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TCAN334DCNR

Texas Instruments

TCAN334DCNR by Texas Instruments

TCAN334DCNR by Texas Instruments is a network interface IC with 8 terminals, operating temperature range of -40 to 125°C, and data rate of 1 Mbps. It is designed for automotive applications requiring a low profile package style and operates at a nominal voltage of 3.3V.

Median Price

$1.794

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 36,554 parts In-Stock

1+ parts

$1.794

100+ parts

$1.482

1k+ parts

$0.801

10k+ parts

-

36,554

$1.794

$1.482

$0.801

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$1.468

100+ parts

-

1k+ parts

-

10k+ parts

-

500

$1.468

-

-

-

Digiode

USA . 2,979 parts In-Stock

1+ parts

$1.704

100+ parts

-

1k+ parts

-

10k+ parts

-

2,979

$1.704

-

-

-

Vyrian

USA . 15,217 parts In-Stock

1+ parts

-

100+ parts

-

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15,217

-

-

-

-

Chip Stock

USA . 9,220 parts In-Stock

1+ parts

-

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9,220

-

-

-

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Cyclops Electronics Ltd

UK . 5,111 parts In-Stock

1+ parts

-

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5,111

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-

-

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Bristol Electronics

USA . 877 parts In-Stock

1+ parts

-

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877

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Sensible Micro Corp

USA . 476 parts In-Stock

1+ parts

-

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476

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 4,662 parts In-Stock

1+ parts

$1.468

100+ parts

-

1k+ parts

-

10k+ parts

$1.439

4,662

$1.468

-

-

$1.439

Argo Parts USA

USA . 1,135 parts In-Stock

1+ parts

$1.468

100+ parts

-

1k+ parts

-

10k+ parts

-

1,135

$1.468

-

-

-

Bastille Electronics

Australia . 10 parts In-Stock

1+ parts

$1.468

100+ parts

$1.395

1k+ parts

$1.325

10k+ parts

$1.307

10

$1.468

$1.395

$1.325

$1.307

Ampacity Inc.

Singapore . 15,463 parts In-Stock

1+ parts

$1.520

100+ parts

-

1k+ parts

-

10k+ parts

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15,463

$1.520

-

-

-

Semicontronic

India . 13,928 parts In-Stock

1+ parts

$1.520

100+ parts

$1.482

1k+ parts

$1.474

10k+ parts

-

13,928

$1.520

$1.482

$1.474

-

Corphita

USA . 449 parts In-Stock

1+ parts

$1.615

100+ parts

-

1k+ parts

-

10k+ parts

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449

$1.615

-

-

-

Parana Technologies

USA . 1,423 parts In-Stock

1+ parts

$12.065

100+ parts

-

1k+ parts

$12.474

10k+ parts

-

1,423

$12.065

-

$12.474

-

Corohmni

South Africa . 259 parts In-Stock

1+ parts

$12.746

100+ parts

-

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259

$12.746

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-

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DigiPath Technology Company

USA . 383 parts In-Stock

1+ parts

$13.285

100+ parts

-

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383

$13.285

-

-

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IDEA Electronic Components Group

UK . 343 parts In-Stock

1+ parts

$13.556

100+ parts

$12.878

1k+ parts

$12.200

10k+ parts

-

343

$13.556

$12.878

$12.200

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ChromeModa Solutions

Germany . 43 parts In-Stock

1+ parts

$13.556

100+ parts

$11.116

1k+ parts

-

10k+ parts

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43

$13.556

$11.116

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-

Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$14.168

100+ parts

$13.459

1k+ parts

$13.459

10k+ parts

-

1,000

$14.168

$13.459

$13.459

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A-Z Elektronik GmbH

Germany . 13,500 parts In-Stock

1+ parts

-

100+ parts

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13,500

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-

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Lixinc

USA . 9,205 parts In-Stock

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9,205

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Futuretech Components

Singapore . 3,000 parts In-Stock

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3,000

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

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100+ parts

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1,000

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Akira Global LLC

USA . 49 parts In-Stock

1+ parts

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49

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-

Overview

Upgrade your network interfaces with the TCAN334DCNR by Texas Instruments, a high-quality solution designed for automotive applications. Benefit from the reliability and performance of Texas Instruments products while enjoying the convenience of a small outline, low profile package. With a nominal supply voltage of 3.3V and a data rate of 1 Mbps, this interface circuit offers unparalleled value and efficiency for your networking needs. Trust Texas Instruments to deliver the best in innovation and quality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and lightweight, making this product easy to handle and resistant to damage.

Surface Mount: YES

Being surface mountable makes it easy to integrate this product onto circuit boards, saving space and simplifying assembly.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand demanding environmental conditions without compromising performance.

Terminal Finish: NICKEL PALLADIUM GOLD

The NICKEL PALLADIUM GOLD terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable connections.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this product meets the requirements for durability and reliability in automotive environments.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3V, this product offers compatibility with common voltage standards, making it easy to integrate into existing systems.

Data Rate: 1 Mbps

With a fast data rate of 1 Mbps, this product is suitable for high-speed data transfer applications, ensuring efficient performance.

Technical Specifications

Network Interfaces TCAN334DCNR attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

Data Rate:

1 Mbps

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.45 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.6 mm

Trade Compliance

TCAN334DCNR Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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