Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
TLE92613BQXXUMA1 by Infineon is a CAN FD transceiver with 48 terminals, operating at 5 Mbps data rate and 13.5 V supply voltage. It has AEC-Q100 screening level for automotive applications, with -40 to 150 °C temperature range. Suitable for network interfaces in automotive electronics due to its compact chip carrier package style.
Median Price
$2.063
Lifecycle Status
Suppliers In-Stock
6
In-Stock Inventory
1k+
Mouser Electronics
1+ parts
$2.900
100+ parts
$2.620
1k+ parts
$2.210
10k+ parts
$2.100
Rochester
-
$1.840
$1.650
$1.550
Verical
$1.938
Digiode
$2.755
Nova Conductors
$3.630
Vyrian
Semicontronic
$2.460
$2.398
$2.386
Ampacity Inc.
Corphita
$2.610
Continental Prestige Electronics
$3.557
Argo Parts USA
Netroflash
Aztec Data Supply Inc.
$7.529
Advanced Electronics
$10.628
$10.521
$10.096
Modulus Dynamics
$12.162
$11.676
$11.189
Corohmni
$12.907
Microchip USA
$20.687
Perfect Parts
iodParts Technologies Inc.
The use of plastic/epoxy material makes the product lightweight and durable, ideal for use in various applications.
Allows for easy and convenient installation on circuit boards, saving time and effort.
AEC-Q100 screening ensures high reliability and performance, making the product suitable for automotive applications.
With a high maximum operating temperature, the product can withstand extended use in demanding environments.
The nominal supply voltage of 13.5V provides stable power for reliable operation.
The high data rate of 5 Mbps enables fast and efficient data transfer, improving overall performance.
Network Interfaces TLE92613BQXXUMA1 attributes and parameters. Explore more Network Interfaces devices from Infineon Technologies
Data Rate:
JESD-30 Code:
Length:
No. of Functions:
No. of Terminals:
No. of Transceivers:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Screening Level:
Maximum Seated Height:
Maximum Supply Current:
Nominal Supply Voltage:
Surface Mount:
Telecom IC Type:
Terminal Form:
Terminal Pitch:
Terminal Position:
Width:
TLE92613BQXXUMA1 Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Packaging - Mult Dev Cover Tape Chg 13/Jul/2022
Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.
CEO
Jochen Hanebeck
Chief Financial Officer
Sven Schneider
Chief Marketing Officer
Andreas Urschitz
Villach 300mm
Fabrication
Fab Initiation
2011
Austria
Villach
Wafer Capacity
11,000
Kulim 2
2016
Malaysia
Kulim
79,500
Dresden - Module 3
1999
Germany
Dresden
58,000
Villach Building
2,000
Regensburg
1986
60,000
Dresden 200 - Module 1
1995
28,000
Dresden 200 - Module 2
1996
Building 38
2005
500
Building 47
Kulim 1
2006
110,000
Mesa Facility
1990
USA
Mesa
3,000
Villach 150mm
1981
35,000
Villach 200mm
68,000
Temecula
30,000
2021
2018
5,000
Kulim 3
2024
Fab 25
Austin
31,000
Dresden - Module 4
2026
2N2222A
M/a-com Technology Solutions
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Terminal Position: BOTTOM; Package Style (Meter): CYLINDRICAL;
Aeroflex/metelics
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Package Shape: ROUND; Transistor Application: SWITCHING;
BAV99
Bytesonic Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LM107H/883
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Technology: BIPOLAR;
DRV5053VAQLPG
Texas Instruments
Texas Instruments DRV5053VAQLPG is a magnetic field sensor with 2.5-38V supply voltage range, -40 to 125°C operating temperature, and 0-2V output. Ideal for applications requiring Hall effect sensors like automotive, industrial automation, and robotics due to its compact size (1.52" x 4mm) and high output current capability of 2.3A.
SS14
Fairchild Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM2675M-ADJ/NOPB
LM2675M-ADJ/NOPB by Texas Instruments is a voltage-mode switching regulator with 1A output current, 37V max output voltage, and 260kHz max switching frequency. Ideal for automotive applications due to its -40°C to 125°C operating temperature range and compact small outline package design.
MBRS3200T3G
Onsemi
MBRS3200T3G by Onsemi is a Schottky rectifier diode with a max output current of 3A and a max forward voltage of 0.59V. It operates in temperatures ranging from -65°C to 175°C, making it suitable for power applications. The diode has a peak repetitive reverse voltage of 200V and is designed for surface mount installation in electronic circuits.
