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TJA1028TK/3V3/20/X

NXP Semiconductors

TJA1028TK/3V3/20/X by NXP Semiconductors

NXP Semiconductors' TJA1028TK/3V3/20/X is a LIN transceiver with 8 terminals, operating at -40 to 150°C. It has a supply voltage of 3.3V and max current of 4.5mA, suitable for automotive applications meeting AEC-Q100 standards. This small outline package with heat sink is surface mountable and ideal for telecom networks.

Median Price

$1.325

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 9,800 parts In-Stock

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$1.275

9,800

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$1.275

Verical

USA . 9,800 parts In-Stock

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$1.375

9,800

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$1.375

Distributors (In-Stock)

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Vyrian

USA . 3,875 parts In-Stock

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3,875

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Digiode

USA . 1,455 parts In-Stock

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1,455

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Anansix

USA . 887 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 7,541 parts In-Stock

1+ parts

$1.180

100+ parts

$1.150

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$1.145

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-

7,541

$1.180

$1.150

$1.145

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Ampacity Inc.

Singapore . 6,283 parts In-Stock

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$1.180

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$1.180

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Microchip USA

USA . 2,683 parts In-Stock

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$6.000

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Corohmni

South Africa . 201 parts In-Stock

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$11.182

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Component Stockers USA

USA . 2,978 parts In-Stock

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$12.140

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Aztec Data Supply Inc.

USA . 394 parts In-Stock

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$12.274

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$12.274

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AZTECH Wire

Italy . 657 parts In-Stock

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$12.400

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Advanced Electronics

New Zealand . 600 parts In-Stock

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$18.331

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$17.414

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$17.414

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600

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$17.414

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UNI Independent Distributors

Spain . 7,201 parts In-Stock

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Corphita

USA . 3,807 parts In-Stock

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Continental Prestige Electronics

USA . 3,586 parts In-Stock

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Argo Parts USA

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Bastille Electronics

Australia . 500 parts In-Stock

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Overview

Discover the NXP Semiconductors TJA1028TK/3V3/20/X, a top-of-the-line LIN transceiver designed for automotive network interfaces. With NXP's reputation for quality and reliability, this product offers unparalleled performance and durability. Ideal for a wide range of applications, this compact yet powerful component provides seamless connectivity and efficient data transfer. Experience the value and benefits of NXP Semiconductors with the TJA1028TK/3V3/20/X, delivering innovation and excellence to meet your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability for long-term use.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards.

Screening Level: AEC-Q100

Ensures high quality and reliability as per automotive standards.

Package Shape: SQUARE

Square shape enables efficient use of space on circuit boards.

No. of Terminals: 8

Sufficient number of terminals for connecting various components.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Compact design with heat sink ensures optimal performance and thermal management.

Maximum Operating Temperature: 150 °C

Ability to operate at high temperatures without performance degradation.

Minimum Operating Temperature: -40 °C

Suitable for use in a wide range of temperature environments.

Terminal Position: DUAL

Dual terminal position for versatile installation options.

Maximum Seated Height: 1 mm

Low seated height for space-constrained applications.

Width: 3 mm

Compact width for efficient use of board space.

Peak Reflow Temperature °C: 260

High peak reflow temperature for secure soldering.

Length: 3 mm

Compact length for space-saving design.

Terminal Form: NO LEAD

Lead-free terminal form for environmentally friendly product.

Maximum Supply Current: 4.5 mA

Low supply current consumption for energy efficiency.

Telecom IC Type: LIN TRANSCEIVER

Specialized LIN transceiver for seamless communication in telecom applications.

Nominal Supply Voltage: 3.3 V

Compatible with standard 3.3V supply voltage for easy integration.

Terminal Pitch: 0.65 mm

Narrow terminal pitch for high density mounting on boards.

Technical Specifications

Network Interfaces TJA1028TK/3V3/20/X attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PDSO-N8

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Transceivers:

1

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.12,25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Maximum Supply Current:

4.5 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

TJA1028TK/3V3/20/X Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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