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SN65HVD232QDRG4Q1

Texas Instruments

SN65HVD232QDRG4Q1 by Texas Instruments

SN65HVD232QDRG4Q1 by Texas Instruments is a BICMOS technology interface circuit with 8 terminals, operating at 3.3V and supporting data rates up to 1 Mbps. Designed for automotive applications, it has a wide temperature range from -40°C to 125°C and AEC-Q100 screening level for reliability.

Median Price

$2.500

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 9,378 parts In-Stock

1+ parts

$2.500

100+ parts

$2.065

1k+ parts

$1.116

10k+ parts

-

9,378

$2.500

$2.065

$1.116

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Mouser Electronics

USA . 8,829 parts In-Stock

1+ parts

$3.160

100+ parts

$1.950

1k+ parts

$1.730

10k+ parts

$1.680

8,829

$3.160

$1.950

$1.730

$1.680

DigiKey

USA . 3,214 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$1.644

3,214

-

-

-

$1.644

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$1.674

100+ parts

-

1k+ parts

-

10k+ parts

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50

$1.674

-

-

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Digiode

USA . 2,467 parts In-Stock

1+ parts

$2.375

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-

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2,467

$2.375

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Chip Stock

USA . 111,000 parts In-Stock

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111,000

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-

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Vyrian

USA . 7,980 parts In-Stock

1+ parts

-

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7,980

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 6,444 parts In-Stock

1+ parts

$1.674

100+ parts

-

1k+ parts

-

10k+ parts

$1.641

6,444

$1.674

-

-

$1.641

Argo Parts USA

USA . 4,072 parts In-Stock

1+ parts

$1.674

100+ parts

-

1k+ parts

-

10k+ parts

-

4,072

$1.674

-

-

-

Netroflash

USA . 50 parts In-Stock

1+ parts

$1.674

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$1.674

-

-

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Modulus Dynamics

Lithuania . 650 parts In-Stock

1+ parts

$1.858

100+ parts

$1.840

1k+ parts

$1.784

10k+ parts

-

650

$1.858

$1.840

$1.784

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Ampacity Inc.

Singapore . 7,947 parts In-Stock

1+ parts

$2.130

100+ parts

-

1k+ parts

-

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7,947

$2.130

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Corphita

USA . 4,847 parts In-Stock

1+ parts

$2.250

100+ parts

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10k+ parts

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4,847

$2.250

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Semicontronic

India . 7,942 parts In-Stock

1+ parts

$4.630

100+ parts

$4.514

1k+ parts

$4.491

10k+ parts

-

7,942

$4.630

$4.514

$4.491

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Corohmni

South Africa . 745 parts In-Stock

1+ parts

$9.736

100+ parts

-

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-

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745

$9.736

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-

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Advanced Electronics

New Zealand . 60 parts In-Stock

1+ parts

$12.855

100+ parts

$12.213

1k+ parts

$12.213

10k+ parts

-

60

$12.855

$12.213

$12.213

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Parana Technologies

USA . 2,163 parts In-Stock

1+ parts

$13.904

100+ parts

-

1k+ parts

$14.387

10k+ parts

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2,163

$13.904

-

$14.387

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ChromeModa Solutions

Germany . 5,639 parts In-Stock

1+ parts

$15.622

100+ parts

$12.810

1k+ parts

-

10k+ parts

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5,639

$15.622

$12.810

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IDEA Electronic Components Group

UK . 275 parts In-Stock

1+ parts

$15.622

100+ parts

$14.841

1k+ parts

$14.060

10k+ parts

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275

$15.622

$14.841

$14.060

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Perfect Parts

USA . 4,431 parts In-Stock

1+ parts

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4,431

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GreenTree Electronics

Israel . 2,500 parts In-Stock

1+ parts

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2,500

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A-Z Elektronik GmbH

Germany . 2,500 parts In-Stock

1+ parts

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2,500

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Robosynatics

Brazil . 2,215 parts In-Stock

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2,215

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Lucentia Tech

USA . 2,215 parts In-Stock

1+ parts

-

100+ parts

$12.041

1k+ parts

$12.041

10k+ parts

$12.041

2,215

-

$12.041

$12.041

$12.041

DigiPath Technology Company

USA . 819 parts In-Stock

1+ parts

-

100+ parts

$14.085

1k+ parts

-

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819

-

$14.085

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Overview

Unlock seamless and reliable communication with the SN65HVD232QDRG4Q1 by Texas Instruments. Designed with high-quality materials and advanced technology, this network interface IC is perfect for automotive applications, ensuring optimal performance in extreme temperatures. With a small outline package style and low power consumption, this product offers unmatched value and benefits to customers looking for a compact and efficient solution for their networking needs. Trust Texas Instruments for cutting-edge technology that delivers excellence every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures reliability and long-lasting performance.

Surface Mount: YES

Easy installation and compatibility with modern circuit boards make this product convenient to use.

Screening Level: AEC-Q100

AEC-Q100 certification ensures that this product meets the stringent quality standards required for automotive applications.

Package Shape: RECTANGULAR

The compact rectangular shape allows for efficient use of space on a circuit board.

Power Supplies (V): 3.3

The 3.3V power supply ensures compatibility with common voltage requirements in electronic devices.

No. of Terminals: 8

The ample number of terminals allow for versatile connectivity options in a variety of setups.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and allows for denser packing on a board.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliable performance even in harsh environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures flexibility and usability in a wide range of conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of high-quality terminal finishes ensures excellent conductivity and corrosion resistance.

Terminal Position: DUAL

The dual terminal position allows for enhanced stability and durability in various applications.

Maximum Seated Height: 1.75 mm

The low seated height makes this product suitable for compact designs and tight spaces.

Width: 3.9 mm

The slim width of the product allows for efficient use of space on a circuit board.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures secure and reliable soldering during the manufacturing process.

Length: 4.9 mm

The compact length of the product allows for flexibility in design and layout on a circuit board.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade ensures that this product can withstand the demanding conditions of automotive environments.

Technology: BICMOS

The use of BiCMOS technology combines the advantages of both bipolar and CMOS technologies for optimized performance.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and stability during installation and use.

Maximum Supply Current: 0.017 mA

The low maximum supply current helps conserve energy and prolong the lifespan of the product.

Telecom IC Type: INTERFACE CIRCUIT

The interface circuit type is ideal for telecom applications, ensuring seamless communication and connectivity.

Nominal Supply Voltage: 3.3 V

The 3.3V nominal supply voltage is compatible with a wide range of electronic devices and systems.

Terminal Pitch: 1.27 mm

The small terminal pitch allows for precise connections and efficient use of space on a circuit board.

Data Rate: 1 Mbps

The high data rate of 1 Mbps enables fast and reliable data transmission for various applications.

Technical Specifications

Network Interfaces SN65HVD232QDRG4Q1 attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

Data Rate:

1 Mbps

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

.017 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

SN65HVD232QDRG4Q1 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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