SMBJ18CA
Lite-on Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
Vishay Siliconix
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; No. of Elements: 1; Terminal Form: GULL WING; Qualification: Not Qualified;
BSS138
NXP Semiconductors
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; No. of Terminals: 3; Maximum Drain Current (ID): .2 A; Operating Mode: ENHANCEMENT MODE;
International Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.1 V; Maximum Repetitive Peak Reverse Voltage: 18 V; Polarity: BIDIRECTIONAL;
1N4148
Grande Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LM358AN
Signetics
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
LM555CMX
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
LM317T
STMicroelectronics
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; JESD-30 Code: R-XSFM-T3; Minimum Input-Output Voltage Differential: 3 V;
ISO1050DUBR
ISO1050DUBR by Texas Instruments is a network interface IC with 8 terminals, operating from -55 to 105°C. It features a small outline package, nickel palladium gold finish, and gull wing terminal form. Ideal for telecom applications requiring a 5V supply voltage and peak reflow temperature of 260°C.
Jgd Semiconductors
RECTIFIER DIODE; Surface Mount: YES; Maximum Reverse Recovery Time: .006 us; Maximum Repetitive Peak Reverse Voltage: 70 V; Maximum Forward Voltage (VF): 1 V; Maximum Operating Temperature: 150 Cel;
General Semiconductor
Silicon Standard
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: NO; Maximum Power Dissipation (Abs): .225 W; Maximum Drain-Source On Resistance: 7.5 ohm; Transistor Element Material: SILICON;
LTC2875MPDD#PBF
Analog Devices
LTC2875MPDD#PBF by Analog Devices is a BICMOS technology interface circuit with 8 terminals, operating from -55 to 125°C. It features matte tin finish, small outline package style, and is suitable for telecom applications requiring a 3.3V supply voltage in military-grade temperature environments.
LAN8740A-EN-TR
Standard Microsystems
ETHERNET TRANSCEIVER; Temperature Grade: COMMERCIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
KSZ8895MQXIA
Micrel
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 128; Package Code: FQFP; Package Shape: RECTANGULAR;
TCAN332GD
TCAN332GD by Texas Instruments is an automotive-grade network interface IC with 8 terminals, operating from -40 to 125°C. It supports a data rate of 5 Mbps at a supply voltage of 3.3 V, making it ideal for telecom applications requiring high-speed interface circuits.
LAN8742-CZ-TR
Microchip Technology
LAN8742-CZ-TR by Microchip: 3.3V supply, 100 Mbps data rate, quad terminal position. Telecom IC for Ethernet transceiver with square package shape and 24 terminals. Ideal for network interfaces in commercial applications.
SN65HVD231D
SN65HVD231D by Texas Instruments is a BICMOS technology interface circuit with 1Mbps data rate. It operates at 3.3V, has 8 terminals, and can withstand industrial temperatures. Ideal for network interfaces in applications requiring small outline packages and surface mount capabilities.
TJA1050T/VM,518
NXP Semiconductors' TJA1050T/VM,518 is a Network Interface IC with 1Mbps data rate and 5V supply voltage. It features CMOS technology, operates in automotive temperature grade (-40 to 125°C), and has a small outline package style. Ideal for interface circuits in automotive applications due to its low power consumption of 0.075mA.
KSZ9031RNXVA
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;
AR8033-AL1A-R
Qualcomm
Qualcomm's AR8033-AL1A-R is a network interface chip with 48 terminals and a square package shape. It operates at temperatures ranging from 0 to 70 °C and has a data rate of 1000 Mbps. This Ethernet transceiver is commonly used in commercial applications requiring high-speed networking capabilities.
TCAN1042HGVDR
TCAN1042HGVDR by Texas Instruments is an Ethernet transceiver with 5 Mbps data rate, operating at -55 to 125 °C. It has a small outline package style, 8 terminals, and requires 180 mA supply current. Ideal for military-grade telecom applications due to its nickel palladium gold finish and gull wing terminal form.
MCP2562FD-E/MF
MCP2562FD-E/MF by Microchip is a CAN FD transceiver with 8 Mbps data rate, operating at -40 to 125°C. It has 70 mA supply current, suitable for automotive applications due to TS16949 screening and small outline package style.
TJA1052IT/2
NXP Semiconductors' TJA1052IT/2 is a network interface IC with 16 terminals, operating at 1 Mbps data rate and 5V nominal voltage. Designed for automotive applications, it has AEC-Q100 screening level and operates b/w -40 to 125°C.
MAX3051ESA+T
Analog Devices' MAX3051ESA+T is a BICMOS technology network interface IC with 8 terminals, operating at 3.3V. It offers a data rate of 1 Mbps and is ideal for industrial applications requiring interface circuitry in small outline packages.
RTL8367N-VB-CG
Realtek Semiconductor
Network Interfaces;
KSZ8081MNXIA
KSZ8081MNXIA by Microchip is an Ethernet transceiver IC with 100 Mbps data rate, operating at -40 to 85°C. It features a 32-terminal chip carrier package suitable for network interfaces, meeting TS 16949 screening standards. Ideal for industrial applications requiring a compact design and low power consumption.
TJA1051T/3/1J
NXP Semiconductors' TJA1051T/3/1J is a CAN transceiver with 8 terminals, operating at 5V and 1Mbps data rate. It has a temperature range of -40 to 125°C, suitable for automotive applications. The small outline package measures 4.9mm x 3.9mm x 1.75mm and supports surface mount assembly.
