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PTCAN1044AVDRBRQ1

Texas Instruments

PTCAN1044AVDRBRQ1 by Texas Instruments

Texas Instruments PTCAN1044AVDRBRQ1 is an AEC-Q100 compliant CAN FD transceiver with 8 Mbps data rate, ideal for automotive applications. Operating from -40 to 150°C, it features a small outline package with 8 terminals and no lead terminal form. This surface-mount device offers high-speed communication in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,064 parts In-Stock

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Digiode

USA . 1,357 parts In-Stock

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1,357

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Nova Conductors

Japan . 92 parts In-Stock

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92

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Distributors (Availability)

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Parana Technologies

USA . 1,729 parts In-Stock

1+ parts

$6.857

100+ parts

-

1k+ parts

$7.483

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1,729

$6.857

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$7.483

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DigiPath Technology Company

USA . 564 parts In-Stock

1+ parts

$7.551

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$6.947

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564

$7.551

$6.947

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AZTECH Wire

Italy . 856 parts In-Stock

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$7.585

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856

$7.585

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IDEA Electronic Components Group

UK . 1,457 parts In-Stock

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$7.705

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$6.934

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1,457

$7.705

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$6.934

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ChromeModa Solutions

Germany . 642 parts In-Stock

1+ parts

$7.705

100+ parts

$6.318

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642

$7.705

$6.318

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Corohmni

South Africa . 253 parts In-Stock

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$14.731

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253

$14.731

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Semicontronic

India . 1,514 parts In-Stock

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$499.000

100+ parts

$486.525

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$484.030

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1,514

$499.000

$486.525

$484.030

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One Stop Electronics

USA . 917 parts In-Stock

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$556.000

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917

$556.000

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Ampacity Inc.

Singapore . 1,290 parts In-Stock

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$601.000

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$601.000

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Corphita

USA . 4,350 parts In-Stock

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Argo Parts USA

USA . 4,144 parts In-Stock

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Continental Prestige Electronics

USA . 2,578 parts In-Stock

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Advanced Electronics

New Zealand . 63 parts In-Stock

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63

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Bastille Electronics

Australia . 50 parts In-Stock

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50

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Overview

Maximize the efficiency and reliability of your automotive network with the PTCAN1044AVDRBRQ1 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality network interfaces that ensure seamless communication in a variety of applications. With its advanced features and durable construction, this CAN FD transceiver offers unmatched value and performance. Experience the benefits of enhanced data rates, high temperature tolerance, and reliable connectivity for your automotive systems. Trust Texas Instruments to provide the solutions you need for optimal performance and peace of mind.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers durability and light weight, making the product ideal for various automotive applications.

Surface Mount: YES

The surface mount feature allows for easy installation on circuit boards, saving time and effort during assembly.

No. of Functions: 1

This single function device simplifies the design and integration process, making it a cost-effective solution.

Screening Level: AEC-Q100

With AEC-Q100 screening, this product meets the high reliability and quality standards required for automotive applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space on the circuit board, maximizing design flexibility.

No. of Terminals: 8

The 8 terminals provide ample connectivity options, allowing for versatile integration into different systems.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

This package style offers excellent thermal management and a compact form factor, ideal for space-constrained applications.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature ensures reliable performance even in harsh automotive environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for usage in cold conditions, enhancing the product's versatility.

Terminal Position: DUAL

The dual terminal position design enhances signal stability and reliability, crucial for automotive communication systems.

Temperature Grade: AUTOMOTIVE

Designed for automotive use, this product can withstand the temperature fluctuations and rugged conditions typically found in vehicles.

No. of Channels: 1

This single-channel configuration simplifies setup and troubleshooting, making it a user-friendly option.

Terminal Form: NO LEAD

The no-lead terminal form reduces the risk of solder joint failures, ensuring long-term reliability in automotive applications.

No. of Transceivers: 1

The single transceiver design streamlines communication setup, making the product efficient and easy to integrate.

Telecom IC Type: CAN FD TRANSCEIVER

With CAN FD transceiver technology, this product offers high-speed data communication capabilities, suitable for modern automotive systems.

Nominal Supply Voltage: 5 V

The 5V supply voltage is a common standard in automotive electronics, ensuring compatibility with existing systems.

Data Rate: 8 Mbps

The high data rate of 8 Mbps allows for fast and efficient data transmission, ideal for demanding automotive applications.

Technical Specifications

Network Interfaces PTCAN1044AVDRBRQ1 attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

Data Rate:

8 Mbps

JESD-30 Code:

R-PDSO-N8

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

No. of Transceivers:

1

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Screening Level:

AEC-Q100

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

PTCAN1044AVDRBRQ1 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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