage: 13.5 V

The nominal supply voltage of 13.5V provides stable power for reliable operation.

Data Rate: 5 Mbps

The high data rate of 5 Mbps enables fast and efficient data transfer, improving overall performance.

Technical Specifications

Network Interfaces TLE92613BQXXUMA1 attributes and parameters. Explore more Network Interfaces devices from Infineon Technologies

Specs

Data Rate:

5 Mbps

JESD-30 Code:

S-PQCC-N48

Length:

7 mm

No. of Functions:

1

No. of Terminals:

48

No. of Transceivers:

1

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Screening Level:

AEC-Q100

Maximum Seated Height:

.9 mm

Maximum Supply Current:

6.5 mA

Nominal Supply Voltage:

13.5 V

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

TLE92613BQXXUMA1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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