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ISO1044BDR

Texas Instruments

ISO1044BDR by Texas Instruments

ISO1044BDR by Texas Instruments is a Network Interface with 8 terminals in a small outline package. It operates b/w -40 to 125°C, suitable for automotive applications. Features include 1.8V supply voltage, 70mA max supply current, and Gull Wing terminal form.

Median Price

$2.343

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 227,526 parts In-Stock

1+ parts

$2.343

100+ parts

$2.053

1k+ parts

$1.160

10k+ parts

-

227,526

$2.343

$2.053

$1.160

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 22 parts In-Stock

1+ parts

$1.475

100+ parts

-

1k+ parts

-

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22

$1.475

-

-

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Digiode

USA . 238 parts In-Stock

1+ parts

$2.226

100+ parts

-

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238

$2.226

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Vyrian

USA . 82,439 parts In-Stock

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82,439

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Chip Stock

USA . 23,545 parts In-Stock

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23,545

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Classic Components Corporation

USA . 2,542 parts In-Stock

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2,542

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Component Sense

UK . 2,372 parts In-Stock

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2,372

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Distributors (Availability)

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Continental Prestige Electronics

USA . 3,352 parts In-Stock

1+ parts

$1.475

100+ parts

-

1k+ parts

-

10k+ parts

$1.446

3,352

$1.475

-

-

$1.446

Argo Parts USA

USA . 2,371 parts In-Stock

1+ parts

$1.475

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-

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2,371

$1.475

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

$1.475

100+ parts

$1.446

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-

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1,000

$1.475

$1.446

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Semicontronic

India . 78,141 parts In-Stock

1+ parts

$1.990

100+ parts

$1.940

1k+ parts

$1.930

10k+ parts

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78,141

$1.990

$1.940

$1.930

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Corphita

USA . 4,536 parts In-Stock

1+ parts

$2.109

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4,536

$2.109

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Ampacity Inc.

Singapore . 82,523 parts In-Stock

1+ parts

$4.330

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82,523

$4.330

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Corohmni

South Africa . 393 parts In-Stock

1+ parts

$7.724

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393

$7.724

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Parana Technologies

USA . 1,268 parts In-Stock

1+ parts

$9.778

100+ parts

$908.076

1k+ parts

$8.801

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1,268

$9.778

$908.076

$8.801

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DigiPath Technology Company

USA . 148 parts In-Stock

1+ parts

$10.767

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148

$10.767

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ChromeModa Solutions

Germany . 6,740 parts In-Stock

1+ parts

$10.987

100+ parts

$9.009

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6,740

$10.987

$9.009

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IDEA Electronic Components Group

UK . 880 parts In-Stock

1+ parts

$10.987

100+ parts

$10.438

1k+ parts

$9.888

10k+ parts

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880

$10.987

$10.438

$9.888

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Advanced Electronics

New Zealand . 28 parts In-Stock

1+ parts

$16.727

100+ parts

$15.891

1k+ parts

$15.891

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28

$16.727

$15.891

$15.891

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Lixinc

USA . 5,940 parts In-Stock

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5,940

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A-Z Elektronik GmbH

Germany . 2,770 parts In-Stock

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2,770

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ChipstoGo Electronic ltd

UK . 2,500 parts In-Stock

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2,500

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Futuretech Components

Singapore . 1,000 parts In-Stock

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1,000

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Robosynatics

Brazil . 450 parts In-Stock

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450

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Lucentia Tech

USA . 450 parts In-Stock

1+ parts

-

100+ parts

$86.282

1k+ parts

$86.282

10k+ parts

$86.282

450

-

$86.282

$86.282

$86.282

Infinite Electronics LLP (Excess)

. 445 parts In-Stock

1+ parts

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100+ parts

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445

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Overview

Elevate your networking capabilities with the Texas Instruments ISO1044BDR, a premium quality network interface designed to deliver unparalleled performance and reliability. Manufactured by industry leader Texas Instruments, this versatile device is ideal for a wide range of applications in the automotive sector and beyond. With its innovative design, high-quality materials, and cutting-edge technology, the ISO1044BDR offers customers unmatched value, seamless connectivity, and enhanced functionality. Trust Texas Instruments to provide you with the best-in-class solutions for all your networking needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for various industrial applications.

No. of Terminals: 8

Having 8 terminals allows for multiple connection points, enabling versatile connectivity options for various devices and systems.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125 °C, this product can withstand harsh environmental conditions without compromising performance.

Nominal Supply Voltage: 1.8 V

The nominal supply voltage of 1.8 V ensures efficient power consumption and compatibility with a wide range of devices.

Moisture Sensitivity Level (MSL): 2

Having a moisture sensitivity level of 2 ensures that the product is less prone to moisture-related issues, enhancing its reliability in various environments.

Technical Specifications

Network Interfaces ISO1044BDR attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.905 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

8

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.24

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.75 mm

Maximum Supply Current:

70 mA

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.895 mm

Trade Compliance

ISO1044BDR Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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