DP83848KSQ/NOPB
DP83848KSQ/NOPB by Texas Instruments is a 3.3V Ethernet transceiver with 100000 Mbps data rate. It operates in industrial temperature range (-40 to 85 °C) and has AEC-Q100 screening level for automotive applications. This square-shaped chip carrier package has 40 terminals, 0.5mm pitch, and is surface mountable.
AR8035-AL1A-R
Qualcomm's AR8035-AL1A-R is an Ethernet transceiver with 1000 Mbps data rate, operating at 0-70°C. It features a square chip carrier package with 48 terminals and a very thin profile. Ideal for network interfaces in commercial applications due to its low supply current and compact size.
LAN8742AI-CZ
LAN8742AI-CZ by Microchip is an Ethernet transceiver with 100 Mbps data rate. It operates at -40 to 85 °C, suitable for industrial use. The chip carrier package has 24 terminals in a square shape, making it ideal for network interfaces.
TLE9250XLEXUMA1
Infineon Technologies
TLE9250XLEXUMA1 by Infineon is an AEC-Q100 compliant interface circuit with 8 terminals, 0.65mm pitch, and 5V supply voltage. Its small outline package makes it suitable for automotive applications requiring a compact design and high reliability in harsh environments. The no-lead terminal form and thin profile enhance space efficiency while ensuring robust performance.
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TLE9251VSJXUMA1
TLE9251VSJXUMA1 by Infineon Technologies is a network interface IC with 8 terminals and a small outline package style. It operates at a nominal voltage of 5V and has a max seated height of 1.73mm. This IC is commonly used in telecom applications for interface circuit purposes.
TLE9252VLCXUMA1
INTERFACE CIRCUIT; Terminal Finish: TIN; Moisture Sensitivity Level (MSL): 2A; JESD-609 Code: e3;
TLE9252VSKXUMA1
TLE9252VSKXUMA1 by Infineon is a CAN FD transceiver with 5 Mbps data rate, AEC-Q100 screening, and 5V supply voltage. Ideal for automotive applications due to its small outline package and operating temperature range of -40 to 150°C.
TLE9255WSKXUMA2
TLE9255WSKXUMA2 by Infineon Technologies is a small outline network interface IC with 14 terminals, GULL WING form, and 1.27mm pitch. It operates at 5V nominal voltage and AEC-Q100 screening level suitable for automotive applications. The package dimensions are 4mm x 8.75mm x 1.75mm, making it ideal for compact designs in the automotive industry.
TLE9251VLEXUMA1
TLE9251VLEXUMA1 by Infineon is an AEC-Q100 compliant interface circuit with 8 terminals, 5V supply voltage, and 0.65mm terminal pitch. It is designed for automotive applications requiring a small outline package with heat sink, suitable for surface mount assembly. The IC's compact size of 3x3mm and low seated height of 1.1mm make it ideal for space-constrained environments in vehicles.
TLE9255WLCXUMA1
TLE9255WLCXUMA1 by Infineon Technologies is a network interface IC with 14 terminals, AEC-Q100 screening level, and 5V nominal voltage. It is designed for automotive applications requiring a small outline package with surface mount capability and dual terminal position.
TLE9250XSJXUMA1
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Finish: NICKEL GOLD PALLADIUM;
TLE9250VSJXUMA1
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
TLE9250SJXUMA1
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE;
TLE9250LEXUMA1
TLE9250LEXUMA1 by Infineon is an AEC-Q100 compliant interface circuit with 8 terminals, 5V supply voltage, and 0.65mm terminal pitch. It is a small outline package suitable for automotive applications requiring network interfaces. The IC features a square shape, tin finish, and thin profile design for space-constrained installations.
TLE9251VSJXUMA1/SAMPLE
INTERFACE CIRCUIT;
TLE9250VLEXUMA1
TLE9250VLEXUMA1 by Infineon is an AEC-Q100 compliant interface circuit with 8 terminals, small outline package style, and tin terminal finish. It operates at a nominal voltage of 5V and has a terminal pitch of 0.65mm. Ideal for automotive applications requiring network interfaces in compact spaces.
TLE9261BQXV33XUMA1
CAN FD TRANSCEIVER; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Minimum Operating Temperature: -40 Cel;
TLE9261BQXXUMA1
CAN FD TRANSCEIVER; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Maximum Supply Current: 6.5 mA;
TLE94613ESV33XUMA1
CAN FD TRANSCEIVER; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: HTSSOP; Package Shape: RECTANGULAR; Package Equivalence Code: TSSOP24,.25;
TLE9351VSJXTMA1
CAN FD TRANSCEIVER; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; JESD-30 Code: R-PDSO-G8;
TLE92613BQXV33XUMA1
CAN FD TRANSCEIVER; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Terminal Pitch: .5 mm;
TLE9271QXV33XUMA1
CAN FD TRANSCEIVER; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Package Equivalence Code: LCC48,.27SQ,20;
Supply Digital Components
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12,000 In-Stock
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