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ISO1050DW

Texas Instruments

ISO1050DW by Texas Instruments

ISO1050DW by Texas Instruments is a network interface IC with 16 terminals in a small outline package. It operates at temperatures ranging from -55 to 105 °C and has a nominal voltage of 5V. This interface circuit is commonly used in telecom applications.

Median Price

$5.752

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 3,092 parts In-Stock

1+ parts

$6.950

100+ parts

$5.600

1k+ parts

$5.010

10k+ parts

$5.000

3,092

$6.950

$5.600

$5.010

$5.000

Verical

USA . 360 parts In-Stock

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-

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$4.555

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$3.819

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360

-

$4.555

$3.819

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Distributors (In-Stock)

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Nova Conductors

Japan . 41 parts In-Stock

1+ parts

$4.080

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41

$4.080

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Digiode

USA . 1,788 parts In-Stock

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$6.602

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1,788

$6.602

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Chip Stock

USA . 41,650 parts In-Stock

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Vyrian

USA . 723 parts In-Stock

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723

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Demsay Elektronik

Türkiye . 568 parts In-Stock

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568

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Goldney Electronics S.L.

Spain . 129 parts In-Stock

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129

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Bristol Electronics

USA . 42 parts In-Stock

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42

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 41 parts In-Stock

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41

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Cogito LLC

Ukraine . 15 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 1,083 parts In-Stock

1+ parts

$3.870

100+ parts

$3.773

1k+ parts

$3.754

10k+ parts

-

1,083

$3.870

$3.773

$3.754

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Continental Prestige Electronics

USA . 6,058 parts In-Stock

1+ parts

$3.950

100+ parts

-

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10k+ parts

$3.871

6,058

$3.950

-

-

$3.871

Argo Parts USA

USA . 2,932 parts In-Stock

1+ parts

$3.950

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2,932

$3.950

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Netroflash

USA . 50 parts In-Stock

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$4.080

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$3.998

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50

$4.080

$3.998

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Modulus Dynamics

Lithuania . 900 parts In-Stock

1+ parts

$4.529

100+ parts

$4.484

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$4.348

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900

$4.529

$4.484

$4.348

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Component Stockers USA

USA . 29,149 parts In-Stock

1+ parts

$4.950

100+ parts

$4.700

1k+ parts

$3.240

10k+ parts

$3.240

29,149

$4.950

$4.700

$3.240

$3.240

Corphita

USA . 3,172 parts In-Stock

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$6.255

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$6.255

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Parana Technologies

USA . 1,903 parts In-Stock

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$7.653

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$8.174

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1,903

$7.653

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$8.174

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$7.933

100+ parts

$7.536

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$7.536

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3,000

$7.933

$7.536

$7.536

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DigiPath Technology Company

USA . 1,135 parts In-Stock

1+ parts

$8.427

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$7.753

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1,135

$8.427

$7.753

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Ampacity Inc.

Singapore . 1,069 parts In-Stock

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$8.430

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1,069

$8.430

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ChromeModa Solutions

Germany . 2,439 parts In-Stock

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$8.599

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$7.051

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2,439

$8.599

$7.051

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IDEA Electronic Components Group

UK . 398 parts In-Stock

1+ parts

$8.599

100+ parts

$8.169

1k+ parts

$7.739

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398

$8.599

$8.169

$7.739

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Corohmni

South Africa . 3 parts In-Stock

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$16.399

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$16.399

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Perfect Parts

USA . 9,046 parts In-Stock

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9,046

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Lixinc

USA . 7,329 parts In-Stock

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

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6,000

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Alle Elektronik GmbH

Germany . 1,440 parts In-Stock

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1,440

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Robosynatics

Brazil . 450 parts In-Stock

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450

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Lucentia Tech

USA . 450 parts In-Stock

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450

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Overview

The Texas Instruments ISO1050DW is a high-quality Network Interface module that offers numerous advantages for customers. With its surface mount design and small outline package style, it provides ease of installation and space-saving benefits. Manufactured by Texas Instruments, a renowned industry leader known for their reliable and innovative products, the ISO1050DW guarantees exceptional performance and durability. This versatile module finds applications in various fields such as telecommunications and interface circuits. With its nominal supply voltage of 5V and wide operating temperature range from -55 to 105°C, it ensures stable and efficient operation even in extreme conditions. Experience the value and benefits that the ISO1050DW brings to your projects, trust in Texas Instruments for unmatched quality and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the network interface, ensuring it can withstand various environmental conditions.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

No. of Terminals: 16

Sufficient number of terminals for connecting the network interface to other components, enabling seamless communication.

Maximum Operating Temperature: 105 °C

Withstands high temperatures without compromising performance, making it suitable for demanding applications.

Nominal Supply Voltage: 5 V

Operates efficiently at a standard supply voltage, ensuring compatibility with most systems and devices.

Technical Specifications

Network Interfaces ISO1050DW attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

ISO1050DW Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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