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TJA1057GTK

NXP Semiconductors

TJA1057GTK by NXP Semiconductors

NXP Semiconductors' TJA1057GTK is an AEC-Q100 compliant interface circuit with 8 terminals, small outline package style, and 5V nominal voltage. It is designed for automotive applications requiring a compact form factor (3x3mm) and surface mount capability. The device offers reliable network connectivity in vehicles with its low profile design and dual terminal position.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Cyclops Electronics Ltd

UK . 72,000 parts In-Stock

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72,000

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Digiode

USA . 2,293 parts In-Stock

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2,293

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Anansix

USA . 1,779 parts In-Stock

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1,779

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Vyrian

USA . 416 parts In-Stock

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416

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

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AZTECH Wire

Italy . 846 parts In-Stock

1+ parts

$10.402

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846

$10.402

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Aztec Data Supply Inc.

USA . 4,033 parts In-Stock

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$12.630

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4,033

$12.630

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Corohmni

South Africa . 268 parts In-Stock

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$12.759

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268

$12.759

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Ampacity Inc.

Singapore . 1,376 parts In-Stock

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$53.000

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1,376

$53.000

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Semicontronic

India . 1,026 parts In-Stock

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$283.000

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$275.925

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$274.510

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1,026

$283.000

$275.925

$274.510

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One Stop Electronics

USA . 653 parts In-Stock

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$991.000

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653

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Futuretech Components

Singapore . 6,000 parts In-Stock

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6,000

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Kepictronics

USA . 6,000 parts In-Stock

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Continental Prestige Electronics

USA . 4,877 parts In-Stock

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UNI Independent Distributors

Spain . 1,786 parts In-Stock

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Argo Parts USA

USA . 1,298 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,200 parts In-Stock

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1,200

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Corphita

USA . 630 parts In-Stock

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630

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Lixinc

USA . 597 parts In-Stock

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597

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Advanced Electronics

New Zealand . 57 parts In-Stock

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57

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Bastille Electronics

Australia . 40 parts In-Stock

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40

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Overview

Experience seamless networking with the TJA1057GTK from NXP Semiconductors. As a leader in the industry, NXP ensures top-notch quality and reliability in their products. The TJA1057GTK is perfect for various applications in the Network Interfaces category, offering customers unrivaled value, performance, and efficiency. Trust NXP to deliver cutting-edge technology that meets your networking needs effortlessly.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and long-lasting performance of the product.

Surface Mount: YES

Allows for easy installation on circuit boards, making it convenient for assembly.

Screening Level: AEC-Q100

Compliance with AEC-Q100 standards ensures high reliability and quality for automotive applications.

Package Shape: SQUARE

The square package shape provides stability and facilitates easier mounting on the PCB.

No. of Terminals: 8

Having 8 terminals allows for sufficient connectivity options, making it versatile for various applications.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The small outline, heat sink/slug, and very thin profile package style ensures compactness and efficient heat dissipation.

Terminal Position: DUAL

Dual terminal position enables secure connections and better stability on the PCB.

Maximum Seated Height: 1 mm

Low seated height allows for space-saving installation in compact devices.

Width: 3 mm

Narrow width enables the product to fit in tight spaces on the PCB.

Length: 3 mm

Compact length makes it suitable for applications where space is limited.

Terminal Form: NO LEAD

The no-lead terminal form provides a reliable and environmentally friendly option for soldering connections.

Telecom IC Type: INTERFACE CIRCUIT

Specifically designed for interface circuits in telecommunication applications, ensuring optimal performance.

Nominal Supply Voltage: 5 V

Operates efficiently with a nominal supply voltage of 5V, compatible with standard power sources.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65mm allows for high-density mounting on the PCB, ideal for space-constrained designs.

Technical Specifications

Network Interfaces TJA1057GTK attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PDSO-N8

Length:

3 mm

No. of Functions:

1

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3 mm

Trade Compliance

TJA1057GTK Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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