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TCAN332DR

Texas Instruments

TCAN332DR by Texas Instruments

TCAN332DR by Texas Instruments is a network interface IC with 1 channel and a data rate of 1 Mbps. It has a small outline package style, operates at temperatures ranging from -40 to 125 °C, and is commonly used in automotive applications.

Median Price

$1.624

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 5,261 parts In-Stock

1+ parts

$1.390

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$0.898

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$1.390

$0.898

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Arrow

USA . 18 parts In-Stock

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$1.488

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$1.488

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Texas Instruments

USA . 106,411 parts In-Stock

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$1.624

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$1.341

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$0.725

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106,411

$1.624

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$0.725

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Element14

Singapore . 1,057 parts In-Stock

1+ parts

$2.162

100+ parts

$1.624

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$1.130

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$1.077

1,057

$2.162

$1.624

$1.130

$1.077

DigiKey

USA . 5,442 parts In-Stock

1+ parts

$2.310

100+ parts

$1.394

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$1.276

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5,442

$2.310

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$1.276

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Mouser Electronics

USA . 1,684 parts In-Stock

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$2.310

100+ parts

$1.400

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$1.260

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$1.160

1,684

$2.310

$1.400

$1.260

$1.160

Newark

USA . 1,167 parts In-Stock

1+ parts

$2.310

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$1.400

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$1.240

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$2.310

$1.400

$1.240

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Verical

USA . 5,254 parts In-Stock

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-

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$1.433

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$1.312

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$1.183

5,254

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$1.433

$1.312

$1.183

Farnell

UK . 2,266 parts In-Stock

1+ parts

-

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$1.170

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$1.030

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$0.996

2,266

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$1.170

$1.030

$0.996

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,700 parts In-Stock

1+ parts

$1.178

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$1.178

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Nova Conductors

Japan . 50 parts In-Stock

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$1.330

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50

$1.330

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Maritex

Poland . 3,239 parts In-Stock

1+ parts

$2.370

100+ parts

$1.319

1k+ parts

$1.100

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3,239

$2.370

$1.319

$1.100

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Chip Stock

USA . 21,670 parts In-Stock

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Vyrian

USA . 13,281 parts In-Stock

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Cyclops Electronics Ltd

UK . 1,635 parts In-Stock

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ComSIT Distribution GmbH

Germany . 31 parts In-Stock

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Elcom Components

USA . 24 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 13,755 parts In-Stock

1+ parts

$0.860

100+ parts

$0.838

1k+ parts

$0.834

10k+ parts

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13,755

$0.860

$0.838

$0.834

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Ampacity Inc.

Singapore . 13,405 parts In-Stock

1+ parts

$0.860

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13,405

$0.860

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Corphita

USA . 53 parts In-Stock

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$1.116

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53

$1.116

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Continental Prestige Electronics

USA . 2,853 parts In-Stock

1+ parts

$1.328

100+ parts

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$1.301

2,853

$1.328

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$1.301

Argo Parts USA

USA . 390 parts In-Stock

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$1.328

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390

$1.328

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Advanced Electronics

New Zealand . 300 parts In-Stock

1+ parts

$6.290

100+ parts

$5.976

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$5.976

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300

$6.290

$5.976

$5.976

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Modulus Dynamics

Lithuania . 4,487 parts In-Stock

1+ parts

$9.034

100+ parts

$9.034

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$9.034

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4,487

$9.034

$9.034

$9.034

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Parana Technologies

USA . 1,824 parts In-Stock

1+ parts

$10.560

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$11.061

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1,824

$10.560

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$11.061

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DigiPath Technology Company

USA . 1,846 parts In-Stock

1+ parts

$11.628

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$10.697

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1,846

$11.628

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ChromeModa Solutions

Germany . 5,963 parts In-Stock

1+ parts

$11.865

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$9.729

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$11.865

$9.729

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IDEA Electronic Components Group

UK . 98 parts In-Stock

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$11.865

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$11.272

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$10.678

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98

$11.865

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$10.678

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Corohmni

South Africa . 546 parts In-Stock

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$13.855

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Lixinc

USA . 19,154 parts In-Stock

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A-Z Elektronik GmbH

Germany . 10,250 parts In-Stock

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Technoshack Inc. (Excess)

Canada . 4,000 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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$1.303

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$1.264

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$1.237

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$1.303

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$1.237

Futuretech Components

Singapore . 600 parts In-Stock

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600

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GreenTree Electronics

Israel . 110 parts In-Stock

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Robosynatics

Brazil . 30 parts In-Stock

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30

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Lucentia Tech

USA . 30 parts In-Stock

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$5.771

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$5.771

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$5.771

30

-

$5.771

$5.771

$5.771

Overview

Experience seamless connectivity and exceptional performance with the TCAN332DR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and reliability. The TCAN332DR belongs to the network interfaces category, making it an essential component for various applications. With its small outline package style and dual terminal position, this product offers convenience and versatility. Whether you need it for automotive or telecom purposes, the TCAN332DR guarantees optimal functionality. Stay connected and unlock endless possibilities with this outstanding interface circuit from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, perfect for portable devices.

Surface Mount: YES

Being surface mountable allows for easy installation on circuit boards, saving space and reducing assembly time.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product is suitable for use in various environments without the risk of overheating.

Nominal Supply Voltage: 3.3 V

Operates at a standard supply voltage of 3.3V, making it compatible with a wide range of electronic systems and devices.

Data Rate: 1 Mbps

Capable of supporting data transfer speeds of up to 1 Mbps, ensuring efficient communication and data exchange in network environments.

Technical Specifications

Network Interfaces TCAN332DR attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

Data Rate:

1 Mbps

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.75 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

TCAN332DR Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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