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TCAN1051HGVDQ1

Texas Instruments

TCAN1051HGVDQ1 by Texas Instruments

TCAN1051HGVDQ1 by Texas Instruments is a network interface IC with 8 terminals, operating temperature range of -55 to 125°C, and data rate of 5 Mbps. It is designed for telecom applications requiring a supply voltage of 5V, with AEC-Q100 screening level for automotive use. The small outline package style makes it suitable for space-constrained designs in harsh environments.

Median Price

$1.960

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 7,362 parts In-Stock

1+ parts

$2.370

100+ parts

$1.700

1k+ parts

$1.290

10k+ parts

$1.040

7,362

$2.370

$1.700

$1.290

$1.040

Rochester

USA . 71 parts In-Stock

1+ parts

-

100+ parts

$1.550

1k+ parts

$1.290

10k+ parts

$1.150

71

-

$1.550

$1.290

$1.150

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,869 parts In-Stock

1+ parts

$1.045

100+ parts

-

1k+ parts

-

10k+ parts

-

3,869

$1.045

-

-

-

Nova Conductors

Japan . 34 parts In-Stock

1+ parts

$1.340

100+ parts

-

1k+ parts

-

10k+ parts

-

34

$1.340

-

-

-

Vyrian

USA . 2,072 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,072

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 2,278 parts In-Stock

1+ parts

$0.940

100+ parts

$0.916

1k+ parts

$0.912

10k+ parts

-

2,278

$0.940

$0.916

$0.912

-

Ampacity Inc.

Singapore . 2,123 parts In-Stock

1+ parts

$0.940

100+ parts

-

1k+ parts

-

10k+ parts

-

2,123

$0.940

-

-

-

Corphita

USA . 270 parts In-Stock

1+ parts

$0.990

100+ parts

-

1k+ parts

-

10k+ parts

-

270

$0.990

-

-

-

Corohmni

South Africa . 277 parts In-Stock

1+ parts

$1.340

100+ parts

-

1k+ parts

-

10k+ parts

-

277

$1.340

-

-

-

Argo Parts USA

USA . 1,296 parts In-Stock

1+ parts

$1.340

100+ parts

-

1k+ parts

-

10k+ parts

-

1,296

$1.340

-

-

-

Continental Prestige Electronics

USA . 1,064 parts In-Stock

1+ parts

$1.340

100+ parts

-

1k+ parts

-

10k+ parts

$1.313

1,064

$1.340

-

-

$1.313

Advanced Electronics

New Zealand . 450 parts In-Stock

1+ parts

$1.380

100+ parts

$1.311

1k+ parts

$1.311

10k+ parts

-

450

$1.380

$1.311

$1.311

-

Parana Technologies

USA . 1,157 parts In-Stock

1+ parts

$7.356

100+ parts

-

1k+ parts

$7.848

10k+ parts

-

1,157

$7.356

-

$7.848

-

DigiPath Technology Company

USA . 2,117 parts In-Stock

1+ parts

$8.100

100+ parts

-

1k+ parts

-

10k+ parts

-

2,117

$8.100

-

-

-

IDEA Electronic Components Group

UK . 1,104 parts In-Stock

1+ parts

$8.265

100+ parts

-

1k+ parts

$7.438

10k+ parts

-

1,104

$8.265

-

$7.438

-

ChromeModa Solutions

Germany . 812 parts In-Stock

1+ parts

$8.265

100+ parts

$6.777

1k+ parts

-

10k+ parts

-

812

$8.265

$6.777

-

-

Authorized Procurement Solutions

USA . 15,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

15,000

-

-

-

-

ChipstoGo Electronic ltd

UK . 65 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

65

-

-

-

-

Overview

Experience seamless connectivity and reliable performance with the TCAN1051HGVDQ1 from Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and precision engineering in every product. The TCAN1051HGVDQ1 falls under the Network Interfaces category and is designed to meet the rigorous standards of AEC-Q100 screening level for automotive applications. With its small outline package style and wide operating temperature range, this interface circuit provides unmatched value and versatility for your networking needs. Trust Texas Instruments to deliver cutting-edge solutions that enhance your connectivity experience.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material provides durability and resistance to heat, making this product suitable for long-term use in various environments.

Surface Mount: YES

Surface mount design allows for easy installation on circuit boards, simplifying the assembly process.

Screening Level: AEC-Q100

Compliance with AEC-Q100 standards ensures high reliability and performance in automotive applications.

Maximum Operating Temperature: 125 °C

Capable of operating at high temperatures without performance degradation, making it suitable for demanding industrial applications.

Width: 3.895 mm

Compact size enables space-saving integration in small devices or circuit designs.

Nominal Supply Voltage: 5 V

Operates at a standard voltage level, making it compatible with most power sources and reducing the need for additional components.

Technical Specifications

Network Interfaces TCAN1051HGVDQ1 attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

Data Rate:

5 Mbps

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.905 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Maximum Supply Current:

180 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.895 mm

Trade Compliance

TCAN1051HGVDQ1 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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